(19)
(11) EP 4 158 878 A1

(12)

(43) Date of publication:
05.04.2023 Bulletin 2023/14

(21) Application number: 21721798.3

(22) Date of filing: 13.04.2021
(51) International Patent Classification (IPC): 
H04L 29/08(2006.01)
H04L 29/06(2006.01)
(52) Cooperative Patent Classification (CPC):
H04L 67/12; H04L 69/22; H04L 69/16; H04L 69/324
(86) International application number:
PCT/US2021/027034
(87) International publication number:
WO 2021/242424 (02.12.2021 Gazette 2021/48)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 29.05.2020 US 202016887384

(71) Applicant: QUALCOMM INCORPORATED
San Diego, California 92121-1714 (US)

(72) Inventors:
  • ZHANG, Juan
    San Diego, California 92121-1714 (US)
  • PAYYAPPILLY, Ajith Tom
    San Diego, California 92121-1714 (US)
  • CHIN, Tom
    San Diego, California 92121-1714 (US)
  • RONG, Huayan
    San Diego, California 92121-1714 (US)

(74) Representative: Howe, Steven 
Reddie & Grose LLP The White Chapel Building 10 Whitechapel High Street
London E1 8QS
London E1 8QS (GB)

   


(54) UPPER LAYERS REALIZATION OF UNICAST FOR C-V2X