COMPOUND, SEMICONDUCTOR LAYER COMPRISING COMPOUND AND ORGANIC ELECTRONIC DEVICE - Patent 4151642

(19)

(11)

EP 4 151 642 A8

(12)	CORRECTED EUROPEAN PATENT APPLICATION
	Note: Bibliography reflects the latest situation

(15)	Correction information:
	Corrected version no 1 (W1 A1)

(48)	Corrigendum issued on:
	14.06.2023 Bulletin 2023/24

(43)	Date of publication:
	22.03.2023 Bulletin 2023/12

(21)	Application number: 21197757.4

(22)	Date of filing: 20.09.2021

(51)

International Patent Classification (IPC):

C07F 1/08^(2006.01)
C09K 11/00^(2006.01)

H01L 51/00^(2006.01)

(52)	Cooperative Patent Classification (CPC):
	C07F 1/08; C07C 49/15

(84)	Designated Contracting States:
	AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
	Designated Extension States:
	BA ME
	Designated Validation States:
	KH MA MD TN

(71)	Applicant: Novaled GmbH
	01099 Dresden (DE)

(72)	Inventors:
	UVAROV, Vladimir 01099 Dresden (DE) WILLMANN, Steffen 01099 Dresden (DE) HEGGEMANN, Ulrich 01099 Dresden (DE)

(74)	Representative: Michalski Hüttermann & Partner Patentanwälte mbB
	Kaistraße 16A 40221 Düsseldorf 40221 Düsseldorf (DE)

(54)	COMPOUND, SEMICONDUCTOR LAYER COMPRISING COMPOUND AND ORGANIC ELECTRONIC DEVICE

(57) The present invention relates to a compound represented by Formula (I):

wherein M is Cu, Zn, Al, Hf.