BACKGROUND
1. Field
[0001] The present disclosure relates to a display device.
2. Description of the Related Art
[0002] Display devices are becoming increasingly important with the development of multimedia.
Accordingly, various types of display devices such as organic light emitting displays
(OLEDs) and liquid crystal displays (LCDs) are being used.
[0003] As a device for displaying an image of a display device, there is a self-luminous
display device including a light emitting element. The self-luminous display device
may be an organic light emitting display using an organic material as a light emitting
material as a light emitting element or an inorganic light emitting display using
an inorganic material as a light emitting material.
SUMMARY
[0004] Aspects and features of embodiments of the present disclosure provide a display device
in which light emitting elements remaining as defects in pixels are removed.
[0005] However, aspects and features of embodiments of the disclosure are not restricted
to the ones set forth herein. The above and other aspects of the present disclosure
will become more apparent to one of ordinary skill in the art to which the present
disclosure pertains by referencing the detailed description of the present disclosure
given below.
[0006] According to one or more embodiments of the present disclosure, a display device
including: a plurality of electrodes including a first electrode on a substrate and
extending in a first direction, a second electrode spaced from the first electrode
in a second direction, a third electrode between the first electrode and the second
electrode, and a fourth electrode spaced from the second electrode in the second direction,
a first insulating layer on the plurality of electrodes, a plurality of light emitting
elements on the plurality of electrodes that are spaced from each other in the second
direction on the first insulating layer, a second insulating layer on the first insulating
layer and plurality of the light emitting elements and including a plurality of openings,
a plurality of connection electrodes on at least some of the plurality of electrodes,
in contact with the plurality of light emitting elements, and spaced from each other
in the first direction and the second direction, wherein the second insulating layer
includes a plurality of first openings overlapping the first electrode and the plurality
of light emitting elements and are spaced from each other in the first direction,
wherein a plurality of second openings overlaps the second electrode and the plurality
of light emitting elements and are spaced from each other in the first direction,
wherein a third opening does not overlap the plurality of light emitting elements
and the plurality of electrodes, and wherein a fourth opening overlaps the second
electrode and the third electrode without overlapping the light emitting elements.
[0007] The display device may further include a bank layer on the first insulating layer
and surrounding an emission area in which the light emitting elements are located,
wherein the plurality of first openings, the plurality of second openings, and the
fourth opening may be located in the emission area, and the third opening is located
on the bank layer.
[0008] The display device may further include one electrode of a storage capacitor located
on the substrate and overlapping the bank layer, wherein the third opening may overlaps
the one electrode of the storage capacitor.
[0009] The second insulating layer may further includes a plurality of fifth openings overlapping
the third electrode and the plurality of light emitting elements and are spaced from
each other in the first direction, and a plurality of sixth openings overlapping the
fourth electrode and the plurality of light emitting elements and are spaced from
each other in the first direction.
[0010] The fourth opening may be located between the plurality of fifth openings and the
plurality of second openings to overlap a region between the second electrode and
the third electrode.
[0011] The plurality of light emitting elements may include a first light emitting element
on the first electrode and the third electrode, a second light emitting element on
the second electrode and the fourth electrode, a third light emitting element on the
first electrode and the third electrode and spaced from the first light emitting element
in the first direction, and a fourth light emitting element on the second electrode
and the fourth electrode and spaced from the second light emitting element in the
first direction.
[0012] The plurality of first openings overlaps first ends of the first light emitting element
and the third light emitting element, wherein the plurality of second openings overlaps
second ends of the second light emitting element and the fourth light emitting element,
wherein the plurality of fifth openings overlaps second ends of the first light emitting
element and the third light emitting element, and wherein the plurality of sixth openings
overlaps first ends of the second light emitting element and the fourth light emitting
element.
[0013] The plurality of connection electrodes includes: a first connection electrode on
the first electrode and overlapping a first opening from among the plurality of first
openings located at a lower region of the emission area, and a second connection electrode
located on the second electrode and overlapping a second opening from among the plurality
of second openings located at a lower region of the emission area.
[0014] The plurality of connection electrodes further includes a third connection electrode
including a first extension portion on the third electrode, and a second extension
portion on the first electrode and spaced from the first connection electrode in the
first direction, a fourth connection electrode including a third extension portion
on the fourth electrode, and a fourth extension portion on the second electrode and
spaced from the second connection electrode in the first direction, and a fifth connection
electrode including a fifth extension portion on the third electrode, and a sixth
extension portion on the fourth electrode and spaced from the third extension portion
in the first direction.
[0015] The first extension portion may overlap the plurality of fifth openings located at
the lower region of the emission area, wherein the second extension portion may overlap
the plurality of first openings located at an upper region of the emission area, wherein
the third extension portion may overlap the plurality of sixth openings located at
the lower region of the emission area, wherein the fourth extension portion may overlap
the plurality of second openings located at the upper region of the emission area,
wherein the fifth extension portion may overlap the plurality of fifth openings located
at the upper region of the emission area, and wherein the sixth extension portion
may overlap the plurality of sixth openings located at the upper region of the emission
area.
[0016] The display device may further include a third insulating layer on the second insulating
layer, wherein the third insulating layer may be on the third opening and the fourth
opening.
[0017] The third insulating layer may be in contact with a portion of the first insulating
layer exposed by the fourth opening.
[0018] The plurality of first openings and the plurality of second openings that are located
at a lower region of the emission area, and the plurality of fifth openings and the
plurality of sixth openings that are located at an upper region of the emission area
penetrate the third insulating layer.
[0019] Lengths of the third opening and the fourth opening measured in the first direction
may be greater than lengths of each of the plurality of first openings, the plurality
of second openings, the plurality of fifth openings, and the plurality of sixth openings
measured in the first direction.
[0020] According to one or more embodiments of the present disclosure, a display device
including: a first electrode and a second electrode spaced from the first electrode,
a first insulating layer on the first electrode and the second electrode, a plurality
of light emitting elements each having a first end on the first electrode and a second
end on the second electrode on the first insulating layer, a bank layer on the first
insulating layer and surrounding an emission area in which the plurality of light
emitting elements are located, a second insulating layer on the first insulating layer
and the plurality of light emitting elements and including a plurality of openings,
a first connection electrode on the first electrode, and a second connection electrode
on the second electrode, wherein the second insulating layer includes a first opening
overlapping the first electrode and one ends of the plurality of light emitting elements,
a second opening overlapping the second electrode and other ends of the plurality
of light emitting elements, and a third opening that does not overlap the plurality
of light emitting elements, the first electrode, and the second electrode.
[0021] The first connection electrode partially overlaps the first opening and is in contact
with the one ends of the plurality of light emitting elements, and wherein the second
connection electrode partially overlaps the second opening and in contact with the
other ends of the plurality of light emitting elements.
[0022] The display device may further include a third insulating layer on the second insulating
layer and the second connection electrode, wherein the first opening may penetrate
the second insulating layer and the third insulating layer.
[0023] The third insulating layer covers the second opening and the third opening.
[0024] The third opening overlaps the bank layer.
[0025] The second insulating layer may further include a fourth opening on the first electrode
without overlapping the plurality of light emitting elements.
[0026] In the display device according to one or more embodiments, an insulating layer disposed
on light emitting elements may include an opening formed in a region where the light
emitting elements are not aligned. The insulating layer may not cover misaligned light
emitting elements, and light emitting elements seated in a region other than an alignment
region may be removed.
[0027] The display device according to one or more embodiments may prevent the misaligned
light emitting elements in pixels from remaining defective, and in a defect inspection
of the display device, there is an effect that it is easy to inspect foreign substances
or dark spots formed in lower conductive layers.
[0028] However, the effects, aspects, and features of embodiments of the disclosure are
not limited to the aforementioned effects, aspects, and features and various other
effects, aspects, and features are included in the specification.
BRIEF DESCRIPTION OF THE DRAWINGS
[0029] The above and other aspects and features of embodiments of the present disclosure
will become more apparent by describing in detail embodiments thereof with reference
to the attached drawings, in which:
FIG. 1 is a schematic plan view of a display device according to one or more embodiments;
FIG. 2 is a plan view illustrating an arrangement of a plurality of wires included
in a display device according to one or more embodiments;
FIG. 3 is an equivalent circuit diagram of a sub-pixel according to one or more embodiments;
FIG. 4 is a plan view illustrating one pixel of a display device according to one
or more embodiments;
FIG. 5 is a plan view illustrating a first insulating layer disposed in one pixel
of FIG. 4;
FIG. 6 is a plan view illustrating a second insulating layer disposed in one pixel
of FIG. 4;
FIG. 7 is a plan view illustrating a first connection electrode layer disposed in
one pixel of FIG. 4;
FIG. 8 is a plan view illustrating a third insulating layer disposed in one pixel
of FIG. 4;
FIG. 9 is a plan view illustrating a second connection electrode layer disposed in
one pixel of FIG. 4;
FIG. 10 is a cross-sectional view taken along the line E1-E1' of FIG. 4;
FIG. 11 is a cross-sectional view taken along the line E2-E2' of FIG. 4;
FIG. 12 is a cross-sectional view taken along the line E3-E3' of FIG. 4;
FIG. 13 is a schematic cutaway view of a light emitting element according to one or
more embodiments;
FIG. 14 is a plan view illustrating a sub-pixel of a display device according to one
or more embodiments;
FIG. 15 is a plan view illustrating a first insulating layer disposed in one sub-pixel
of FIG. 14;
FIG. 16 is a plan view illustrating a second insulating layer disposed in one sub-pixel
of FIG. 14;
FIG. 17 is a plan view illustrating a first connection electrode layer disposed in
one sub-pixel of FIG. 14;
FIG. 18 is a plan view illustrating a third insulating layer disposed in one sub-pixel
of FIG. 14;
FIG. 19 is a plan view illustrating a second connection electrode layer disposed in
one sub-pixel of FIG. 14;
FIG. 20 is a cross-sectional view taken along the line E4-E4' in FIG. 14;
FIG. 21 is a cross-sectional view taken along the line E5-E5' of FIG. 14;
FIG. 22 is a plan view illustrating a sub-pixel of a display device according to one
or more embodiments;
FIG. 23 is a cross-sectional view taken along the line E6-E6' of FIG. 22;
FIG. 24 is a cross-sectional view taken along the line E7-E7' in FIG. 22; and
FIG. 25 is a cross-sectional view taken along the line E8-E8' in FIG. 22.
DETAILED DESCRIPTION
[0030] The present disclosure will now be described more fully hereinafter with reference
to the accompanying drawings, in which embodiments of the present disclosure are shown.
The present disclosure may, however, be embodied in different forms and should not
be construed as limited to the embodiments set forth herein. Rather, these embodiments
are provided so that this disclosure will be thorough and complete, and will fully
convey the scope of the present disclosure to those skilled in the art.
