TECHNICAL FIELD
[0001] The present disclosure relates to the field of printing display technology, and in
particular, to an OLED display panel and a display device.
BACKGROUND
[0002] As the rapid development of organic light emitting diode (OLED) display technology
has led to the rapid entry of curved and flexible display products into the market,
the technologies in relevant fields have also advanced rapidly. OLEDs are a kind of
diode element using organic light emitting materials driven through electric fields
to emit light by means of carrier injections and recombination. OLED elements have
attracted wide attention due to their advantages of light weight, thinness, flexibility,
and wide viewing angles.
[0003] Polarizers (POL), which can effectively reduce reflectivity of panels in bright light,
lose nearly 58% of their output light, greatly increasing an OLED panel's lifetime
burden. On the other hand, polarizers with large thicknesses and fragility are not
conducive to the development of dynamic folding products. In order to develop dynamic
folding products based on OLED display technology, new materials, new technologies,
and new processes must be introduced to replace polarizers. Using color filters (CF)
instead of polarizers is classified as polarizer-free (POL-less) technology.
[0004] As shown in FIG. 1A, which is a schematic diagram illustrating a comparison between
effects of a POL-less display panel based on a color filter and a display panel based
on a polarizer, arrows indicate directions of light emitted by the panels. As shown
in part a of FIG. 1A, the POL-less display panel 10a based on the color filter comprises
an array layer 11a, an organic light emitting (EL) layer 12a, a thin film encapsulation
(TFE) layer 13a, and a color filter (CF) layer 14a which are stacked in sequence,
wherein a thickness H1 of the color filter layer 14a is about 2-3µm, and a luminescent
efficiency of the POL-less display panel 10a based on the color filter is greater
than 60% and its reflectivity is greater than 6%. As shown in part b of FIG. 1A, the
display panel 10b based on the polarizer comprises an array layer 11b, an organic
light emitting layer 12b, a thin film encapsulation layer 13a, and a polarizer 14b
which are stacked in sequence, wherein a thickness H2 of the polarizer 14b is about
60µm, and a luminescent efficiency of the display panel 10b based on the polarizer
is about 42% and its reflectivity is about 5%.
[0005] As can be seen from FIG. 1A, in the POL-less display panel based on the color filter
panel, not only a thickness of a functional layer can be reduced from about 60µm to
less than 5µm, but also a luminescent efficiency can be improved from about 42% to
more than 60%, and the reflectivity of the POL-less display panel based on the color
filter is substantially the same as that of the display panel based on the polarizer.
[0006] POL-less technology based on color filters is considered as one of the key technologies
for dynamic folding product development. A basic structure of a color filter comprises
red (R), green (G), and blue (B) color resists and a black matrix (BM). Based on OLED's
self-luminous characteristics, the color resists need to correspond to red, green,
and blue light emitting units of OLEDs respectively to form a functional color filter
layer. In current POL-less technology, a photoetching process is needed, and a defining
area (bank) manufactured by the current photoetching process is a layer of photoresist
patterns, wherein a commonly used photoresist comprises BM materials.
[0007] Referring to FIG. 1B, which is a schematic diagram illustrating a photoresist pattern
formed by the current photoetching process, a diameter D101 of a circular bank 101
is 27-28µm, an edge L102 of a rounded rectangle 102 is 31-32µm, and an edge L103 of
another rounded rectangle bank 103 is 36-37µm. The photoresist patterns formed by
the photoetching process meet requirements of optical parameters of an RGB layer in
a subsequent photoetching process.
[0008] However, due to needs of the photoetching process in the current POL-less technology,
not only is there a large waste of materials, but also a certain environmental pollution
caused by large amounts of solvent volatilizing during the photoetching process because
photoetching materials themselves are materials with high solvent content.
SUMMARY
[0009] The present disclosure aims at providing an OLED display panel and a display device
for the problems existing in current technology, which can realize manufacturing a
color filter by printing, reduce a usage of color filter materials when printing requirements
are met, avoid an effect of solvent volatilization to the environment by using solvent-free
color filter materials, and enhance competitiveness of products.
