TECHNICAL FIELD
[0001] This application relates to circuit technologies, and in particular, to a pixel drive
circuit.
BACKGROUND
[0002] An light emitting diode (LED) display panel implements pixel display by using an
LED, and in terms of display performance, the LED has higher contrast and higher luminance
than a conventional liquid crystal display (LCD).
[0003] In the LED display panel, an LED pixel array is driven by a pixel drive circuit.
The pixel drive circuit is selected based on a row selection signal and a column drive
signal, to drive the LED to emit light. An anode of the LED is connected to a power
supply, and a cathode is connected to the pixel drive circuit. Because there are a
parasitic capacitor and a parasitic resistor on the cathode of the LED, when the LED
is frequently switched between an on state and an off state, the pixel drive circuit
needs to charge or discharge the cathode of the LED at a high speed, and charging/discharging
time affects switching time of the LED, and consequently, a switching speed of the
LED is limited. When the switching speed of the LED is relatively slow, a ghost phenomenon
is easily observed by a human eye, and user experience is affected.
SUMMARY
[0004] Embodiments of this application provide a pixel drive circuit, to accelerate absorption
of a charge in a parasitic capacitor by using a charge absorption circuit, so that
a switching frequency of a light emitting diode is improved.
[0005] According to a first aspect, an embodiment of this application provides a pixel drive
circuit, including a first switch and a second switch that are cascaded between a
cathode of a light emitting diode and the ground, and a charge absorption circuit.
An anode of the light emitting diode is electrically connected to a voltage source,
one end of the charge absorption circuit is electrically connected to a connection
point (a first node) of the first switch and the second switch, and the other end
is connected to the ground. A first end of the first switch is electrically connected
to the cathode of the light emitting diode, and a control end of the first switch
receives a control signal, so that the first switch is closed or opened based on the
control signal, to control the light emitting diode to be turned on or off. A first
end of the second switch is electrically connected to a second end of the first switch,
a second end of the second switch is grounded, a control end of the second switch
receives a bias voltage, and the second switch is closed in a working state. The charge
absorption circuit is configured to absorb a charge from the first node. When the
first switch is opened and the light emitting diode is off, a parasitic capacitor
on the cathode (a second node) of the light emitting diode D1 accumulates charges.
When the first switch is closed, the charge in the parasitic capacitor is discharged
by using the first switch and the second switch, and may also be discharged by using
the charge absorption circuit.
[0006] The charge absorption circuit electrically connected to the first node can accelerate
release of the charge on the first node, so that the charge in the parasitic capacitor
can be released more quickly. When a charge release speed in the parasitic capacitor
is accelerated, current signal establishment time of the light emitting diode is shortened,
and a refresh frequency of the light emitting diode is increased, so that time experienced
by the light emitting diode in a process from an extinct state to a lighted state
is shortened, a ghost phenomenon caused when a human eye observes the light emitting
diode can be improved, display precision of the light emitting diode is improved,
and user experience is improved.
[0007] In a possible implementation, both the first switch and the second switch may be
NMOS transistors. A source of a first NMOS transistor used as the first switch is
electrically connected to the ground, a drain of the first NMOS transistor and a source
of a second NMOS transistor used as the second switch are electrically connected to
the first node, and a drain of the second NMOS transistor is electrically connected
to the cathode of the light emitting diode.
[0008] In a possible implementation, the charge absorption circuit includes a first capacitor,
one end of the first capacitor is electrically connected to the first node, and the
other end is grounded. The capacitor used as the charge absorption circuit occupies
a relatively small area resource, so that display performance of the light emitting
diode can be significantly improved at the extremely low cost of hardware resources.
[0009] In a possible implementation, the first capacitor is a metal-insulator-metal MIM
capacitor, a metal-oxide-metal MOM capacitor, or a metal-oxide-semiconductor MOS capacitor.
[0010] In a possible implementation, the charge absorption circuit includes a diode-connected
MOS transistor; in other words, two MOS transistors are connected to form a two-end
component to be used as a diode. The diode-connected MOS transistor can better improve
display performance of the light emitting diode.