[0031] It will also be understood that when a layer is referred to as being "on" another
layer or substrate, it can be directly on the other layer or substrate, or intervening
layers may also be present. The same reference numbers indicate the same components
throughout the specification.
[0032] It will be understood that, although the terms "first," "second," etc. may be used
herein to describe various elements, these elements should not be limited by these
terms. These terms are only used to distinguish one element from another element.
For instance, a first element discussed below could be termed a second element without
departing from the teachings of the present disclosure. Similarly, the second element
could also be termed the first element.
[0033] Hereinafter, embodiments will be described with reference to the accompanying drawings.
[0034] FIG. 1 is a schematic plan view of a display device according to one or more embodiments.
[0035] Referring to FIG. 1, a display device 10 displays a moving image or a still image.
The display device 10 may refer to any electronic device providing a display screen.
Examples of the display device 10 may include a television, a laptop computer, a monitor,
a billboard, an Internet-of-Things device, a mobile phone, a smartphone, a tablet
personal computer (PC), an electronic watch, a smart watch, a watch phone, a head-mounted
display, a mobile communication terminal, an electronic notebook, an electronic book,
a portable multimedia player (PMP), a navigation device, a game machine, a digital
camera, a camcorder and the like, which provide a display screen.
[0036] The display device 10 includes a display panel that provides a display screen. Examples
of the display panel may include an inorganic light emitting diode display panel,
an organic light emitting display panel, a quantum dot light emitting display panel,
a plasma display panel and a field emission display panel. In the following description,
a case where an inorganic light emitting diode display panel is applied as a display
panel will be exemplified, but the present disclosure is not limited thereto, and
other display panels may be applied within the same scope of technical spirit.
[0037] The shape of the display device 10 may be variously modified. For example, the display
device 10 may have a shape such as a rectangular shape elongated in a horizontal direction,
a rectangular shape elongated in a vertical direction, a square shape, a quadrilateral
shape with rounded corners (e.g., vertices), another polygonal shape and a circular
shape. The shape of a display area DPA of the display device 10 may also be similar
to the overall shape of the display device 10. FIG. 1 illustrates the display device
10 having a rectangular shape elongated in a second direction DR2.
[0038] The display device 10 may include the display area DPA and a non-display area NDA
around the edge or periphery of the display area DPA. The display area DPA is an area
where an image can be displayed, and the non-display area NDA is an area where no
image is displayed. The display area DPA may also be referred to as an active region,
and the non-display area NDA may also be referred to as a non-active region. The display
area DPA may substantially occupy the center of the display device 10.
[0039] The display area DPA may include a plurality of pixels PX. The plurality of pixels
PX may be arranged in a matrix. For example, the plurality of pixels PX may be arranged
along rows and columns of a matrix. The shape of each pixel PX may be a rectangular
or square shape in a plan view. However, the present disclosure is not limited thereto,
and it may be a rhombic shape in which each side is inclined with respect to one direction.
The pixels PX may be arranged in a stripe type or an island type or a PENTILE
® arrangement structure, but the present disclosure is not limited thereto. This PENTILE
® arrangement structure may be referred to as an RGBG matrix structure (e.g., a PENTILE
® matrix structure or an RGBG structure (e.g., a PENTILE
® structure)). PENTILE
® is a registered trademark of Samsung Display Co., Ltd., Republic of Korea. In addition,
each of the pixels PX may include one or more light emitting elements that emit light
of a specific wavelength band to display a specific color.
[0040] The non-display area NDA may be disposed around the display area DPA. The non-display
area NDA may completely or partially surround the display area DPA. The display area
DPA may have a rectangular shape, and the non-display area NDA may be disposed adjacent
to four sides of the display area DPA. The non-display area NDA may form a bezel of
the display device 10. Wires or circuit drivers included in the display device 10
may be disposed in the non-display area NDA, or external devices may be mounted thereon.
[0041] FIG. 2 is a plan view illustrating an arrangement of a plurality of wires included
in a display device according to one or more embodiments.
[0042] Referring to FIG. 2, the display device 10 may include a plurality of wires. The
display device 10 may include a plurality of scan lines SL1, SL2, and SL3, a plurality
of data lines DTL1, DTL2, and DTL3, an initialization voltage line VIL, and a plurality
of voltage lines VL1, VL2, VL3, and VL4. Although not shown in the drawing, other
wires may be further provided in the display device 10.
[0043] The first scan line SL1 and the second scan line SL2 may be disposed to extend in
the first direction DR1. The first scan line SL1 and the second scan line SL2 may
be disposed adjacent to each other, and may be disposed to be spaced from the different
first scan line SL1 and second scan line SL2 in the second direction DR2. The first
scan line SL1 and the second scan line SL2 may be connected to a scan line pad WPD_SC
connected to a scan driver. The first scan line SL1 and the second scan line SL2 may
be disposed to extend from the pad area PDA disposed in the non-display area NDA to
the display area DPA.
[0044] The third scan line SL3 may be disposed to extend in the second direction DR2, and
may be disposed to be spaced from the other third scan line SL3 in the first direction
DR1. One third scan line SL3 may be connected to one or more first scan lines SL1
or one or more second scan lines SL2. In one or more embodiments, the first scan line
SL1 and the second scan line SL2 may be formed as a conductive layer disposed on a
different layer from the third scan line SL3. The plurality of scan lines SL may have
a mesh structure in the entire surface of the display area DPA, but is not limited
thereto.
[0045] In one or more embodiments, the term "connected" as used herein may mean not only
that one member is connected to another member through a physical contact, but also
that one member is connected to another member through yet another member. This may
also be understood as one part and the other part as integral elements are connected
into an integrated element via another element. Furthermore, if one element is connected
to another element, this may be construed as a meaning including an electrical connection
via another element in addition to a direct connection in physical contact.
[0046] The data lines DTL may be disposed to extend in the first direction DR1. The data
line DTL includes a first data line DTL1, a second data line DTL2, and a third data
line DTL3, and each one of the first to third data lines DTL1, DTL2, and DTL3 forms
a pair and is disposed adjacent to each other. Each of the data lines DTL1, DTL2,
and DTL3 may be disposed to extend from the pad area PDA disposed in the non-display
area NDA to the display area DPA. However, the present disclosure is not limited thereto,
and the plurality of data lines DTL may be spaced from each other at equal intervals
between a first voltage line VL1 and a second voltage line VL2 to be described later.
[0047] The initialization voltage line VIL may be disposed to extend in the first direction
DR1. The initialization voltage line VIL may be disposed between the data lines DTL
and the first scan line SL1 and the second scan line SL2. The initialization voltage
line VIL may be disposed to extend from the pad area PDA disposed in the non-display
area NDA to the display area DPA.
[0048] The first voltage line VL1 and the second voltage line VL2 are disposed to extend
in the first direction DR1, and the third voltage line VL3 and the fourth voltage
line VL4 are disposed to extend in the second direction DR2. The first voltage line
VL1 and the second voltage line VL2 may be alternately disposed along the second direction
DR2, and the third voltage line VL3 and the fourth voltage line VL4 may be alternately
disposed along the first direction DR1. The first voltage line VL1 and the second
voltage line VL2 may be disposed to extend in the first direction DR1 to cross the
display area DPA, and as for the third voltage line VL3 and the fourth voltage line
VL4, some of the wires may be disposed in the display area DPA and other wires may
be disposed in the non-display area NDA positioned on both sides of the display area
DPA in the first direction DR1, respectively. The first voltage line VL1 and the second
voltage line VL2 may be formed as a conductive layer disposed on a different layer
from the third voltage line VL3 and the fourth voltage line VL4. The first voltage
line VL1 may be connected to at least one third voltage line VL3, the second voltage
line VL2 may be connected to at least one fourth voltage line VL4, and the plurality
of voltage lines VL may have a mesh structure in the entire display area DPA. However,
the present disclosure is not limited thereto.
[0049] The first scan line SL1, the second scan line SL2, the data line DTL, the initialization
voltage line VIL, the first voltage line VL1, and the second voltage line VL2 may
be electrically connected to at least one line pad WPD. Each line pad WPD may be disposed
in the non-display area NDA. In one or more embodiments, each of the line pads WPD
may be disposed in the pad area PDA positioned on the lower side, which is the other
side of the display area DPA in the first direction DR1. The first scan line SL1 and
the second scan line SL2 are connected to the scan line pad WPD_SC disposed in the
pad area PDA, and the plurality of data lines DTL are connected to the data line pads
WPD_DT different from each other, respectively. The initialization voltage line VIL
is connected to an initialization line pad WPD_Vint, the first voltage line VL1 is
connected to a first voltage line pad WPD_VL1, and the second voltage line VL2 is
connected to a second voltage line pad WPD_VL2. The external devices may be mounted
on the line pads WPD. The external devices may be mounted on the line pads WPD by
applying an anisotropic conductive film, ultrasonic bonding or the like. The drawing
exemplifies that each of the line pads WPD is disposed on the pad area PDA disposed
on the lower side of the display area DPA, but is not limited thereto. Some of the
plurality of line pads WPD may be disposed in any one area on the upper side or on
the left and right sides of the display area DPA.
[0050] Each pixel PX or sub-pixel SPXn (n being an integer of 1 to 3) of the display device
10 includes a pixel driving circuit. The above-described wires may pass through each
pixel PX or the periphery thereof to apply a driving signal to each pixel driving
circuit. The pixel driving circuit may include transistors and capacitors. The number
of transistors and capacitors of each pixel driving circuit may be variously modified.
According to one or more embodiments, in each sub-pixel SPXn of the display device
10, the pixel driving circuit may have a 3T1C structure including three transistors
and one capacitor. Hereinafter, the pixel driving circuit of the 3T1C structure will
be described as an example, but the present disclosure is not limited thereto, and
various other modified structures such as a 2T1C structure, a 7T1C structure, and
a 6T1C structure may be applied.
[0051] FIG. 3 is an equivalent circuit diagram of a sub-pixel according to one or more embodiments.
[0052] Referring to FIG. 3, each sub-pixel SPXn of the display device 10 according to one
or more embodiments includes three transistors T1, T2 and T3 and one storage capacitor
Cst in addition to a light emitting diode EL.
[0053] The light emitting diode EL emits light by a current supplied through a first transistor
T1. The light emitting diode EL includes a first electrode, a second electrode, and
at least one light emitting element disposed between them. The light emitting element
may emit light of a specific wavelength band by electrical signals transmitted from
the first electrode and the second electrode.
[0054] One end of the light emitting diode EL may be connected to the source electrode of
the first transistor T1, and the other end thereof may be connected to the second
voltage line VL2 to which a low potential voltage (hereinafter, a second power voltage)
lower than a high potential voltage (hereinafter, a first power voltage) of the first
voltage line VL1 is supplied.