[0010] An embodiment of the present disclosure provides an OLED display panel, comprising:
an array layer; an organic light emitting layer arranged on the array layer and comprising
at least one light emitting unit; and a color filter layer arranged on the organic
light emitting layer and comprising a photoresist structure and at least one color
resist unit; wherein the photoresist structure comprises a first defining layer and
a second defining layer, the first defining layer comprises at least one first color
resist defining area, the second defining layer comprises at least one second color
resist defining area at a position corresponding to the first color resist defining
area, the first color resist defining area and the second color resist defining area
have same shapes and are concentric, an opening of the second color resist defining
area is larger than an opening of the first color resist defining area, and the second
defining layer comprises a sloped surface defined between the first color resist defining
area and the second color resist defining area; and the color resist unit is arranged
in an area defined by the first color resist defining area and the second color resist
defining area and corresponds to the light emitting unit, and the color resist unit
is arranged in the first color resist defining area and the second color resist defining
area by ink-jet printing.
[0011] An embodiment of the present disclosure further provides an OLED display panel comprising:
an array layer; an organic light emitting layer arranged on the array layer and comprising
at least one light emitting unit; and a color filter layer arranged on the organic
light emitting layer and comprising a photoresist structure and at least one color
resist unit; wherein the photoresist structure comprises a first defining layer and
a second defining layer, the first defining layer comprises at least one first color
resist defining area, the second defining layer comprises at least one second color
resist defining area at a position corresponding to the first color resist defining
area, an opening of the second color resist defining area is larger than an opening
of the first color resist defining area, and the second defining layer comprises a
sloped surface defined between the first color resist defining area and the second
color resist defining area; and the color resist unit is arranged in an area defined
by the first color resist defining area and the second color resist defining area
and corresponds to the light emitting unit.
[0012] An embodiment of the present disclosure further provides a display device comprising
an OLED display panel, wherein the OLED display panel comprises: an array layer; an
organic light emitting layer arranged on the array layer and comprising at least one
light emitting unit; and a color filter layer arranged on the organic light emitting
layer and comprising a photoresist structure and at least one color resist unit; wherein
the photoresist structure comprises a first defining layer and a second defining layer,
the first defining layer comprises at least one first color resist defining area,
the second defining layer comprises at least one second color resist defining area
at a position corresponding to the first color resist defining area, an opening of
the second color resist defining area is larger than an opening of the first color
resist defining area, and the second defining layer comprises a sloped surface defined
between the first color resist defining area and the second color resist defining
area; and the color resist unit is arranged in an area defined by the first color
resist defining area and the second color resist defining area and corresponds to
the light emitting unit.
[0013] In the embodiments of the present disclosure, the photoresist structure of the color
filter layer is a stack of two defining layers, and the sloped surface is defined
between corresponding defining areas of two defining layers, which is convenient for
development of a subsequent ink-jet printing process, and realizes manufacturing the
color filter layer by ink-jet printing. Compared with a manufacturing method for the
color filter layer by the photoetching process, it can not only reduce a usage of
color filter materials, but also avoid an effect of solvent volatilization to the
environment due to using solvent-free color filter materials.
BRIEF DESCRIPTION OF DRAWINGS
[0014] To describe the technical solutions of the embodiments of the present disclosure
more clearly, the following briefly introduces the accompanying drawings used in the
description of the embodiments of the present disclosure. Apparently, the accompanying
drawings described below illustrate only some exemplary embodiments of the present
disclosure, and persons skilled in the art may derive other drawings from the drawings
without making creative efforts.
FIG. 1A is a schematic diagram illustrating a comparison between effects of a POL-less
display panel based on a color filter and a display panel based on a polarizer.
FIG. 1B is a schematic structural diagram illustrating a photoresist pattern formed
by the current photoetching process.
FIG. 2A is a schematic sectional structural diagram illustrating an OLED display panel
according to an embodiment of the present disclosure.
FIG. 2B is a top-down structural schematic diagram illustrating an OLED display panel
according to an embodiment of the present disclosure.
FIG. 3 is a top-down structural schematic diagram illustrating a photoresist structure
according to an embodiment of the present disclosure.
FIG. 4 is a sectional structural schematic diagram illustrating a photoresist structure
according to an embodiment of the present disclosure.
FIG. 5 is a diagram illustrating a comparison between printing effects of a photoresist
structure according to an embodiment of the present disclosure and a current single-layer
photoresist structure for ink-jet printing.