[0011] In a possible implementation, the diode-connected MOS transistor includes a third
NMOS transistor and a fourth NMOS transistor. A drain and a gate of the third NMOS
transistor are electrically connected to the first node, a drain of the fourth NMOS
transistor is electrically connected to a source of the third NMOS transistor, a source
of the fourth NMOS transistor is grounded, and a gate of the fourth NMOS transistor
is electrically connected to the first node.
[0012] In a possible implementation, the charge absorption circuit includes a Schottky diode,
a cathode of the Schottky diode is electrically connected to the first node, and an
anode is grounded. The Schottky diode used as the charge absorption circuit occupies
a relatively small area resource, so that display performance of the light emitting
diode can be significantly improved at the extremely low cost of hardware resources.
[0013] In a possible implementation, the pixel drive circuit further includes a second capacitor,
one end of the second capacitor is electrically connected to the control end of the
second switch, and the other end is grounded.
[0014] In a possible implementation, the control signal that is input to the first switch
is a pulse width modulation PWM signal.
[0015] In a possible implementation, the foregoing plurality of light emitting diodes may
include a plurality of RGB pixels, and each RGB pixel includes three types of pixels:
R, G, and B.
[0016] In a possible implementation, the foregoing plurality of pixel drive circuits are
separately disposed in a plurality of chips, and each pixel drive circuit drives a
corresponding light emitting diode.
[0017] According to a second aspect, an embodiment of this application provides a pixel
drive circuit, including a first switch and a second switch that are cascaded between
a cathode of a light emitting diode and the ground, a charge absorption circuit, and
a ninth switch. An anode of the light emitting diode is electrically connected to
a voltage source, one end of the charge absorption circuit is electrically connected
to the cathode of the light emitting diode by using the ninth switch, and the other
end is connected to the ground. A first end of the first switch is electrically connected
to the cathode of the light emitting diode, and a control end of the first switch
and a control end of the ninth switch receive a same control signal, so that the first
switch and the ninth switch are closed or opened based on the control signal, to control
the light emitting diode to be turned on or off. A first end of the second switch
is electrically connected to a second end of the first switch, a second end of the
second switch is grounded, a control end of the second switch receives a bias voltage,
and the second switch is closed in a working state. The charge absorption circuit
is configured to absorb a charge from the cathode of the light emitting diode. When
the first switch is opened and the light emitting diode is off, a parasitic capacitor
on the cathode (a second node) of the light emitting diode D1 accumulates charges.
When the first switch is closed, the charge in the parasitic capacitor is discharged
by using the first switch and the second switch, and may also be discharged by using
the charge absorption circuit.
[0018] The charge absorption circuit electrically connected to the cathode of the light
emitting diode can accelerate release of a charge on the cathode of the light emitting
diode, so that the charge in the parasitic capacitor can be released more quickly.
When a charge release speed in the parasitic capacitor is accelerated, current signal
establishment time of the light emitting diode is shortened, and a refresh frequency
of the light emitting diode is increased, so that time experienced by the light emitting
diode in a process from an extinct state to a lighted state is shortened, a ghost
phenomenon caused when a human eye observes the light emitting diode can be improved,
display precision of the light emitting diode is improved, and user experience is
improved.
[0019] In a possible implementation, both the first switch and the second switch may be
NMOS transistors. A source of a first NMOS transistor used as the first switch is
electrically connected to the ground, a drain of the first NMOS transistor and a source
of a second NMOS transistor used as the second switch are electrically connected to
the cathode of the light emitting diode, and a drain of the second NMOS transistor
is electrically connected to the cathode of the light emitting diode.
[0020] In a possible implementation, the charge absorption circuit includes a first capacitor,
one end of the first capacitor is electrically connected to the cathode of the light
emitting diode, and the other end is grounded. The capacitor used as the charge absorption
circuit occupies a relatively small area resource, so that display performance of
the light emitting diode can be significantly improved at the extremely low cost of
hardware resources.
[0021] In a possible implementation, the first capacitor is a metal-insulator-metal MIM
capacitor, a metal-oxide-metal MOM capacitor, or a metal-oxide-semiconductor MOS capacitor.
