(19)
(11) EP 4 139 622 A1

(12)

(43) Date of publication:
01.03.2023 Bulletin 2023/09

(21) Application number: 20742636.2

(22) Date of filing: 18.05.2020
(51) International Patent Classification (IPC): 
F28D 15/02(2006.01)
(52) Cooperative Patent Classification (CPC):
F28D 15/0241
(86) International application number:
PCT/BY2020/000004
(87) International publication number:
WO 2021/232134 (25.11.2021 Gazette 2021/47)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(71) Applicant: Huawei Technologies Co., Ltd.
Longgang District, Shenzhen, Guangdong 518129 (CN)

(72) Inventors:
  • MU, Junwei
    Shenzhen, Guangdong 518129 (CN)
  • IANG, Guo
    Shenzhen, Guangdong 518129 (CN)
  • FILATAU, Sviataslau Alehavich
    Shenzhen, Guangdong 518129 (CN)

(74) Representative: Isarpatent 
Patent- und Rechtsanwälte Barth Charles Hassa Peckmann & Partner mbB Friedrichstrasse 31
80801 München
80801 München (DE)

   


(54) HEAT PIPE FOR ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING THEREFOR