FIG. 6 is a structural schematic diagram illustrating a display device according to
an embodiment of the present disclosure.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[0015] Reference will now be made in detail to embodiments, examples of which are illustrated
in the accompanying drawings. Wherein, same or similar reference numbers always represent
the same or similar elements or elements with the same or similar functions. The terms
"first", "second", "third", and the like (if any) in the description, claims, and
drawings are used to distinguish between different objects, rather than used to indicate
a specified order or sequence. It should be understood that the objects described
in this way may be exchanged when appropriate. In description of the disclosure, "a
plurality of" means two or more than two, unless otherwise specified. Furthermore,
the terms "include" and "comprise" as well as any variants thereof are intended to
cover a non-exclusive inclusion. Directional terms mentioned in the present disclosure,
such as "top", "bottom", "front", "back", "left", "right", "inside", "outside", "side"
etc., are only used with reference to orientations of the accompanying drawings.
[0016] In description of the present disclosure, it should be understood that, unless specified
or limited otherwise, the terms "mounted," "connected," "coupled," "fixed" and the
like are used broadly, and may be, for example, fixed connections, detachable connections,
or integral connections; may also be mechanical or electrical connections; may also
be direct connections or indirect connections via intervening structures; may also
be inner communications of two elements, which can be understood by those skilled
in the art according to specific situations.
[0017] An embodiment of the present disclosure provides a photoresist structure of a color
filter layer of an OLED display panel. The photoresist structure is adjusted and selected
to be a stack of two defining layers, wherein an opening of a bottom defining area
(bank) is smaller than an opening of a top defining area, corresponding banks of the
two defining layers are concentric, and a sloped surface is defined between the corresponding
banks of the two defining layers (an inclination angle [taper] of the top bank is
smaller). In other words, the photoresist structure is narrow at the top and wide
at the bottom in the defining areas, in order to limit ink overflow in all directions
when printing color resist units of the color filter layer by ink-jet printing (IJP)
technology, and to ensure ink droplets can slide down the sloped surface to a bottom
of the banks in case of deviation in printing. In the embodiment of the present disclosure,
the improved photoresist structure is adopted, which is convenient for development
of the subsequent ink-jet printing process, and realizes manufacture of the color
filter layer by ink-jet printing. Compared with the method of manufacturing the color
filter layer by photoetching process, not only can it only reduce a usage amount of
color filter materials, but also prevents solvent from volatilizing into the environment
due to using solvent-free color filter materials.
[0018] Please refer to FIG. 2A, FIG. 2B and FIG. 3 to FIG. 5 in combination, wherein FIG.
2A is a schematic sectional structural diagram illustrating an OLED display panel
according to an embodiment of the present disclosure, FIG. 2B is a top-down structural
schematic diagram illustrating an OLED display panel according to an embodiment of
the present disclosure, FIG. 3 is a top-down structural schematic diagram illustrating
a photoresist structure according to an embodiment of the present disclosure, FIG.
4 is a sectional structural schematic diagram illustrating a photoresist structure
according to an embodiment of the present disclosure, and FIG. 5 is a diagram illustrating
a comparison between printing effects of a photoresist structure according to an embodiment
of the present disclosure and a current single-layer photoresist structure for ink-jet
printing.
[0019] As shown in FIG. 2A and FIG. 2B, the OLED display panel in the embodiment of the
present disclosure comprises an array layer 21, an organic light emitting layer 22,
and a color filter layer 24.
[0020] In detail, the organic light emitting layer 22 is arranged on the array layer 21,
and the organic light emitting layer 22 comprises at least one light emitting unit
220. Accordingly, the array layer 21 comprises thin film transistors 210 arranged
in an array. The light emitting unit 220 is electrically connected to the thin film
transistor 210 to be driven by the thin film transistor 210 to emit light. The specific
arrangements and working principles of the array layer 21 and the organic light emitting
layer 22 can be referred to the prior art, and details are not further described in
the embodiment of the present disclosure.