[0022] In a possible implementation, the charge absorption circuit includes a diode-connected
MOS transistor; in other words, two MOS transistors are connected to form a two-end
component to be used as a diode. The diode-connected MOS transistor can better improve
display performance of the light emitting diode.
[0023] In a possible implementation, the diode-connected MOS transistor includes a third
NMOS transistor and a fourth NMOS transistor. A drain and a gate of the third NMOS
transistor are electrically connected to the cathode of the light emitting diode,
a drain of the fourth NMOS transistor is electrically connected to a source of the
third NMOS transistor, a source of the fourth NMOS transistor is grounded, and a gate
of the fourth NMOS transistor is electrically connected to the cathode of the light
emitting diode.
[0024] In a possible implementation, the charge absorption circuit includes a Schottky diode,
a cathode of the Schottky diode is electrically connected to the cathode of the light
emitting diode, and an anode is grounded. The Schottky diode used as the charge absorption
circuit occupies a relatively small area resource, so that display performance of
the light emitting diode can be significantly improved at the extremely low cost of
hardware resources.
[0025] In a possible implementation, the pixel drive circuit further includes a second capacitor,
one end of the second capacitor is electrically connected to the control end of the
second switch, and the other end is grounded.
[0026] In a possible implementation, the control signal that is input to the first switch
is a pulse width modulation PWM signal.
[0027] According to a third aspect, an embodiment of this application provides a display
circuit, including a plurality of pixel drive circuits in the first aspect and any
possible implementation, and a plurality of light emitting diodes. The plurality of
light emitting diodes are separately electrically connected to the plurality of pixel
drive circuits, and the plurality of pixel drive circuits are configured to separately
drive the plurality of light emitting diodes.
[0028] According to a fourth aspect, an embodiment of this application provides a display
circuit, including a plurality of pixel drive circuits in the second aspect and any
possible implementation, and a plurality of light emitting diodes. The plurality of
light emitting diodes are separately electrically connected to the plurality of pixel
drive circuits, and the plurality of pixel drive circuits are configured to separately
drive the plurality of light emitting diodes.
[0029] According to a fifth aspect, an embodiment of this application provides a terminal
device, including a rear cover, a bezel, and the display circuit in the third aspect
or the fourth aspect. The rear cover and the display circuit are disposed opposite
to each other and are connected by using the bezel.
[0030] The pixel drive circuit in the second aspect, the display circuits in the third aspect
and the fourth aspect, and the terminal device in the fifth aspect have a similar
effect to the pixel drive circuit in the first aspect, and can all improve the ghost
phenomenon caused when the human eye observes the light emitting diode, and improve
display precision of the light emitting diode. Details are not described herein again.
BRIEF DESCRIPTION OF DRAWINGS
[0031]
FIG. 1 is a schematic diagram of a sectional structure of a terminal device according
to an embodiment of this application;
FIG. 2 is a schematic diagram of a display circuit according to an embodiment of this
application;
FIG. 3 is a diagram of a circuit structure of a pixel drive circuit according to an
embodiment of this application;
FIG. 4a is a waveform diagram of a PWM signal in a pixel drive circuit according to
an embodiment of this application;
FIG. 4b is a waveform diagram of a current in a light emitting diode;
FIG. 4c is a waveform diagram of a node A in a conventional circuit;
FIG. 4d is a waveform diagram of a node A in a pixel drive circuit according to an
embodiment of this application;
FIG. 5 shows a more specific pixel drive circuit according to an embodiment of this
application;
FIG. 6 shows another more specific pixel drive circuit according to an embodiment
of this application;
FIG. 7 shows still another more specific pixel drive circuit according to an embodiment
of this application;
FIG. 8 shows yet another more specific pixel drive circuit according to an embodiment
of this application; and
FIG. 9 is a diagram of another pixel drive circuit according to an embodiment of this
application.
DESCRIPTION OF EMBODIMENTS
[0032] The following clearly and completely describes the technical solutions in embodiments
of this application with reference to the accompanying drawings in embodiments of
this application.
[0033] The terms "first" and "second" in this application are merely intended for a purpose
of description, and shall not be understood as an indication or implication of relative
importance or implicit indication of a quantity of indicated technical features. In
addition, the term "electrical connection" needs to be understood in a broad sense.