[0055] The first transistor T1 adjusts a current flowing from the first voltage line VL1,
to which the first power voltage is supplied, to the light emitting diode EL according
to the voltage difference between the gate electrode and the source electrode of the
first transistor T1. For example, the first transistor T1 may be a driving transistor
for driving the light emitting diode EL. The gate electrode of the first transistor
T1 may be connected to the source electrode of the second transistor T2, the source
electrode of the first transistor T1 may be connected to the first electrode of the
light emitting diode EL, and the drain electrode of the first transistor T1 may be
connected to the first voltage line VL1 to which the first power voltage is applied.
[0056] The second transistor T2 is turned on by a scan signal of a first scan line SL1 to
connect the data line DTL to the gate electrode of the first transistor T1. The gate
electrode of the second transistor T2 may be connected to the first scan line SL1,
the source electrode thereof may be connected to the gate electrode of the first transistor
T1, and the drain electrode thereof may be connected to the data line DTL.
[0057] The third transistor T3 is turned on by a scan signal of the second scan line SL2
to connect the initialization voltage line VIL to one end of the light emitting diode
EL. The gate electrode of the third transistor T3 may be connected to the second scan
line SL2, the drain electrode thereof may be connected to the initialization voltage
line VIL, and the source electrode thereof may be connected to one end of the light
emitting diode EL or to the source electrode of the first transistor T1.
[0058] In the drawing, it is illustrated that the gate electrodes of the second transistor
T2 and the third transistor T3 are electrically connected to different scan lines
SL1 and SL2, respectively, but the present disclosure is not limited thereto. In one
or more embodiments, the gate electrodes of the second transistor T2 and the third
transistor T3 may be electrically connected to the same scan line.
[0059] In one or more embodiments, the source electrode and the drain electrode of each
of the transistors T1, T2, and T3 are not limited to those described above, and vice
versa. Further, each of the transistors T1, T2, and T3 may be formed of a thin film
transistor (TFT). In addition, in FIG. 3, each of the transistors T1, T2, and T3 has
been described as being formed of an N-type metal oxide semiconductor field effect
transistor (MOSFET), but is not limited thereto. For example, each of the transistors
T1, T2, and T3 may be formed of a P-type MOSFET. Alternatively, some of the transistors
T1, T2, and T3 may be formed of an N-type MOSFET and the others may be formed of a
P-type MOSFET.
[0060] The storage capacitor Cst is formed between the gate electrode and the source electrode
of the first transistor T1. The storage capacitor Cst stores a difference voltage
between a gate voltage and a source voltage of the first transistor T1.
[0061] Hereinafter, a structure of one pixel PX of the display device 10 according to one
or more embodiments will be described in detail with further reference to other drawings.
[0062] FIG. 4 is a plan view illustrating one pixel of a display device according to one
or more embodiments. FIG. 4 illustrates planar arrangement of electrodes RME (RME1
and RME2), bank patterns BP1 and BP2, a bank layer BNL, a plurality of light emitting
elements ED (ED1 and ED2), and connection electrodes CNE (CNE1 and CNE2) disposed
in one pixel PX of the display device 10.
[0063] Referring to FIG. 4, each of the pixels PX of the display device 10 may include a
plurality of sub-pixels SPXn. For example, one pixel PX may include a first sub-pixel
SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3. The first sub-pixel SPX1
may emit light of a first color, the second sub-pixel SPX2 may emit light of a second
color, and the third sub-pixel SPX3 may emit light of a third color. For example,
the first color may be blue, the second color may be green, and the third color may
be red. However, the present disclosure is not limited thereto, and the sub-pixels
SPXn may emit light of the same color. In one or more embodiments, each of the sub-pixels
SPXn may emit blue light. Although it is illustrated in the drawing that one pixel
PX includes three sub-pixels SPXn, the present disclosure is not limited thereto,
and the pixel PX may include a larger number of sub-pixels SPXn.
[0064] Each sub-pixel SPXn of the display device 10 may include an emission area EMA and
a non-emission area. The emission area EMA may be an area in which the light emitting
element ED is disposed to emit light of a specific wavelength band. The non-emission
area may be a region in which the light emitting element ED is not disposed and a
region from which light is not emitted because light emitted from the light emitting
element ED does not reach it.
[0065] The emission area EMA may include the region in which the light emitting element
ED is disposed, and a region adjacent to the light emitting element ED in which the
lights emitted from the light emitting element ED are emitted. For example, the emission
area EMA may further include a region in which the light emitted from the light emitting
element ED is reflected or refracted by another member and emitted. The plurality
of light emitting elements ED may be disposed in each sub-pixel SPXn, and the emission
area may be formed to include an area where the light emitting elements ED are disposed
and an area adjacent thereto.
[0066] Although it is shown in the drawing that the sub-pixels SPXn have the emission areas
EMA that are substantially identical in size, the present disclosure is not limited
thereto. In one or more embodiments, the emission areas EMA of the sub-pixels SPXn
may have different sizes according to a color or wavelength band of light emitted
from the light emitting element ED disposed in each sub-pixel.
[0067] Each sub-pixel SPXn may further include a sub-region SA disposed in the non-emission
area. The sub-region SA of the corresponding sub-pixel SPXn may be disposed on the
lower side of the emission area EMA, which is the other side in the first direction
DR1. The emission area EMA and the sub-region SA may be alternately arranged along
the first direction DR1, and the sub-region SA may be disposed between the emission
areas EMA of different sub-pixels SPXn that are spaced from each other in the first
direction DR1. For example, the emission area EMA and the sub-region SA may be alternately
arranged along the first direction DR1, and each of the emission area EMA and the
sub-region SA may be repeatedly arranged along the second direction DR2. However,
the present disclosure is not limited thereto, and the arrangement of the emission
areas EMA and the sub-regions SA in the plurality of pixels PX may be different from
that shown in FIG. 4.
[0068] Light may not be emitted from the sub-region SA because the light emitting element
ED is not disposed in the sub-region SA, but an electrode RME disposed in each sub-pixel
SPXn may be partially disposed in the sub-region SA. The electrodes RME disposed in
different sub-pixels SPXn may be disposed to be separated at a separation portion
ROP of the sub-region SA.
[0069] Each of the wires and the circuit elements of a circuit layer disposed on each pixel
PX and connected to the light emitting diode EL may be connected to the first to third
sub-pixels SPX1, SPX2, and SPX3. However, the wires and the circuit elements may not
be disposed to correspond to the area occupied by each sub-pixel SPXn or the emission
area EMA, and may be disposed regardless of the position of the emission area EMA
within one pixel PX.
[0070] The bank layer BNL may be disposed to be around (or to surround) the plurality of
sub-pixels SPXn, the emission area EMA, and the sub-region SA. The bank layer BNL
may be disposed at the boundary between the sub-pixels SPXn adjacent in the first
direction DR1 and the second direction DR2, and may also be disposed at the boundary
between the emission area EMA and the sub-region SA. The sub-pixels SPXn, the emission
area EMA, and the sub-region SA of the display device 10 may be the areas distinguished
by the arrangement of the bank layer BNL. The gaps between the plurality of sub-pixels
SPXn, the emission areas EMA, and the sub-regions SA may vary depending on the width
of the bank layer BNL.
[0071] The bank layer BNL may include portions extending in the first direction DR1 and
the second direction DR2 in a plan view to be arranged in a grid pattern over the
entire surface of the display area DPA. The bank layer BNL may be disposed along the
boundaries between the sub-pixels SPXn to delimit the neighboring sub-pixels SPXn.
The bank layer BNL may also be arranged to be around (or surround) the emission area
EMA and the sub-region SA disposed for each sub-pixel SPXn to delimit them from each
other.
[0072] FIG. 5 is a plan view illustrating a first insulating layer disposed in one pixel
of FIG. 4. FIG. 6 is a plan view illustrating a second insulating layer disposed in
one pixel of FIG. 4. FIG. 7 is a plan view illustrating a first connection electrode
layer disposed in one pixel of FIG. 4. FIG. 8 is a plan view illustrating a third
insulating layer disposed in one pixel of FIG. 4. FIG. 9 is a plan view illustrating
a second connection electrode layer disposed in one pixel of FIG. 4. FIG. 10 is a
cross-sectional view taken along the line E1-E1' of FIG. 4. FIG. 11 is a cross-sectional
view taken along the line E2-E2' of FIG. 4. FIG. 12 is a cross-sectional view taken
along the line E3-E3' of FIG. 4.
[0073] FIGS. 5 to 9 illustrate the planar arrangement of a plurality of insulating layers
PAS1, PAS2, and PAS3 that are different layers disposed in one pixel PX, and the connection
electrodes CNE1 and CNE2. FIG. 5 illustrates the planar arrangement of the first insulating
layer PAS1 disposed under the bank layer BNL, and FIGS. 6 and 8 illustrate the planar
arrangement of the second insulating layer PAS2 and the third insulating layer PAS3
disposed above the bank layer BNL. FIG. 10 illustrates a cross section across both
ends of the light emitting element ED and electrode contact holes CTD and CTS disposed
in the first sub-pixel SPX1, and FIG. 11 illustrates a cross section across both ends
of the light emitting element ED and contact portions CT1 and CT2 disposed in the
first sub-pixel SPXn. FIG. 12 illustrates a cross section across the bank layer BNL
between the sub-pixels SPXn in the second direction DR2.
[0074] Referring to FIGS. 4 and 5 to 12, the display device 10 may include a first substrate
SUB and a semiconductor layer, a plurality of conductive layers, and a plurality of
insulating layers disposed on the first substrate SUB. In addition, the display device
10 may include the plurality of electrodes RME (RME1 and RME2), the light emitting
element ED, and the connection electrodes CNE (CNE1 and CNE2). The semiconductor layer,
the conductive layers, and the insulating layers may each constitute a circuit layer
of the display device 10.
[0075] The first substrate SUB may be an insulating substrate. The first substrate SUB may
be made of an insulating material such as glass, quartz, or polymer resin. Further,
the first substrate SUB may be a rigid substrate, but may also be a flexible substrate
which can be bent, folded or rolled. The first substrate SUB may include the display
area DPA and the non-display area NDA around (or surrounding) the display area DPA,
and the display area DPA may include the emission area EMA and the sub-region SA that
is a part of the non-emission area.
[0076] A first conductive layer may be disposed on the first substrate SUB. The first conductive
layer includes a lower metal layer BML that is disposed to overlap a first active
layer ACT1 of a first transistor T1 in a thickness direction of the substrate SUB
(e.g., a third direction DR3). The lower metal layer BML may prevent light from being
incident on the first active layer ACT1 of the first transistor or may be electrically
connected to the first active layer ACT1 to perform a function of stabilizing the
electrical characteristics of the first transistor T1. However, the lower metal layer
BML may be omitted.