[0021] The color filter layer 24 is arranged on the organic light emitting layer 22, and
the color filter layer 24 comprises a photoresist structure 241 and at least one color
resist unit 242, wherein the color resist unit 242 corresponds to the light emitting
unit 220. In detail, the color filter layer 24 comprises red (R), green (G), and blue
(B) color resists, and the color resists correspond to red, green, and blue light
emitting units of the organic light emitting layer 22 to form a color filter functional
layer.
[0022] In a further embodiment, an OLED display panel 20 further comprises a thin film encapsulation
layer 23, wherein the thin film encapsulation layer 23 covers the organic light emitting
layer 22 and the array layer 21, and the color filter layer 24 is formed at a side
of the thin film encapsulation layer 23 away from the organic light emitting layer
22.
[0023] As shown in FIG. 3 to FIG. 4, the photoresist structure 241 in the embodiment of
the present disclosure comprises a first defining layer 31 and a second defining layer
32, wherein the first defining layer 31 comprises at least one first color resist
defining area 311, and the second defining layer 32 comprises at least one second
color resist defining area 321 at a position corresponding to the first color resist
defining area 311. An opening D32 of the second color resist defining area 321 is
larger than an opening D31 of the first color resist defining area 311, and the second
defining layer 32 comprises a sloped surface 322 defined between the first color resist
defining area 311 and the second color resist defining area 321. That is, a surface
with a stepped shape is formed between the second defining layer 32 and the first
defining layer 31. Because ink is printed into corresponding color resist defining
areas using droplets in the ink-jet printing process, off-centered ink can flow into
the color resist defining areas by the design of the sloped surface.
[0024] Referring to FIG. 2A again, the color resist unit 242 is formed in an area defined
by the first color resist defining area 311 and the second color resist defining area
321 which are corresponding to the photoresist structure 241, and is corresponding
to the light emitting unit 220. In a further embodiment, the color resist unit 612
is formed in the area defined by the first color resist defining area 311 and the
second color resist defining area 321 by ink-jet printing.
[0025] Referring to FIG. 3 to FIG. 4 again, in a further embodiment, an aperture parameter
of the first color resist defining area 311 and an optical parameter of the color
resist unit 242 are substantially the same. That is, the photoresist structure 241
in the embodiment of the present disclosure meets an optical parameter requirement
for subsequent formation of RGB layers.
[0026] In a further embodiment, the first color resist defining area 311 and the second
color resist defining area 321 have the same shapes and are concentric. The arrangement
facilitates formation of the sloped surface, and the sloped surface can be formed
all around the first color resist defining area 311, which is more convenient for
the off-center ink to flow into the first color resist defining area 311.
[0027] In a further embodiment, shapes of the first color resist defining area 311 and the
second color resist defining area 321 are selected from any or a combination of a
circle, a rounded rectangle, and a square.
[0028] Continuing to refer to FIG. 3, in the embodiment, the first color resist defining
area 311 of the first defining layer 31 have shapes comprising circles and rounded
rectangles, specifically comprising a circular bank 311a, a first rounded rectangular
bank 311b, and a second rounded rectangular bank 31 1c, and aperture parameters of
the banks meet requirements of optical parameters for manufacturing corresponding
color resist units. Accordingly, the second color resist defining area 321 of the
second defining layer 32 have shapes comprising circles and rounded rectangles, specifically
comprising a circular bank 321a, a first rounded rectangular bank 321b, and a second
rounded rectangular bank 321c, and aperture parameters of the banks are larger than
that of corresponding banks of the first color resist defining area 311 to meet requirements
of ink-j et printing.
[0029] In an embodiment, a diameter of the circular bank 311a of the first defining layer
31 can range from 26µm to 28µm, a length of an edge of the first rounded rectangular
bank 311b can range from 25µm to 32µm, and a length of an edge of the second rounded
rectangular bank 311c can range from 27µm to 37µm. A diameter D301 of the corresponding
circular bank 321a of the second defining layer 32 can range from 28µm to 39µm, a
length L302 of an edge of the first rounded rectangular bank 321b can range from 45µm
to 46µm, and a length L303 of an edge of the second rounded rectangular bank 321c
can range from 45µm to 46µm, wherein the aperture parameters of the corresponding
different rounded rectangular banks (the first rounded rectangular bank 321b and the
second rounded rectangular bank 321c) can be the same to simplify the manufacturing
process.