For example, "electrical connection" may be a physical direction connection, or may
be an electrical connection implemented by using an intermediary medium, for example,
a connection implemented by using a resistor, an inductor, or another electrical element.
[0034] When being used to describe a three-end switch element, a "first end" and a " second
end" may separately be connection ends of the three-end switch element, and a "control
end" may be a control end of the three-end switch element. For example, for a metal-oxide-semiconductor
(MOS) transistor switch, a control end may be a gate of the MOS transistor, a first
end may be a source of the MOS transistor, and a second end is a drain of the MOS
transistor; or the first end may be a drain of the MOS transistor, and the second
end is a source of the MOS transistor.
[0035] FIG. 1 is a schematic diagram of a sectional structure of a terminal device 200 according
to an embodiment of this application. The terminal device 200 may be a smartphone,
a portable computer, a tablet computer, an electronic band, or the like, or a super
small display. The terminal device 200 includes a screen 210, a bezel 220, and a rear
cover 230. The screen 210 and the rear cover 230 are disposed opposite to each other,
and are connected by using the bezel 220, to form a cavity between the screen 210
and the rear cover 230. A substrate 240 is disposed in the cavity, and a plurality
of drive circuits 250 are disposed on the substrate 240. An LED array 260 is further
disposed on the substrate 240. One drive circuit 250 may be connected to one or more
LED arrays 260, and drive a corresponding LED array 260 to emit light. The substrate
240 may be a printed circuit board (PCB). The terminal device 200 may further include
a touch panel, configured to sense a touch signal and convert the touch signal into
an electrical signal. The terminal device 200 may further include another chip such
as a processor chip, a storage chip, or a baseband chip. The chip may be disposed
on the substrate 240, or may be disposed on another PCB in the terminal device 200,
and is electrically connected to the drive circuit 250, to control the drive circuit
250 to drive the LED array 260.
[0036] FIG. 2 is a schematic diagram of a display circuit 300 according to an embodiment
of this application. The display circuit 300 may be a micro light emitting diode (micro
LED) display circuit. The display circuit 300 includes a plurality of pixel drive
circuits 310 arranged in an array and a plurality of RGB pixels corresponding to the
pixel drive circuits 310. The pixel drive circuit 310 may be the drive circuit 250
shown in FIG. 1, and the RGB pixel may be the LED array 260 shown in FIG. 1. Each
pixel drive circuit 310 may drive four RGB pixels in a connection relationship shown
in FIG. 2, drive more RGB pixels, or drive only one RGB pixel. Each RGB pixel includes
R (red), G (green), and B (blue). The plurality of pixel drive circuits 310 may be
separately disposed on a plurality of chips, or may be fabricated on the substrate
240 in a form of a thin film transistor (TFT). For example, one pixel drive circuit
310 drives four RGB pixels. For a 2K screen whose resolution is 2560*1440, the display
circuit 300 may include 2560
∗1440/4=921600 pixel drive circuits 310, and each pixel drive circuit 310 is disposed
on one chip and drives four RGB pixels. Specifically, each pixel drive circuit includes
12 current sources to drive 12 light emitting diodes in the four RGB pixels. In another
implementation, a plurality of pixel drive circuits may alternatively be integrated
into one chip.
[0037] FIG. 3 is a diagram of a circuit structure of a pixel drive circuit 310 according
to an embodiment of this application. The pixel drive circuit 310 includes a first
switch M1 and a second switch M2 that are cascaded, and a charge absorption circuit
311. A first end of the first switch M1 is electrically connected to a cathode of
a light emitting diode D1, a second end of the first switch M1 is electrically connected
to a first end of the second switch M2, and a control end of the first switch M1 is
configured to receive a switch control signal. In an implementation, the switch control
signal may be a pulse width modulation (PWM ) signal. A second end of the second switch
M2 is grounded, and is electrically connected to one end of a second capacitor Cgg.
A control end of the second switch M2 is configured to receive a bias voltage VBIAS.