[0077] The buffer layer BL may be disposed on the lower metal layer BML and the first substrate
SUB. The buffer layer BL may be formed on the first substrate SUB to protect the transistors
of the pixel PX from moisture permeating through the first substrate SUB susceptible
to moisture permeation, and may perform a surface planarization function.
[0078] The semiconductor layer is disposed on the buffer layer BL. The semiconductor layer
may include the first active layer ACT1 of the first transistor T1 and a second active
layer ACT2 of the second transistor T2. The first active layer ACT1 and the second
active layer ACT2 may be disposed to partially overlap a first gate electrode G1 and
a second gate electrode G2 of a second conductive layer to be described later, respectively,
in the third direction DR3.
[0079] The semiconductor layer may include polycrystalline silicon, monocrystalline silicon,
oxide semiconductor, and the like. In one or more embodiments, the semiconductor layer
may include polycrystalline silicon. The oxide semiconductor may be an oxide semiconductor
containing indium (In). For example, the oxide semiconductor may be at least one of
indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium oxide (IGO), indium
zinc tin oxide (IZTO), indium gallium tin oxide (IGTO), indium gallium zinc oxide
(IGZO), or indium gallium zinc tin oxide (IGZTO).
[0080] Although it is illustrated in the drawing that one first transistor T1 is disposed
in the sub-pixel SPXn of the display device 10, but the disclosure is not limited
thereto, and the display device 10 may include a larger number of transistors.
[0081] A first gate insulating layer GI is disposed on the semiconductor layer in the display
area DPA. The first gate insulating layer GI may not be disposed in the pad area PDA.
The first gate insulating layer GI may serve as a gate insulating film of each of
the transistors T1 and T2. In the drawings, it is illustrated that the first gate
insulating layer GI is patterned together with the gate electrodes G1 and G2 of the
second conductive layer to be described later, and is partially disposed between the
second conductive layer and the active layers ACT1 and ACT2 of the semiconductor layer.
However, the present disclosure is not limited thereto. In one or more embodiments,
the first gate insulating layer GI may be entirely disposed on the buffer layer BL.
[0082] The second conductive layer is disposed on the first gate insulating layer GI. The
second conductive layer may include a first gate electrode G1 of the first transistor
T1 and a second gate electrode G2 of the second transistor T2. The first gate electrode
G1 may be disposed to overlap the channel region of the first active layer ACT1 in
a third direction DR3 that is a thickness direction, and the second gate electrode
G2 may be disposed to overlap the channel region of the second active layer ACT2 in
the third direction DR3 that is the thickness direction. In one or more embodiments,
the second conductive layer may further include one electrode of the storage capacitor.
[0083] A first interlayer insulating layer IL1 is disposed on the second conductive layer.
The first interlayer insulating layer IL1 may function as an insulating film between
the second conductive layer and other layers disposed thereon, and may protect the
second conductive layer.
[0084] A third conductive layer is disposed on the first interlayer insulating layer IL1.
The third conductive layer may include the first voltage line VL1 and the second voltage
line VL2, a first conductive pattern CDP1, a source electrode Si and a drain electrode
D1 of the transistor T1, and a source electrode S2 and a drain electrode D2 of the
transistor T2 that are disposed in the display area DPA. In one or more embodiments,
the third conductive layer may further include the other electrode of the storage
capacitor.
[0085] The first voltage line VL1 may be applied with a high potential voltage (or a first
power voltage) transmitted to a first electrode RME1, and the second voltage line
VL2 may be applied with a low potential voltage (or a second power voltage) transmitted
to a second electrode RME2. A part of the first voltage line VL1 may be in contact
with the first active layer ACT1 of the first transistor T1 through the contact hole
penetrating the first interlayer insulating layer IL1. The first voltage line VL1
may serve as a first drain electrode D1 of the first transistor T1. The second voltage
line VL2 may be directly connected to the second electrode RME2 to be described later.
[0086] The first conductive pattern CDP1 may be in contact with the first active layer ACT1
of the first transistor T1 through the contact hole penetrating the first interlayer
insulating layer IL1. The first conductive pattern CDP1 may be in contact with the
lower metal layer BML through another contact hole penetrating the first interlayer
insulating layer IL1 and the buffer layer BL. The first conductive pattern CDP1 may
serve as a first source electrode Si of the first transistor T1. Further, the first
conductive pattern CDP1 may be connected to the first electrode RME1 or the first
connection electrode CNE1 to be described later. The first transistor T1 may transmit
the first power voltage applied from the first voltage line VL1 to the first electrode
RME1 or the first connection electrode CNE1.
[0087] The second source electrode S2 and the second drain electrode D2 may be in contact
with the second active layer ACT2 of the second transistor T2 through the respective
contact holes penetrating the first interlayer insulating layer IL1. The second transistor
T2 may be any one of the switching transistors described with reference to FIG. 3.
The second transistor T2 may transfer the signal applied from the data line DTL of
FIG. 3 to the first transistor T1 or may transfer the signal applied from the initialization
voltage line VIL of FIG. 3 to the other electrode of the storage capacitor.
[0088] A first passivation layer PV1 is disposed on the third conductive layer and the first
interlayer insulating layer IL1. The first passivation layer PV1 may function as an
insulating layer between the third conductive layer and other layers and may protect
the third conductive layer.
[0089] The buffer layer BL, the first gate insulating layer GI, the first interlayer insulating
layer IL1, and the first passivation layer PV1 described above may be formed of a
plurality of inorganic layers stacked in an alternating manner. For example, the buffer
layer BL, the first gate insulating layer GI, the first interlayer insulating layer
IL1, and the first passivation layer PV1 may be formed as a double layer formed by
stacking, or a multilayer formed by alternately stacking, inorganic layers including
at least one of silicon oxide (SiO
x), silicon nitride (SiN
x), or silicon oxynitride (SiO
xN
y). However, the present disclosure is not limited thereto, and the buffer layer BL,
the first gate insulating layer GI, the first interlayer insulating layer IL1, and
the first passivation layer PV1 may be formed as a single inorganic layer containing
the above-described insulating material. Further, in one or more embodiments, the
first interlayer insulating layer IL1 may be made of an organic insulating material
such as polyimide (PI) or the like.
[0090] A via layer VIA is disposed on the third conductive layer in the display area DPA.
The via layer VIA may contain an organic insulating material, e.g., polyimide (PI),
and may compensate the stepped portion formed by the conductive layers disposed thereunder
to flatten the top surface. However, in one or more embodiments, the via layer VIA
may be omitted.
[0091] The display device 10 may include, as a display element layer disposed on the via
layer VIA, the bank patterns BP1 and BP2, the plurality of electrodes RME (RME1 and
RME2), the bank layer BNL, the plurality of light emitting elements ED, and the plurality
of connection electrodes CNE (CNE1 and CNE2). In addition, the display device 10 may
include the insulating layers PAS1, PAS2, and PAS3 disposed on the via layer VIA.
[0092] The plurality of bank patterns BP1 and BP2 may be disposed in the emission area EMA
of each sub-pixel SPXn. The bank patterns BP1 and BP2 may have a predetermined width
in the second direction DR2 and may have a shape extending in the first direction
DR1.
[0093] For example, the bank patterns BP1 and BP2 may include a first bank pattern BP1 and
a second bank pattern BP2 spaced from each other in the second direction DR2 in the
emission area EMA of each sub-pixel SPXn. The first bank pattern BP1 may be disposed
on the left side with respect to the center of the emission area EMA, which is one
side in the second direction DR2, and the second bank patterns BP2 may be disposed
on the right side with respect to the center of the emission area EMA, which is the
other side in the second direction DR2, while being spaced from the first bank pattern
BP1. The first bank pattern BP1 and the second bank pattern BP2 may be alternately
disposed along the second direction DR2 and may be disposed in an island-shaped pattern
in the display area DPA. The plurality of light emitting elements ED may be arranged
between the first bank pattern BP1 and the second bank pattern BP2.
[0094] The lengths of the first bank pattern BP1 and the second bank pattern BP2 in the
first direction DR1 may be the same, and may be smaller than the length of the emission
area EMA surrounded by the bank layer BNL in the first direction DR1. The first bank
pattern BP1 and the second bank pattern BP2 may be spaced from a portion of the bank
layer BNL extending in the second direction DR2. However, the present disclosure is
not limited thereto, and the bank patterns BP1 and BP2 may be integrated with the
bank layer BNL, or may partially overlap the portion of the bank layer BNL extending
in the second direction DR2. In this case, the lengths of the bank patterns BP1 and
BP2 in the first direction DR1 may be greater than or equal to the length of the emission
area EMA surrounded by the bank layer BNL in the first direction DR1.
[0095] The widths of the first bank pattern BP1 and the second bank pattern BP2 in the second
direction DR2 may be the same. However, the present disclosure is not limited thereto,
and they may have different widths. For example, one bank pattern may have a larger
width than the other bank pattern, and the bank pattern having a larger width may
be disposed across the emission areas EMA of different sub-pixels SPXn adjacent in
the second direction DR2. In this case, in the bank pattern disposed across the plurality
of emission areas EMA, a portion of the bank layer BNL extending in the first direction
DR1 may overlap the second bank pattern BP2 in the thickness direction (e.g., the
third direction DR3). Although it is illustrated in the drawing that two bank patterns
BP1 and BP2 having the same width are arranged for each sub-pixel SPXn, the present
disclosure is not limited thereto. The number and the shape of the bank patterns BP1
and BP2 may vary depending on the number or the arrangement structure of the electrodes
RME.
[0096] The plurality of bank patterns BP1 and BP2 may be disposed on the via layer VIA.
For example, each of the bank patterns BP1 and BP2 may be directly disposed on the
via layer VIA, and may have a structure in which at least a part thereof protrudes
with respect to the top surface of the via layer VIA. The protruding parts of the
bank patterns BP1 and BP2 may have an inclined surface or a curved surface with a
certain curvature, and the light emitted from the light emitting element ED may be
reflected by the electrode RME disposed on the bank patterns BP1 and BP2 and emitted
in the upward direction of the via layer VIA. Unlike the example illustrated in the
drawing, the bank patterns BP1 and BP2 may have a shape, e.g., a semicircular or semi-elliptical
shape, in which the outer surface is curved with a certain curvature in cross-sectional
view. The bank patterns BP1 and BP2 may include an organic insulating material such
as polyimide (PI), but is not limited thereto.
[0097] The plurality of electrodes RME (RME1 and RME2) have a shape extending in one direction
and are disposed for each sub-pixel SPXn. The plurality of electrodes RME1 and RME2
may extend in the first direction DR1 to be disposed across the emission area EMA
of the sub-pixel SPXn and the sub-region SA, and may be disposed to be spaced from
each other in the second direction DR2. The plurality of electrodes RME may be electrically
connected to the light emitting element ED to be described later, but the present
disclosure is not limited thereto. The electrodes RME may not be electrically connected
to the light emitting element ED.