[0030] In an embodiment, materials of the first defining layer 31 and the second defining
layer 32 both comprise a black matrix (BM) material. In detail, the BM material comprises
ink. The two defining layers are formed by two masks, wherein the optical parameters
are ensured by holes of a bottom mask, and the IJP requirements are satisfied by holes
of a top mask.
[0031] In an embodiment, a material of the first defining layer 31 comprises a black matrix
(BM) material, and a material of the second defining layer 32 comprises an over coat
(OC) material. The BM material and the OC material both comprise epoxy resin, specifically,
the BM material comprises black ink and the OC material comprises gelatinous resin.
[0032] In a further embodiment, the OC material and the BM material are both negative materials,
and when same openings are exposed, an exposure of the OC material is greater than
an exposure of the BM material. Specifically, the first defining layer 31 and the
second defining layer 32 are formed by performing a halftone process through one mask
and by exposing a first layer of the BM material and a second layer of the OC material
at the same time. Due to the negative BM material and the consistent property of the
OC material and the BM material, an opening of a layer of the BM material is smaller,
caused by different exposing properties of the OC material and the BM material and
a retention characteristic when negatively exposed under a same exposure, thereby
forming the surface with the stepped shape to facilitate subsequent IJP.
[0033] In combination with FIG. 5 below, the photoresist structure in the embodiment of
the present disclosure is further verified through an inkjet printing experiment.
[0034] In the photoresist structure with a stack of two defining layers, the ink is printed
in corresponding color resist defining areas in the way of droplets in the printing
process. Due to a certain gradient of the defining areas, the off-center ink can flow
into the color resist defining areas zone, which not only meets the requirements of
IJP printing, but also makes the color resist units of the printed color filter layer
meet the requirements of subsequent optical parameters, as shown in part a in FIG.
5.
[0035] As a contrast, the photoresist structure with a single-layer defining layer is difficult
to be sloped since a substrate layer is not too thick at the beginning of the design,
and the color resist units formed by printing are easy to deviate from the defining
area, which affects optical parameter requirements, as shown in part b in FIG. 5.
[0036] Based on the same inventive concept, an embodiment of the present disclosure also
provides a display device.
[0037] As shown in FIG. 6 which is a structural schematic diagram illustrating a display
device according to an embodiment of the present disclosure, the display device 60
comprises a display panel 61 which is the OLED display panel mentioned above in the
present disclosure. The arrangement and advantages are described in detail as the
foregoing, and are not further described herein.
[0038] The display device in the embodiment of the present disclosure can comprise wearable
devices such as smart bracelets, smart watches, and virtual reality (VR) devices,
and can comprise mobile phones, e-books, electronic newspapers, televisions, personal
laptops, flexible or rollable OLED displays, or lighting devices.
[0039] It can be understood that, for those skilled in the art, equivalent replacements
and modifications can be made according to the technical solution and disclosure ideas
thereof of the present disclosure, and all these modifications or replacements are
considered within the protection scope of the attached claims of the present disclosure.
1. An organic light emitting diode (OLED) display panel, comprising:
an array layer;
an organic light emitting layer arranged on the array layer and comprising at least
one light emitting unit; and
a color filter layer arranged on the organic light emitting layer and comprising a
photoresist structure and at least one color resist unit;
wherein the photoresist structure comprises a first defining layer and a second defining
layer, the first defining layer comprises at least one first color resist defining
area, the second defining layer comprises a second color resist defining area at a
position corresponding to the first color resist defining area, the first color resist
defining area and the second color resist defining area have a same shape and are
concentric, an opening of the second color resist defining area is larger than an
opening of the first color resist defining area, and the second defining layer comprises
a sloped surface defined between the first color resist defining area and the second
color resist defining area; and
wherein the color resist unit is arranged in an area defined by the first color resist
defining area and the second color resist defining area and corresponds to the light
emitting unit, and the color resist unit is arranged in the first color resist defining
area and the second color resist defining area by ink-jet printing.
2. The OLED display panel as claimed in claim 1, wherein each of the first color resist
defining area and the second color resist defining area is in a shape selected from
any one or combination of a circle, a rounded rectangle, and a square.
3. The OLED display panel as claimed in claim 1, wherein an aperture parameter of the
first color resist defining area and an optical parameter of the color resist unit
are substantially same.