In addition, an anode of the light emitting diode D1 is connected to a power supply,
to provide a voltage difference applied to two ends of the light emitting diode D1.
The charge absorption circuit 311 is electrically connected to a node A (that is,
a connection point of the first switch M1 and the second switch M2), to absorb a charge
on the node A. Some charges on the node A flow to the ground through the second switch
M2, and other charges are absorbed by the charge absorption circuit 311. The pixel
drive circuit 310 may further include the second capacitor Cgg that is electrically
connected to the control end and the second end of the second switch M2.
[0038] In a working state, the first switch M1 is closed or opened by using the received
switch control signal, and the second switch M2 is kept closed by using the received
bias voltage VBIAS. When the switch control signal controls the first switch M1 to
be opened, a voltage of a node B (that is, the cathode of the light emitting diode
D1) increases, a current in the light emitting diode D1 is 0, and a parasitic capacitor
Cp on the node B accumulates charges. When the switch control signal controls the
first switch M1 to be closed, the parasitic capacitor Cp performs discharging by using
the first switch M1 and the second switch M2. The light emitting diode D1 is turned
on when a voltage of the node B is lower than a specific threshold (depending on characteristics
of the light emitting diode D1). After the first switch M1 is closed, the charge absorption
circuit 311 may absorb the charge on the node A. Therefore, charges accumulated in
the parasitic capacitor Cp may be first discharged by using the first switch M1, and
then by using the second switch M2, and discharged by using the charge absorption
circuit 311, to accelerate discharging of the parasitic capacitor Cp on the node B,
prolong current signal establishment time of the light emitting diode D1, and improve
a refresh frequency of the light emitting diode D1. In a non-working state, the bias
voltage VBIAS controls the second switch M2 to be opened.
[0039] When the voltage of the node B is less than a specific threshold, the light emitting
diode D1 is turned on. The threshold is mainly related to a forward conduction voltage
of the light emitting diode D1. For example, a forward conduction voltage of a silicon
(Si) transistor is approximately 0.7 V, and a forward conduction voltage of a germanium
(Ge) transistor is approximately 0.3 V
[0040] In an implementation, both the first switch M1 and the second switch M2 are NMOS
transistors. The control end of the first switch M1 is a gate, the first end of the
first switch M1 is a drain, and the second end is a source. The control end of the
second switch M2 is a gate, the first end of the second switch M2 is a drain, and
the second end is a source.
[0041] The switch control signal is generated by a control signal generator and output to
the control end of the first switch M1 in the pixel drive circuit 310. In an implementation,
the control signal generator and the pixel drive circuit 310 may be separately disposed
on different chips. For example, one pixel drive circuit 310 is disposed on a corresponding
drive IC, and the control signal generator is disposed on another chip. A control
signal such as a PWM signal generated by one control signal generator may control
on and off of the first switch M1 in the plurality of pixel drive circuits 310.
[0042] In a same charging/discharging periodicity, FIG. 4a is a waveform diagram of a PWM
signal in the pixel drive circuit 310, FIG. 4b is a waveform diagram of a current
I
D1 in the light emitting diode D 1, FIG. 4c is a waveform diagram of a node A in a conventional
circuit, and FIG. 4d shows an optimized circuit, that is, a waveform diagram of the
node A in the pixel drive circuit 310 provided in this embodiment of this application.
In this embodiment of this application, as an example for description, the switch
control signal is a PWM signal, and both the first switch M1 and the second switch
M2 are NMOS transistors.
[0043] When the pixel drive circuit 310 works normally, the second switch M2 is closed.