[0098] The display device 10 may include the first electrode RME1 and the second electrode
RME2 arranged in each sub-pixel SPXn. The first electrode RME1 is located on the left
side with respect to the center of the emission area EMA, and the second electrode
RME2 is located on the right side with respect to the center of the emission area
EMA while being spaced from the first electrode RME1 in the second direction DR2.
A first electrode RME1 may be disposed on the first bank pattern BP1, and a second
electrode RME2 may be disposed on the second bank pattern BP2. The first electrode
RME1 and the second electrode RME2 may be partially arranged in the corresponding
sub-pixel SPXn and the sub-region SA over the bank layer BNL. The first electrode
RME1 and the second electrode RME2 of different sub-pixels SPXn may be separated with
respect to the separation portion ROP located in the sub-region SA of one sub-pixel
SPXn.
[0099] Although it is illustrated in the drawing that two electrodes RME have a shape extending
in the first direction DR1 for each sub-pixel SPXn, the present disclosure is not
limited thereto. For example, the display device 10 may have a shape in which a larger
number of electrodes RME are disposed in one sub-pixel SPXn or the electrodes RME
are partially bent and have different widths depending on positions.
[0100] The first electrode RME1 and the second electrode RME2 may be arranged at least on
the inclined surfaces of the bank patterns BP1 and BP2. In one or more embodiments,
the widths of the plurality of electrodes RME measured in the second direction DR2
may be smaller than the widths of the bank patterns BP1 and BP2 measured in the second
direction DR2, and the gap between the first electrode RME1 and the second electrode
RME2 in the second direction DR2 may be smaller than the gap between the bank patterns
BP1 and BP2. At least a part of the first electrode RME1 and the second electrode
RME2 may be directly arranged on the via layer VIA, so that the first electrode RME1
and the second electrode RME2 may be arranged at the same plane.
[0101] The light emitting element ED disposed between the bank patterns BP1 and BP2 may
emit light toward both ends, and the emitted light may be directed toward the electrodes
RME disposed on the bank patterns BP1 and BP2. The electrodes RME may have a structure
in which portions thereof disposed on the bank patterns BP1 and BP2 may reflect the
light emitted from the light emitting element ED. The first electrode RME1 and the
second electrode RME2 may be arranged to cover at least one side surfaces of the bank
patterns BP1 and BP2 and may reflect the light emitted from the light emitting element
ED.
[0102] The electrodes RME may be in direct contact with the third conductive layer through
the electrode contact holes CTD and CTS at the portions overlapping the bank layer
BNL between the emission area EMA and the sub-region SA. The first electrode contact
hole CTD may be formed in an area in which the bank layer BNL and the first electrode
RME1 overlap, and the second electrode contact hole CTS may be formed in an area in
which the bank layer BNL and the second electrode RME2 overlap. The first electrode
RME1 may be in contact with the first conductive pattern CDP1 through the first electrode
contact hole CTD penetrating the via layer VIA and the first passivation layer PV1.
The second electrode RME2 may be in contact with the second voltage line VL2 through
the second electrode contact hole CTS penetrating the via layer VIA and the first
passivation layer PV1. The first electrode RME1 may be electrically connected to the
first transistor T1 through the first conductive pattern CDP1, so that the first power
voltage may be applied to the first electrode RME1, and the second electrode RME2
may be electrically connected to the second voltage line VL2, so that the second power
voltage may be applied to the second electrode RME2. However, the present disclosure
is not limited thereto. In one or more embodiments, the electrodes RME1 and RME2 may
not be electrically connected to the voltage lines VL1 and VL2 of the third conductive
layer, respectively, and the connection electrode CNE to be described later may be
directly connected to the third conductive layer.
[0103] The plurality of electrodes RME may include a conductive material having high reflectivity.
For example, the electrodes RME may contain a metal such as silver (Ag), copper (Cu),
or aluminum (Al), or may contain an alloy including aluminum (Al), nickel (Ni), lanthanum
(La), or the like. Alternatively, the electrodes RME may have a structure in which
a metal layer such as titanium (Ti), molybdenum (Mo), and niobium (Nb) and the alloy
are stacked. In one or more embodiments, the electrodes RME may be formed as a double
layer or a multilayer formed by stacking at least one metal layer made of an alloy
including aluminum (Al) and titanium (Ti), molybdenum (Mo), and niobium (Nb).
[0104] The present disclosure is not limited thereto, and each electrode RME may further
include a transparent conductive material. For example, each electrode RME may include
a material such as ITO, IZO, and ITZO. In one or more embodiments, each of the electrodes
RME may have a structure in which at least one transparent conductive material and
at least one metal layer having high reflectivity are stacked, or may be formed as
one layer including them. For example, each electrode RME may have a stacked structure
of ITO/Ag/ITO, ITO/Ag/IZO, ITO/Ag/ITZO/IZO, or the like. The electrodes RME may be
electrically connected to the light emitting element ED, and may reflect some of the
lights emitted from the light emitting element ED in an upward direction of the first
substrate SUB.
[0105] The first insulating layer PAS1 may be disposed in the entire display area DPA and
may be disposed on the via layer VIA and the plurality of electrodes RME. The first
insulating layer PAS1 may include an insulating material to protect the plurality
of electrodes RME and insulate electrodes RME that are different from each other.
The first insulating layer PAS1 is disposed to cover the electrodes RME before the
bank layer BNL is formed, so that it is possible to prevent the electrodes RME from
being damaged in a process of forming the bank layer BNL. In addition, the first insulating
layer PAS1 may prevent the light emitting element ED disposed thereon from being damaged
by direct contact with other members.
[0106] In one or more embodiments, the first insulating layer PAS1 may have stepped portions
such that the top surface thereof is partially depressed between the electrodes RME
that are spaced in the second direction DR2. The light emitting element ED may be
disposed on the top surface of the first insulating layer PAS1, where the stepped
portions are formed, and thus a space may remain between the light emitting element
ED and the first insulating layer PAS1.
[0107] In accordance with one or more embodiments, the first insulating layer PAS1 may include
a plurality of separation openings OPR and the plurality of contact portions CT1 and
CT2. The first insulating layer PAS1 may include the plurality of separation openings
OPR formed to correspond to the separation portion ROP of the sub-region SA, and the
plurality of contact portions CT1 and CT2 formed at the portion in which the connection
electrode CNE to be described later and the electrode RME are connected. The first
insulating layer PAS1 may be disposed on the entire via layer VIA, and may partially
expose the layers disposed thereunder at the portions in which the plurality of separation
openings OPR or the contact portions CT1 and CT2 are formed.
[0108] At the separation openings OPR formed to correspond to the separation portions ROP
of the sub-regions SA, which are the openings formed in the first insulating layer
PAS1, the process of separating the electrodes RME disposed thereunder may be performed.
The plurality of electrodes RME may be disposed to extend in the first direction DR1,
and may be separated into the plurality of electrodes RME by etching portions exposed
by the separation openings OPR formed to correspond to the separation portions ROP
among the openings of the first insulating layer PAS1.
[0109] The contact portions CT1 and CT2 formed in the first insulating layer PAS1 may be
disposed to overlap different electrodes RME. For example, the contact portions CT1
and CT2 may be disposed in the sub-region SA, and may include the first contact portions
CT1 disposed to overlap the first electrode RME1 and the second contact portions CT2
disposed in the sub-region SA to overlap the second electrode RME2. The first contact
portions CT1 and the second contact portions CT2 may penetrate the first insulating
layer PAS1 to partially expose the top surface of the first electrode RME1 or the
second electrode RME2 thereunder. Each of the first contact portion CT1 and the second
contact portion CT2 may further penetrate some of the other insulating layers disposed
on the first insulating layer PAS1. The electrode RME exposed by each of the contact
portions CT1 and CT2 may be in contact with the connection electrode CNE.
[0110] The bank layer BNL may be disposed on the first insulating layer PAS1. The bank layer
BNL may include portions extending in the first direction DR1 and the second direction
DR2, and may be around (or may surround) the sub-pixels SPXn. The bank layer BNL may
surround and distinguish the emission area EMA and the sub-region SA of each sub-pixel
SPXn, and may surround the outermost part of the display area DPA and distinguish
the display area DPA and the non-display area NDA. The bank layer BNL is disposed
in the entire display area DPA to form a grid pattern, and the regions exposed by
the bank layer BNL in the display area DPA may be the emission area EMA and the sub-region
SA.
[0111] Similarly to the bank patterns BP1 and BP2, the bank layer BNL may have a certain
height. In one or more embodiments, the top surface of the bank layer BNL may be higher
than that of the bank patterns BP1 and BP2, and the thickness of the bank layer BNL
may be equal to or greater than that of the bank patterns BP1 and BP2. The bank layer
BNL may prevent ink from overflowing to adjacent sub-pixels SPXn in an inkjet printing
process during the manufacturing process of the display device 10. Similarly to the
bank patterns BP1 and BP2, the bank layer BNL may include an organic insulating material
such as polyimide.
[0112] The plurality of light emitting elements ED may be arranged in the emission area
EMA. The light emitting elements ED may be disposed between the bank patterns BP1
and BP2, and may be arranged to be spaced from each other in the first direction DR1.
In one or more embodiments, the plurality of light emitting elements ED may have a
shape extending in one direction, and both ends thereof may be disposed on different
electrodes RME. The length of the light emitting element ED may be greater than the
gap between the electrodes RME spaced from each other in the second direction DR2.
The extension direction of the light emitting elements ED may be substantially perpendicular
to the first direction DR1 in which the electrodes RME extend. However, the present
disclosure is not limited thereto, and the light emitting element ED may extend in
the second direction DR2 or in a direction oblique to the second direction DR2.
[0113] The plurality of light emitting elements ED may be arranged on the first insulating
layer PAS1. The light emitting element ED may have a shape extending in one direction,
and may be disposed such that one direction in which the light emitting element ED
extends is parallel to the top surface of the first substrate SUB. As will be described
later, the light emitting element ED may include a plurality of semiconductor layers
arranged along one direction in which the light emitting element ED extends, and the
plurality of semiconductor layers may be sequentially arranged along the direction
parallel to the top surface of the first substrate SUB. However, the present disclosure
is not limited thereto, and the plurality of semiconductor layers may be arranged
in the direction perpendicular to the first substrate SUB when the light emitting
element ED has another structure.
[0114] The light emitting elements ED disposed in each sub-pixel SPXn may emit light of
different wavelength bands depending on a material constituting the semiconductor
layer. However, the present disclosure is not limited thereto, and the light emitting
elements ED arranged in each sub-pixel SPXn may include the semiconductor layer of
the same material and emit light of the same color.
