(19)
(11) EP 4 154 310 A1

(12)

(43) Date of publication:
29.03.2023 Bulletin 2023/13

(21) Application number: 20735144.6

(22) Date of filing: 25.06.2020
(51) International Patent Classification (IPC): 
H01L 25/065(2006.01)
H01L 23/00(2006.01)
 H01L 25/00(2006.01)
(52) Cooperative Patent Classification (CPC):
H01L 2224/08145; H01L 2224/80895; H01L 24/96; H01L 24/80; H01L 2224/05647; H01L 2224/05611; H01L 2224/05609; H01L 2224/05644; H01L 2224/05655; H01L 2224/05639; H01L 2224/05664; H01L 2224/05666; H01L 24/05; H01L 24/08; H01L 25/50; H01L 2224/94; H01L 2224/03845; H01L 2224/80013; H01L 2224/96; H01L 2224/80357; H01L 24/94; H01L 2224/80006; H01L 2224/80047; H01L 2224/04105; H01L 2224/08147; H01L 24/03; H01L 25/0657; H01L 2225/06593
 
C-Sets:
  1. H01L 2224/05655, H01L 2924/00014;
  2. H01L 2224/05639, H01L 2924/00014;
  3. H01L 2224/05664, H01L 2924/01028;
  4. H01L 2224/05666, H01L 2924/00014;
  5. H01L 2224/94, H01L 2224/03;
  6. H01L 2224/94, H01L 2224/80001;
  7. H01L 2224/05647, H01L 2924/00014;
  8. H01L 2224/96, H01L 2224/80001;
  9. H01L 2224/05611, H01L 2924/00014;
  10. H01L 2224/96, H01L 2224/03;
  11. H01L 2224/05609, H01L 2924/00014;
  12. H01L 2224/05644, H01L 2924/00014;
(86) International application number:
PCT/EP2020/067772
(87) International publication number:
WO 2021/259477 (30.12.2021 Gazette 2021/52)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(71) Applicant: Huawei Technologies Co., Ltd.
Longgang District, Shenzhen, Guangdong 518129 (CN)

(72) Inventor:
  • BADAROGLU, Mustafa
    80992 Munich (DE)

(74) Representative: Isarpatent 
Patent- und Rechtsanwälte Barth Charles Hassa Peckmann & Partner mbB Friedrichstrasse 31
80801 München
80801 München (DE)

   


(54) SEMICONDUCTOR DIE ASSEMBLY AND METHOD OF STACKING SEMICONDUCTOR COMPONENTS