From a moment 0 to a moment t
1, the PWM signal is at a low level, and in this case, the first switch M1 is in an
open state. Therefore, the voltage of the node B is higher than the foregoing threshold
voltage, the current I
D1 in the light emitting diode D1 is 0, and the light emitting diode D1 is in an off
state. At the moment t
1, the PWM signal changes from the low level to a high level, and in this case, the
first switch M1 switches from the open state to a closed state. Because both the first
switch M1 and the second switch M2 are in a closed state, a voltage of the node B
in an ideal state rapidly decreases to 0, and the current I
D1 in the light emitting diode D1 rapidly increases to a relatively large value, as
shown by an "ideal current" curve in FIG. 4b. In actual operation, as shown by a "conventional
circuit" curve in FIG. 4b, because there is a parasitic capacitor Cp on a node B in
a conventional circuit in a conventional technology, when the first switch M1 switches
from the open state to the closed state, the parasitic capacitor Cp first needs to
perform discharging by using the first switch M1 and the second switch M2 from the
moment t
1 to a moment t
4, until a voltage of the node B is lower than the foregoing threshold voltage. At
the moment t
4, the current I
D1 in the light emitting diode D1 starts to increase, reaches a maximum value at a moment
t
3, and then keeps the maximum value until a moment t
2, and the light emitting diode D1 is in an on state. At the moment t
2, the PWM signal changes from the high level to the low level, and the current I
D1 in the light emitting diode D1 decreases. Correspondingly, as shown in FIG. 4c, because
discharging is slow, after the first switch M1 is closed, a node A in the conventional
circuit in the conventional technology requires time T1 to complete signal establishment.
It can be learned from FIG. 4a to FIG. 4c that, from the moment t
1 to the moment t
4, the parasitic capacitor Cp is in a discharging process, and consequently, a process
in which the light emitting diode D 1 changes from off to on experiences a relatively
long time. A larger parasitic capacitor Cp leads to longer time from t
1 to t
4, and a ghost phenomenon is more easily observed by a human eye. This affects user
experience.
[0044] In the pixel drive circuit 310 provided in this embodiment of this application, the
charge absorption circuit 311 connected to the node A may absorb the charge on the
node A when the parasitic capacitor Cp performs discharging, to accelerate a discharging
process and accelerate a refresh frequency of the light emitting diode D1. As shown
by an "optimized circuit" curve in FIG. 4b, because the charge absorption circuit
311 accelerates the discharging process, the current I
D1 in the light emitting diode D1 can reach the maximum value more quickly and can be
stable, so that the light emitting diode D1 can normally emit light. As shown in FIG.
4d, a voltage of the node A in the pixel drive circuit 310 decreases and approaches
a normal working voltage after time T2 elapses, and then reaches the normal working
voltage after time T3 elapses. Compared with the time T3, the pixel driver circuit
310 provided in this embodiment of this application can reduce the voltage of the
node B to the normal working voltage in shorter time, to accelerate signal establishment
time of the light emitting diode D 1, and increase a switching frequency of the light
emitting diode D1, so that ghost is eliminated, display precision is improved, and
user experience is improved.
[0045] FIG. 5 shows a more specific pixel drive circuit 310 according to an embodiment of
this application. The charge absorption circuit 311 includes a capacitor Ca. In the
foregoing discharging process, charges in the parasitic capacitor Cp may be absorbed
by the capacitor Ca by using the first switch M1 and the node A, and this is equivalent
to redistributing charges in the capacitor Ca and the parasitic capacitor Cp, so that
the discharging process of the node B is accelerated. A capacitance value of the capacitor
Ca is related to a capacitance value of the parasitic capacitor Cp. When the capacitance
value of the parasitic capacitor Cp is relatively large, the capacitor Ca also requires
a relatively large capacitance value. In addition, when the first switch M1 is opened,
a larger voltage difference between the node B and the node A indicates a larger capacitance
value required by the capacitor Ca.
[0046] The capacitor Ca may be a metal-insulator-metal (MIM) capacitor, a metal-oxide-metal
(MOM) capacitor, or a metal-oxide-semiconductor (MOS) capacitor
[0047] FIG. 6 shows another more specific pixel drive circuit 310 according to an embodiment
of this application. The charge absorption circuit 311 includes a diode-connected
MOS transistor. Specifically, the diode-connected MOS transistor includes an NMOS
transistor M3 and an NMOS transistor M4. A drain and a gate of the NMOS transistor
M3 are connected to the node A, a drain of the NMOS transistor M4 is connected to
a source of the NMOS transistor M3, a source of the NMOS transistor M4 is grounded,
and a gate of the NMOS transistor M4 is also connected to the node A.