[0115] The light emitting elements ED may be electrically connected to the electrode RME
and the conductive layers below the via layer VIA while being in contact with the
connection electrodes CNE (CNE1 and CNE2), and may emit light of a specific wavelength
band by receiving an electrical signal.
[0116] The second insulating layer PAS2 may be disposed on the plurality of light emitting
elements ED, the first insulating layer PAS1, and the bank layer BNL. The second insulating
layer PAS2 may include a pattern portion disposed on the plurality of light emitting
elements ED while extending in the first direction DR1 between the bank patterns BP1
and BP2. The pattern portion is disposed to partially surround the outer surface (e.g.,
outer peripheral or circumferential surface) of the light emitting element ED, and
may not cover both sides or both ends of the light emitting element ED. The pattern
portion may form a linear or island-like pattern in each sub-pixel SPXn in a plan
view. The pattern portion of the second insulating layer PAS2 may protect the light
emitting element ED and fix the light emitting elements ED during a manufacturing
process of the display device 10. Further, the second insulating layer PAS2 may be
disposed to fill the space between the light emitting element ED and the first insulating
layer PAS1 thereunder. Further, a part of the second insulating layer PAS2 may be
disposed on the bank layer BNL and in the sub-regions SA.
[0117] In accordance with one or more embodiments, the second insulating layer PAS2 may
include a plurality of openings OP1, OP2, OP3, and OPR and the plurality of contact
portions CT1 and CT2. The second insulating layer PAS2 may include the plurality of
separation openings OPR formed to correspond to the separation portion ROP of the
sub-region SA, and the plurality of openings OP1 and OP2 disposed to partially overlap
the electrode RME to expose the first ends and the second ends of the light emitting
elements ED in the emission area EMA, and the openings OP3 disposed in an area other
than the emission area EMA. The second insulating layer PAS2 may include the plurality
of contact portions CT1 and CT2 formed at the portions in which the connection electrode
CNE and the electrode RME are connected. The second insulating layer PAS2 may be disposed
on the entire first insulating layer PAS1, and may partially expose the layers disposed
thereunder at the portions in which the plurality of openings are formed.
[0118] At the separation openings OPR formed to correspond to the separation portions ROP
of the sub-regions SA, which are the openings formed in the second insulating layer
PAS2, the process of separating the electrodes RME disposed thereunder may be performed.
Similarly to the first insulating layer PAS1, the second insulating layer PAS2 may
include the separation opening OPR exposing the top surface of the via layer VIA at
the separation portion ROP in which the process of separating the electrodes RME is
performed.
[0119] The second insulating layer PAS2 may include first openings OP1 partially overlapping
the first electrode RME1 and second openings OP2 partially overlapping the second
electrode RME2. The first openings OP1 and the second openings OP2 may be disposed
in the emission area EMA, and may expose both ends of the light emitting elements
ED. The first openings OP1 may expose or may not cover the first ends of the light
emitting elements ED that are disposed on the first electrodes RME1, and the second
openings OP2 may expose or may not cover the second ends of the light emitting elements
ED that are disposed on the second electrode RME2.
[0120] The plurality of first openings OP1 may be disposed to overlap one side of the first
electrode RME1 that faces (e.g., opposes) the second electrode RME2, and may have
a shape extending in the first direction DR1. The first opening OP1 may expose the
first ends of the light emitting elements ED.
[0121] Similarly, the second openings OP2 may be disposed to overlap one side of the second
electrode RME2 that faces (e.g., opposes) the first electrode RME1, and may have a
shape extending in the first direction DR1. The second opening OP2 may expose the
second ends of the light emitting elements ED. As will be described later, the first
openings OP1 may also penetrate the third insulating layer PAS3 to be described later.
The connection electrodes CNE may be in contact with both ends of the light emitting
elements ED exposed through the plurality of first openings OP1 and the plurality
of second openings OP2.
[0122] One first opening OP1 and one second opening OP2 may be disposed in one sub-pixel
SPXn. However, the present disclosure is not limited thereto. In some embodiments,
the plurality of first openings OP1 and the plurality of second openings OP2 may be
disposed in one sub-pixel SPXn.
[0123] According to one or more embodiments, the second insulating layer PAS2 may include
a third opening OP3 disposed in an area other than the emission area EMA. Unlike the
openings OP1 and OP2 that partially overlap the electrodes RME, the third opening
OP3 may be disposed not to overlap the electrodes RME. As an example, the third opening
OP3 may have a shape extending in the first direction DR1 and may be disposed to overlap
the bank layer BNL. The third opening OP3 may be disposed on a portion of the bank
layer BNL extending in the first direction DR1 and may be disposed between the emission
areas EMA of different sub-pixels SPXn. The third opening OP3 may be disposed to expose
a part of the top surface of the bank layer BNL, and the third insulating layer PAS3
to be described later may be directly disposed on the exposed top surface of the bank
layer BNL (e.g., see, FIG. 12).
[0124] The first opening OP1 and the second opening OP2 may be disposed in the emission
area EMA in which the light emitting elements ED are disposed, and may partially overlap
the light emitting elements ED. The first opening OP1 and the second opening OP2 may
be disposed to expose a part of the light emitting element ED so that the connection
electrodes CNE disposed on the second insulating layer PAS2 are able to be in contact
with the light emitting element ED. Because the light emitting elements ED are disposed
above the electrodes RME in the emission area EMA, the first and second openings OP1
and OP2 may be disposed to overlap the electrode RME and the light emitting element
ED. On the other hand, the third opening OP3 may be formed in a portion where the
light emitting elements ED are not disposed. The third opening OP3 may be disposed
not to overlap the light emitting elements ED and the electrodes RME.
[0125] As shown in FIG. 12, the display device 10 according to one or more embodiments may
further include electrodes BME, CSE1, and CSE2 overlapping the bank layer BNL among
the conductive layers under the via layer VIA. For example, the first conductive layer
may further include a lower electrode BME in addition to the lower metal layer BML.
The second conductive layer may further include one electrode CSE1 of the storage
capacitor, and the third conductive layer may further include the other electrode
CSE2 of the storage capacitor. The lower electrode BME and both electrodes CSE1 and
CSE2 of the storage capacitor may overlap, in the thickness direction (e.g., the third
direction DR3), the bank layer BNL disposed between the emission areas EMA of the
sub-pixels SPXn. The third opening OP3 of the second insulating layer PAS2 may overlap
the lower electrode BME and both electrodes CSE1 and CSE2 of the storage capacitor
in the thickness direction (e.g., the third direction DR3).
[0126] An alignment region in which the light emitting elements ED are disposed between
the electrodes RME may be formed in the emission area EMA of each sub-pixel SPXn.
During the manufacturing process of the display device 10, the light emitting elements
ED may be sprayed to the emission area EMA to be disposed in the alignment region
above the electrodes RME. However, some of the plurality of light emitting elements
ED may also be sprayed to an area other than the emission area EMA, i.e., an area
where the light emitting elements ED are not supposed to be aligned. For example,
some of the light emitting elements ED sprayed to the emission area EMA may also be
seated on the bank layer BNL, and these light emitting elements ED may remain as foreign
substances in a subsequent process. According to one or more embodiments, the second
insulating layer PAS2 may include the third opening OP3 that exposes a region other
than the alignment region between the electrodes RME so that the light emitting elements
ED remaining as foreign substances can be removed.
[0127] When the light emitting elements ED are disposed above the electrodes RME, a process
of forming the second insulating layer PAS2 may be performed. After the second insulating
layer PAS2 is entirely formed on the first insulating layer PAS1, a part thereof may
be patterned to form the openings OP1, OP2, OP3, and OPR. The second insulating layer
PAS2 may be disposed in the alignment region of the emission area EMA to fix the light
emitting elements ED disposed above the electrodes RME. The second insulating layer
PAS2 may be formed not to cover the light emitting elements ED disposed in a region
other than the alignment region, so that the light emitting elements ED may be removed
in a subsequent process.
[0128] The first opening OP1 and the second opening OP2 of the second insulating layer PAS2
may be disposed to expose both ends of the light emitting elements ED while penetrating
the second insulating layer PAS2, and a patterned portion therebetween may fix the
light emitting elements ED disposed in the alignment region. On the other hand, the
third opening OP3 of the second insulating layer PAS2 may be formed in a region where
the light emitting elements ED are not supposed to be aligned and may not cover the
misaligned light emitting elements ED. After the second insulating layer PAS2 is formed,
the light emitting elements ED seated in a region other than the alignment region
may be removed, and the misaligned light emitting elements ED in each pixel PX may
be prevented from remaining defective. For example, as the third opening OP3 of the
second insulating layer PAS2 is disposed to overlap the bank layer BNL, the misaligned
light emitting elements ED may not remain on the lower electrode BME under the bank
layer BNL and both electrodes CSE1 and CSE2 of the storage capacitor. Accordingly,
in a defect inspection performed after the manufacturing process of the display device
10 is completed, there is an advantage in that it is easy to inspect foreign substances
or dark spots formed on both electrodes CSE1 and CSE2 of the storage capacitor.
[0129] The second insulating layer PAS2 may include the first contact portions CT1 disposed
in the sub-region SA to overlap the first electrode RME1, and the second contact portions
CT2 disposed in the sub-region SA to overlap the second electrode RME2. The contact
portions CT1 and CT2 may penetrate the second insulating layer PAS2 in addition to
the first insulating layer PAS1. The plurality of first contact portions CT1 and the
plurality of second contact portions CT2 may partially expose the top surface of the
first electrode RME1 or the second electrode RME2 disposed thereunder.
[0130] The plurality of connection electrodes CNE (CNE1 and CNE2) may be disposed on the
plurality of electrodes RME and the bank patterns BP1 and BP2. The plurality of connection
electrodes CNE may have a shape extending in one direction, and may be disposed to
be spaced from each other. Each of the connection electrodes CNE may be in contact
with the light emitting element ED, and may be electrically connected to the third
conductive layer.
[0131] The plurality of connection electrodes CNE may include the first connection electrode
CNE1 and the second connection electrode CNE2 disposed in each sub-pixel SPXn. The
first connection electrode CNE1 may have a shape extending in the first direction
DR1 and may be disposed on the first electrode RME1 or the first bank pattern BP1.
The first connection electrode CNE1 may partially overlap the first electrode RME1
and may be disposed across the emission area EMA and the sub-region SA over the bank
layer BNL. The second connection electrode CNE2 may have a shape extending in the
first direction DR1 and may be disposed on the second electrode RME2 or the second
bank pattern BP2. The second connection electrode CNE2 may partially overlap the second
electrode RME2 and may be disposed across the emission area EMA and the sub-region
SA over the bank layer BNL. Each of the first connection electrode CNE1 and the second
connection electrode CNE2 may be in contact with the light emitting elements ED, and
may be electrically connected to the electrodes RME or the conductive layer disposed
thereunder.