4. The OLED display panel as claimed in claim 1, wherein materials of the first defining
layer and the second defining layer both comprise a black matrix (BM) material.
5. The OLED display panel as claimed in claim 1, wherein a material of the first defining
layer comprises a black matrix (BM) material, and a material of the second defining
layer comprises an over coat (OC) material.
6. The OLED display panel as claimed in claim 5, wherein the OC material and the BM material
are both negative materials, and when same openings are exposed, an exposure of the
OC material is greater than an exposure of the BM material.
7. The OLED display panel as claimed in claim 5, wherein the first defining layer and
the second defining layer are formed by performing a halftone process through one
mask and by exposing a first layer of the BM material and a second layer of the OC
material at the same time.
8. An organic light emitting diode (OLED) display panel, comprising:
an array layer;
an organic light emitting layer arranged on the array layer and comprising at least
one light emitting unit; and
a color filter layer arranged on the organic light emitting layer and comprising a
photoresist structure and at least one color resist unit;
wherein the photoresist structure comprises a first defining layer and a second defining
layer, the first defining layer comprises at least one first color resist defining
area, the second defining layer comprises a second color resist defining area at a
position corresponding to the first color resist defining area, an opening of the
second color resist defining area is larger than an opening of the first color resist
defining area, and the second defining layer comprises a sloped surface defined between
the first color resist defining area and the second color resist defining area; and
wherein the color resist unit is arranged in an area defined by the first color resist
defining area and the second color resist defining area and corresponds to the light
emitting unit.
9. The OLED display panel as claimed in claim 8, wherein the first color resist defining
area and the second color resist defining area have a same shape and are concentric.
10. The OLED display panel as claimed in claim 8, wherein each of the first color resist
defining area and the second color resist defining area is in a shape selected from
any one or combination of a circle, a rounded rectangle, and a square.
11. The OLED display panel as claimed in claim 8, wherein an aperture parameter of the
first color resist defining area and an optical parameter of the color resist unit
are substantially same.
12. The OLED display panel as claimed in claim 8, wherein materials of the first defining
layer and the second defining layer both comprise a black matrix (BM) material.
13. The OLED display panel as claimed in claim 8, wherein a material of the first defining
layer comprises a black matrix (BM) material, and a material of the second defining
layer comprises an over coat (OC) material.
14. The OLED display panel as claimed in claim 13, wherein the OC material and the BM
material are both negative materials, and when same openings are exposed, an exposure
of the OC material is greater than an exposure of the BM material.
15. The OLED display panel as claimed in claim 13, wherein the first defining layer and
the second defining layer are formed by performing a halftone process through one
mask and by exposing a first layer of the BM material and a second layer of the OC
material at the same time.
16. The OLED display panel as claimed in claim 8, wherein the color resist unit is arranged
in the first color resist defining area and the second color resist defining area
by ink-jet printing.
17. A display device, comprising an organic light emitting diode (OLED) display panel,
wherein the OLED display panel comprises:
an array layer;
an organic light emitting layer arranged on the array layer and comprising at least
one light emitting unit; and
a color filter layer arranged on the organic light emitting layer and comprising a
photoresist structure and at least one color resist unit;
wherein the photoresist structure comprises a first defining layer and a second defining
layer, the first defining layer comprises at least one first color resist defining
area, the second defining layer comprises a second color resist defining area at a
position corresponding to the first color resist defining area, an opening of the
second color resist defining area is larger than an opening of the first color resist
defining area, and the second defining layer comprises a sloped surface defined between
the first color resist defining area and the second color resist defining area; and
wherein the color resist unit is arranged in an area defined by the first color resist
defining area and the second color resist defining area and corresponds to the light
emitting unit.
18. The display device as claimed in claim 17, wherein the first color resist defining
area and the second color resist defining area have same shapes and are concentric.
19. The display device as claimed in claim 17, wherein each materials of the first defining
layer and the second defining layer comprise a black matrix (BM) material; or a material
of the first defining layer comprises a black matrix (BM) material, and a material
of the second defining layer comprises an over coat (OC) material.
20. The display device as claimed in claim 17, wherein the color resist unit is arranged
in the first color resist defining area and the second color resist defining area
by ink-jet printing.