[0048] In the foregoing discharging process, charges in the parasitic capacitor Cp may flow
to the ground by using the conductive NMOS transistor M3 and the conductive NMOS transistor
M4. Specifically, after the first switch M1 is closed, the voltage of the node A increases.
In this case, the NMOS transistor M3 and the NMOS transistor M4 are turned on, and
both the voltage of the node A and the voltage of the node B rapidly decrease. When
the voltage of the node A decreases and approaches the normal working voltage, the
NMOS transistor M3 and the NMOS transistor M4 are cut off. After the NMOS transistor
M3 and the NMOS transistor M4 are cut off, the second switch M2 continues to perform
discharging for the node A and the node B, so that the node B reaches a voltage at
which the light emitting diode D1 works normally.
[0049] FIG. 7 shows still another more specific pixel drive circuit 310 according to an
embodiment of this application. The charge absorption circuit 311 includes a Schottky
diode D2. A cathode of the Schottky diode D2 is electrically connected to the node
A, and the anode is grounded. The Schottky diode D2 may also accelerate absorption
of the charge on the node A, so that the pixel driver 310 can reduce the node B to
the normal working voltage in shorter time, to accelerate signal establishment time
of the light emitting diode D 1, and increase a switching frequency of the light emitting
diode D1, so that ghost is eliminated, display precision is improved, and user experience
is improved.
[0050] FIG. 8 shows yet another more specific pixel drive circuit 310 according to an embodiment
of this application. The pixel drive circuit 310 shown in FIG. 8 further includes
a fifth switch M5 connected between the second switch M2 and the ground. The fifth
switch M5 may be an NMOS transistor. In an implementation, a drain of the fifth switch
M5 is connected to a source of the second switch M2, a source of the fifth switch
M5 is grounded and connected to one end of the capacitor Cgg, and a gate of the fifth
switch M5 is connected to a gate of the second switch M2 and the other end of the
capacitor Cgg, to receive a bias voltage VBIAS. The charge absorption circuit 311
in FIG. 8 may be any charge absorption circuit provided in embodiments of this application.
[0051] As shown in FIG. 8, an embodiment of this application further provides a bias circuit
320. The bias circuit 320 includes a sixth switch M6, a seventh switch M7, and an
eighth switch M8. In an implementation, the sixth switch M6 and the seventh switch
M7 are NMOS transistors, and the eighth switch M8 is a PMOS transistor. A source of
the sixth switch M6 is grounded, a gate is connected to a gate of the seventh switch
M7, and a bias voltage VBIAS is generated. A drain of the sixth switch M6 is connected
to a source of the seventh switch M7. A drain of the seventh switch M7 is separately
connected to the gate of the seventh switch M7 and a drain of the eighth switch M8,
and a source of the eighth switch M8 is connected to a power supply. The bias circuit
320 may provide a bias voltage for any pixel drive circuit provided in embodiments
of this application.
[0052] In an implementation, one bias circuit 320 and the pixel drive circuit 310 may be
separately disposed on different chips. The bias circuit 320 may provide a bias voltage
VBIAS for a plurality of pixel drive circuits 310. In another implementation, the
bias circuit 320 and one or more pixel drive circuits 310 may alternatively be integrated
into a same chip.
[0053] As shown in FIG. 9, an embodiment of this application further provides a pixel drive
circuit 900. A circuit structure of the pixel drive circuit 900 is similar to a structure
of the pixel drive circuit 310, and a difference is that a charge absorption circuit
310 in the pixel drive circuit 900 is connected to a cathode of a light emitting diode
D1 by using a ninth switch M9. The charge absorption circuit 310 in the pixel drive
circuit 900 may be any charge absorption circuit in embodiments of this application.
One end of the ninth switch M9 is connected to one end of the charge absorption circuit
310, the other end is connected to the cathode of the light emitting diode D1, and
a PWM signal received by a gate of the ninth switch M9 is the same as a PWM signal
received by the first switch M1. In normal operation, because the PWM signal controls
on and off of both the first switch M1 and the ninth switch M9, after the two switches
are closed, the charge absorption circuit 310 starts to absorb a charge on the light
emitting diode D1, to accelerate release of a charge on the cathode of the light emitting
diode D1, so that the charge in a parasitic capacitor can be released more quickly.