[0132] For example, each of the first connection electrode CNE1 and the second connection
electrode CNE2 may be disposed on the second insulating layer PAS2 and may be in contact
with the light emitting elements ED. The first connection electrode CNE1 may partially
overlap the first electrode RME1 and may be in contact with one ends of the light
emitting elements ED. The second connection electrode CNE2 may partially overlap the
second electrode RME2 and may be in contact with the other ends of the light emitting
elements ED. The plurality of connection electrodes CNE are disposed across the emission
area EMA and the sub-region SA. The connection electrodes CNE may be in contact with
the light emitting elements ED at portions disposed in the emission area EMA, and
may be electrically connected to the third conductive layer at portions disposed in
the sub-region SA.
[0133] The first connection electrode CNE1 may be disposed to partially overlap the first
opening OP1 of the second insulating layer PAS2. The second connection electrode CNE2
may be disposed to partially overlap the second opening OP2 of the second insulating
layer PAS2. The first connection electrode CNE1 may be in contact with the first ends
of the light emitting elements ED exposed through the first opening OP1, and the second
connection electrode CNE2 may be in contact with the second ends of the light emitting
elements ED exposed through the second opening OP2.
[0134] In accordance with one or more embodiments, in the display device 10, the connection
electrodes CNE may be in contact with the electrode RME through the contact portions
CT1 and CT2 disposed in the sub-region SA. The first connection electrode CNE1 may
be in contract with the first electrode RME1 through the first contact portion CT1
penetrating the first insulating layer PAS1, the second insulating layer PAS2, and
the third insulating layer PAS3 in the sub-region SA. The second connection electrode
CNE2 may be in contact with the second electrode RME2 through the second contact portion
CT2 penetrating the first insulating layer PAS1 and the second insulating layer PAS2
in the sub-region SA. Each of the connection electrodes CNE may be electrically connected
to the third conductive layer through each of electrodes RME. The first connection
electrode CNE1 may be electrically connected to the first transistor T1, so that the
first power voltage may be applied to the first connection electrode CNE1, and the
second connection electrode CNE2 may be electrically connected to the second voltage
line VL2, so that the second power voltage may be applied to the second connection
electrode CNE2. Each connection electrode CNE may be in contact the light emitting
element ED in the emission area EMA to transmit the power voltage to the light emitting
element ED.
[0135] However, the present disclosure is not limited thereto. In one or more embodiments,
the plurality of connection electrodes CNE may be in direct contact with the third
conductive layer, and may be electrically connected to the third conductive layer
through patterns other than the electrodes RME.
[0136] The connection electrodes CNE may include a conductive material. For example, they
may include ITO, IZO, ITZO, aluminum (Al), or the like. As an example, the connection
electrodes CNE may include a transparent conductive material, and light emitted from
the light emitting element ED may pass through the connection electrodes CNE to be
emitted.
[0137] The third insulating layer PAS3 is disposed on the second connection electrode CNE2
and the second insulating layer PAS2 of the first connection electrode layer. The
third insulating layer PAS3 may be disposed on the entire second insulating layer
PAS2 to cover the second connection electrode CNE2, and the first connection electrode
CNE1 of the second connection electrode layer may be disposed on the third insulating
layer PAS3. The third insulating layer PAS3 may insulate the first connection electrode
CNE1 and the second connection electrode CNE2 to prevent direct contact therebetween.
[0138] According to one or more embodiments, the third insulating layer PAS3 may include
the first openings OP1 and the first contact portions CT1. The third insulating layer
PAS3 may include the plurality of first openings OP1 disposed to partially overlap
the electrode RME to expose the first ends of the light emitting elements ED, and
the plurality of first contact portions CT1 formed in a region where the first connection
electrode CNE1 and the first electrode RME1 are connected. The first opening OP1 may
penetrate the second insulating layer PAS2 and the third insulating layer PAS3. The
third insulating layer PAS3 may be disposed on the entire second insulating layer
PAS2 and may partially expose the layers disposed thereunder at the portions in which
the plurality of first openings OP1 are formed. The first connection electrode CNE1
may be disposed to partially overlap the first opening OP1 of the third insulating
layer PAS3.
[0139] The first openings OP1 of the third insulating layer PAS3 may partially overlap the
first electrode RME1 in the emission area EMA, and may expose or may not cover the
first ends of the light emitting elements ED that are disposed on the first electrode
RME1. The first openings OP1 may be disposed to overlap one side of the first electrode
RME1 that faces (e.g., opposes) the second electrode RME2, and may have a shape extending
in the first direction DR1.
[0140] The third insulating layer PAS3 may be disposed on the second opening OP2 and the
third opening OP3 of the second insulating layer PAS2. Because the second connection
electrode CNE2 is disposed in the second opening OP2 of the second insulating layer
PAS2, the third insulating layer PAS3 may be disposed to cover the second connection
electrode CNE2. A part of the top surface of the bank layer BNL may be exposed through
the third opening OP3 of the second insulating layer PAS2, and the third insulating
layer PAS3 may be in direct contact with a part of the top surface of the bank layer
BNL.
[0141] The third insulating layer PAS3 may include the first contact portions CT1 disposed
in the sub-region SA to overlap the first electrode RME1. The plurality of first contact
portions CT1 may penetrate the third insulating layer PAS3 in addition to the first
insulating layer PAS1 and the second insulating layer PAS2. The plurality of first
contact portions CT1 may partially expose the top surface of the first electrode RME1
disposed thereunder.
[0142] In one or more embodiments another insulating layer may be further disposed on the
third insulating layer PAS3 and the first connection electrode CNE1. The insulating
layer may function to protect the members disposed on the first substrate SUB against
the external environment.
[0143] Each of the first insulating layer PAS1, the second insulating layer PAS2 and the
third insulating layer PAS3 described above may include an inorganic insulating material
or an organic insulating material. For example, each of the first insulating layer
PAS1, the second insulating layer PAS2, and the third insulating layer PAS3 may include
an inorganic insulating material. Alternatively, the first insulating layer PAS1 and
the third insulating layer PAS3 may include an inorganic insulating material, whereas
the second insulating layer PAS2 may include an organic insulating material. Each
or at least one of the first insulating layer PAS1, the second insulating layer PAS2,
and the third insulating layer PAS3 may have a structure in which a plurality of insulating
layers are stacked alternately or repeatedly. In one or more embodiments, the first
insulating layer PAS1, the second insulating layer PAS2, and the third insulating
layer PAS3 may be any one of silicon oxide (SiO
x), silicon nitride (SiN
x), and silicon oxynitride (SiO
xN
y). The first insulating layer PAS1, the second insulating layer PAS2, and the third
insulating layer PAS3 may be made of the same material or different materials. Alternatively,
some of them may be made of the same material and some of them may be made of different
materials.
[0144] FIG. 13 is a schematic cutaway view of a light emitting element according to one
or more embodiments.
[0145] Referring to FIG. 13, the light emitting element ED may be a light emitting diode.
For example, the light emitting element ED may be an inorganic light emitting diode
that has a nanometer or micrometer size, and is made of an inorganic material. The
light emitting element ED may be aligned between two electrodes having polarity when
an electric field is formed in a specific direction between two electrodes facing
each other.
[0146] The light emitting element ED according to one or more embodiments may have a shape
elongated in one direction. The light emitting element ED may have a shape of a cylinder,
a rod, a wire, a tube, or the like. However, the shape of the light emitting element
ED is not limited thereto, and the light emitting element ED may have a polygonal
prism shape such as a regular cube, a rectangular parallelepiped and a hexagonal prism,
or may have various shapes such as a shape elongated in one direction and having an
outer surface partially inclined.
[0147] The light emitting element ED may include a semiconductor layer doped with any conductivity
type (e.g., p-type or n-type) dopant. The semiconductor layer may emit light of a
specific wavelength band by receiving an electrical signal applied from an external
power source. The light emitting element ED may include a first semiconductor layer
31, a second semiconductor layer 32, a light emitting layer 36, an electrode layer
37 and an insulating film 38.
[0148] The first semiconductor layer 31 may be an n-type semiconductor. The first semiconductor
layer 31 may include a semiconductor material having a chemical formula of AlxGayIn1-x-yN
(0≤x≤1, 0≤y≤1, 0≤x+y≤1). For example, the first semiconductor layer 31 may be any
one or more of AlGaInN, GaN, AlGaN, InGaN, AlN and InN doped with an n-type dopant.
The n-type dopant doped into the first semiconductor layer 31 may be Si, Ge, Sn, or
the like.
[0149] The second semiconductor layer 32 is disposed on the first semiconductor layer 31
with the light emitting layer 36 therebetween. The second semiconductor layer 32 may
be a p-type semiconductor, and the second semiconductor layer 32 may include a semiconductor
material having a chemical formula of AlxGayIn1-x-yN (0≤x≤1, 0≤y≤1, 0≤x+y≤1). For
example, the second semiconductor layer 32 may be any one or more of AlGaInN, GaN,
AlGaN, InGaN, AlN and InN doped with a p-type dopant. The p-type dopant doped into
the second semiconductor layer 32 may be Mg, Zn, Ca, Ba, or the like.
[0150] Although it is illustrated in the drawing that the first semiconductor layer 31 and
the second semiconductor layer 32 are configured as one layer, the present disclosure
is not limited thereto. Depending on the material of the light emitting layer 36,
the first semiconductor layer 31 and the second semiconductor layer 32 may further
include a larger number of layers, such as a cladding layer or a tensile strain barrier
reducing (TSBR) layer. For example, the light emitting element ED may further include
another semiconductor layer disposed between the first semiconductor layer 31 and
the light emitting layer 36 or between the second semiconductor layer 32 and the light
emitting layer 36. A semiconductor layer disposed between the first semiconductor
layer 31 and the light emitting layer 36 may be any one or more of AlGaInN, GaN, AlGaN,
InGaN, AlN, InN and SLs doped with an n-type dopant, and a semiconductor layer disposed
between the second semiconductor layer 32 and the light emitting layer 36 may be any
one or more of AlGaInN, GaN, AlGaN, InGaN, AlN, and InN doped with a p-type dopant.
[0151] The light emitting layer 36 is disposed between the first semiconductor layer 31
and the second semiconductor layer 32. The light emitting layer 36 may include a material
having a single or multiple quantum well structure. When the light emitting layer
36 includes a material having a multiple quantum well structure, a plurality of quantum
layers and well layers may be stacked alternately. The light emitting layer 36 may
emit light by coupling of electron-hole pairs according to an electrical signal applied
through the first semiconductor layer 31 and the second semiconductor layer 32. The
light emitting layer 36 may include a material such as AlGaN, AlGaInN, or InGaN. For
example, when the light emitting layer 36 has a multiple quantum well structure in
which quantum layers and well layers are alternately stacked, the quantum layer may
include a material such as AlGaN or AlGaInN, and the well layer may include a material
such as GaN or AlInN.