When a charge release speed in the parasitic capacitor is accelerated, current signal
establishment time of the light emitting diode is shortened, and a refresh frequency
of the light emitting diode is increased, so that time experienced by the light emitting
diode in a process from an extinct state to a lighted state is shortened, a ghost
phenomenon caused when a human eye observes the light emitting diode can be improved,
display precision of the light emitting diode is improved, and user experience is
improved.
[0054] In addition to the foregoing terminal device mentioned in embodiments of this application,
the pixel drive circuit provided in embodiments of this application may be further
used by another device, such as an ultra-large indoor display screen, a helmet-mounted
display (helmet-mounted displays, HMD), a head up display (HUD), Light Fidelity (Li-Fi),
augmented reality (AR), and virtual reality (VR).
[0055] The foregoing descriptions are merely specific implementations of this application,
but are not intended to limit the protection scope of this application. Any variation
or replacement readily figured out by a person skilled in the art within the technical
scope disclosed in this application shall fall within the protection scope of this
application. Therefore, the protection scope of this application shall be subject
to the protection scope of the claims.
1. A pixel drive circuit, wherein the pixel drive circuit comprises:
a first switch and a second switch that are cascaded between a cathode of a light
emitting diode and the ground, wherein a control end of the first switch receives
a control signal, a control end of the second switch receives a bias voltage, and
an anode of the light emitting diode is electrically connected to a power supply;
and
and a charge absorption circuit, electrically connected between the ground and a first
node, wherein the first node is a connection point of the first switch and the second
switch, and the charge absorption circuit is configured to absorb a charge from the
first node.
2. The pixel drive circuit according to claim 1, wherein the charge absorption circuit
comprises a first capacitor, wherein one end of the first capacitor is electrically
connected to the first node, and the other end is electrically connected to the ground.
3. The pixel drive circuit according to claim 2, wherein the first capacitor is a metal-insulator
metal, MIM, capacitor, a metal-oxide-metal, MOM, capacitor, or a metal-oxide-semiconductor,
MOS, capacitor.
4. The pixel drive circuit according to claim 1, wherein the charge absorption circuit
comprises a diode-connected MOS transistor
5. The pixel drive circuit according to claim 4, wherein the diode-connected MOS transistor
comprises:
a third NMOS transistor, wherein a drain and a gate of the third NMOS transistor are
electrically connected to the first node; and
and a fourth NMOS transistor, wherein a drain of the fourth NMOS transistor is electrically
connected to a source of the third NMOS transistor, a source of the fourth NMOS transistor
is grounded, and a gate of the fourth NMOS transistor is electrically connected to
the first node.
6. The pixel drive circuit according to claim 1, wherein the charge absorption circuit
comprises a Schottky diode, a cathode of the Schottky diode is electrically connected
to the first node, and an anode of the Schottky diode is grounded.
7. The pixel drive circuit according to any one of claims 1 to 6, wherein the first switch
is a first NMOS transistor, the second switch is a second NMOS transistor, wherein
a source of the first NMOS transistor is electrically connected to the ground, a drain
of the first NMOS transistor and a source of the second NMOS transistor are electrically
connected to the first node, and a drain of the second NMOS transistor is electrically
connected to the cathode of the light emitting diode.
8. The pixel drive circuit according to any one of claims 1 to 7, wherein the pixel drive
circuit further comprises a second capacitor, wherein one end of the second capacitor
is electrically connected to the control end of the second switch, and the other end
is grounded.
9. The pixel drive circuit according to any one of claims 1 to 8, wherein the control
signal is a pulse width modulation, PWM, signal.
10. A display circuit, wherein the display circuit comprises:
a plurality of pixel drive circuits according to any one of claims 1 to 9; and
a plurality of light emitting diodes, separately electrically connected to the plurality
of pixel drive circuits, wherein the plurality of pixel drive circuits are configured
to separately drive the plurality of light emitting diodes.
11. A terminal device, comprising a rear cover, a bezel, and the display circuit according
to claim 10, wherein the rear cover and the display circuit are disposed opposite
to each other and are connected by using the bezel.