[0152] The light emitting layer 36 may have a structure in which semiconductor materials
having large band gap energy and semiconductor materials having small band gap energy
are alternately stacked, and may include other Group III to Group V semiconductor
materials according to the wavelength band of the emitted light. The light emitted
by the light emitting layer 36 is not limited to the light of the blue wavelength
band, but the light emitting layer 36 may also emit light of a red or green wavelength
band in some cases.
[0153] The electrode layer 37 may be an ohmic connection electrode. However, the present
disclosure is not limited thereto, and it may be a Schottky connection electrode.
The light emitting element ED may include at least one electrode layer 37. The light
emitting element ED may include one or more electrode layers 37, but the present disclosure
is not limited thereto, and the electrode layer 37 may be omitted.
[0154] In the display device 10, when the light emitting element ED is electrically connected
to an electrode or a connection electrode, the electrode layer 37 may reduce the resistance
between the light emitting element ED and the electrode or connection electrode. The
electrode layer 37 may include a conductive metal. For example, the electrode layer
37 may include at least one of aluminum (Al), titanium (Ti), indium (In), gold (Au),
silver (Ag), ITO, IZO, or ITZO.
[0155] The insulating film 38 is arranged to be around (or to surround) the outer surfaces
(e.g., the outer peripheral or circumferential surfaces) of the plurality of semiconductor
layers and electrode layers described above. For example, the insulating film 38 may
be disposed to be around (or to surround) at least the outer surface (e.g., the outer
peripheral or circumferential surface) of the light emitting layer 36, and may be
formed to expose both ends of the light emitting element ED in the longitudinal direction.
Further, in cross-sectional view, the insulating film 38 may have a top surface, which
is rounded in a region adjacent to at least one end of the light emitting element
ED.
[0156] The insulating film 38 may include at least one of materials having insulating properties,
for example, silicon oxide (SiO
x), silicon nitride (SiN
x), silicon oxynitride (SiO
xN
y), aluminum nitride (AlN
x), aluminum oxide (AlO
x), zirconium oxide (ZrO
x), hafnium oxide (HfO
x), or titanium oxide (TiO
x). It is illustrated in the drawing that the insulating film 38 is formed as a single
layer, but the present disclosure is not limited thereto. In one or more embodiments,
the insulating film 38 may be formed in a multilayer structure having a plurality
of layers stacked therein.
[0157] The insulating film 38 may perform a function of protecting the semiconductor layers
and the electrode layer of the light emitting element ED. The insulating film 38 may
prevent an electrical short circuit that is likely to occur at the light emitting
layer 36 when an electrode to which an electrical signal is transmitted is in direct
contact with the light emitting element ED. In addition, the insulating film 38 may
prevent a decrease in luminous efficiency of the light emitting element ED.
[0158] Further, the insulating film 38 may have an outer surface (e.g., an outer peripheral
or circumferential surface) that is surface-treated. The light emitting elements ED
may be aligned in such a way of spraying the ink in which the light emitting elements
ED are dispersed on the electrodes. Here, the surface of the insulating film 38 may
be treated to have a hydrophobic property or hydrophilic property in order to keep
the light emitting elements ED in the dispersed state without being aggregated with
other adjacent light emitting elements ED in the ink.
[0159] Hereinafter, other embodiments of the display device 10 will be described with reference
to other drawings.
[0160] FIG. 14 is a plan view illustrating a sub-pixel of a display device according to
one or more embodiments.
[0161] FIG. 14 illustrates planar arrangement of electrodes RME (RME1, RME2, RME3, and RME4),
bank patterns BP1, BP2, and BP3, the bank layer BNL, the plurality of light emitting
elements ED, connection electrodes CNE (CNE1, CNE2, CNE3, CNE4, and CNE5) disposed
in one sub-pixel PXn of the display device 10.
[0162] Referring to FIG. 14, the display device 10 according to one or more embodiments
may include a larger number of electrodes RME (RME1, RME2, RME3, and RME4), a larger
number of bank patterns BP1, BP2, and BP3, a larger number of light emitting elements
ED (ED1, ED2, ED3, and ED4), and a larger number of connection electrodes CNE (CNE1,
CNE2, CNE3, CNE4, and CNE5). The display device 10 according to the described embodiment
is different from the embodiment of FIG. 4 in that a larger number of electrodes and
a larger number of light emitting elements are included in each sub-pixel SPXn. In
the following description, redundant description will be omitted while focusing on
differences.
[0163] FIG. 15 is a plan view illustrating a first insulating layer disposed in one sub-pixel
of FIG. 14. FIG. 16 is a plan view illustrating a second insulating layer disposed
in one sub-pixel of FIG. 14. FIG. 17 is a plan view illustrating a first connection
electrode layer disposed in one sub-pixel of FIG. 14. FIG. 18 is a plan view illustrating
a third insulating layer disposed in one sub-pixel of FIG. 14. FIG. 19 is a plan view
illustrating a second connection electrode layer disposed in one sub-pixel of FIG.
14. FIG. 20 is a cross-sectional view taken along the line E4-E4' in FIG. 14. FIG.
21 is a cross-sectional view taken along the line E5-E5' of FIG. 14.
[0164] FIGS. 15 to 19 illustrate the planar arrangement of a plurality of insulating layers
PAS1, PAS2, and PAS3 that are different layers disposed in one pixel PX, and the connection
electrodes CNE1, CNE2, CNE3, CNE4, and CNE5. FIG. 15 illustrates the planar arrangement
of the first insulating layer PAS1 disposed under the bank layer BNL, and FIGS. 16
and 18 illustrate the planar arrangement of the second insulating layer PAS2 and the
third insulating layer PAS3 disposed above the bank layer BNL. FIG. 20 illustrates
a cross section across both ends of the first light emitting element ED1 and the second
light emitting element ED2 disposed in one sub-pixel SPXn, and FIG. 21 illustrates
a cross section across a plurality of contact portions CT1, CT2, CT3, and CT4 disposed
in one sub-pixel SPXn.
[0165] Referring to FIGS. 15 to 21 in conjunction with FIG. 14, the bank patterns BP1, BP2,
and BP3 may further include a third bank pattern BP3 disposed between the first bank
pattern BP1 and the second bank pattern BP2. The first bank pattern BP1 may be located
on the left side with respect to the center of the emission area EMA, the second bank
pattern BP2 may be located on the right side with respect to the center of the emission
area EMA, and the third bank pattern BP3 may be located at the center of the emission
area EMA. The width of the third bank pattern BP3 measured in the second direction
DR2 may be greater than those of the first bank pattern BP1 and the second bank pattern
BP2 measured in the second direction DR2. The gap between the bank patterns BP1, BP2,
and BP3 in the second direction DR2 may be greater than the gap between the electrodes
RME. The first bank pattern BP1 may be disposed to partially overlap the first electrode
RME1, and the second bank pattern BP2 may be disposed to partially overlap the fourth
electrode RME4. The third bank pattern BP3 may be disposed to partially overlap the
second electrode RME2 and the third electrode RME3. At least parts of the electrodes
RME may be arranged without overlapping the bank patterns BP1, BP2, and BP3.
[0166] The plurality of electrodes RME arranged for each sub-pixel SPXn may further include
a third electrode RME3 and a fourth electrode RME4 in addition to a first electrode
RME1 and a second electrode RME2.
[0167] The third electrode RME3 may be disposed between the first electrode RME1 and the
second electrode RME2, and the fourth electrode RME4 may be spaced from the third
electrode RME3 in the second direction DR2 with the second electrode RME2 interposed
therebetween. The plurality of electrodes RME may be sequentially arranged in the
order of the first electrode RME1, the third electrode RME3, the second electrode
RME2, and the fourth electrode RME4 from the left side to the right side of the sub-pixel
SPXn. The electrodes RME may face (or oppose) and may be spaced from each other in
the second direction DR2. The plurality of electrodes RME may be spaced from the electrodes
RME of another sub-pixel SPXn adjacent in the first direction DR1 at the separation
portion ROP of the sub-region SA.
[0168] Among the plurality of electrodes RME, the first electrode RME1 and the second electrode
RME2 may be in contact with the first conductive pattern CDP1 and the second voltage
line VL2 disposed thereunder through the electrode contact holes CTD and CTS disposed
under the bank layer BNL, respectively, whereas the third electrode RME3 and the fourth
electrode RME4 may not be in contact with them.
[0169] The first insulating layer PAS1 may be disposed in a structure similar to that in
the above-described embodiments. The first insulating layer PAS1 may be disposed in
the entire display area DPA and may cover the plurality of electrodes RME and the
bank patterns BP1, BP2, and BP3.
[0170] In accordance with one or more embodiments, the first insulating layer PAS1 may include
the plurality of separation openings OPR and the plurality of contact portions CT1,
CT2, CT3, and CT4. The separation opening OPR disposed to correspond to the separation
portion ROP, which is the opening of the first insulating layer PAS1, is the same
as that described above with reference to FIG. 5. The plurality of contact portions
CT1, CT2, CT3, and CT4 formed in the first insulating layer PAS1 may be disposed to
overlap different electrodes RME. For example, the plurality of contact portions CT1,
CT2, CT3, and CT4 may be disposed in the sub-region SA, and may include the first
contact portion CT1 disposed to overlap the first electrode RME1, the second contact
portion CT2 disposed to overlap the second electrode RME2, the third contact portion
CT3 disposed to overlap the third electrode RME3, and the fourth contact portion CT4
disposed to overlap the fourth electrode RME4. The plurality of contact portions CT1,
CT2, CT3, and CT4 may penetrate the first insulating layer PAS1 to partially expose
the top surfaces of the electrodes RME1, RME2, RME3, and RME4 disposed thereunder,
respectively. Each of the contact portions CT1, CT2, CT3, and CT4 may further penetrate
some of the other insulating layers disposed on the first insulating layer PAS1.
[0171] The plurality of light emitting elements ED may be arranged between the bank patterns
BP1, BP2, and BP3 or on different electrodes RME. Some of the light emitting elements
ED may be arranged between the first bank pattern BP1 and the third bank pattern BP3,
and some other light emitting elements ED may be arranged between the third bank pattern
BP3 and the second bank pattern BP2. In accordance with one or more embodiments, the
light emitting element ED may include a first light emitting element ED1 and a third
light emitting element ED3 arranged between the first bank pattern BP1 and the third
bank pattern BP3, and a second light emitting element ED2 and a fourth light emitting
element ED4 arranged between the third bank pattern BP3 and the second bank pattern
BP2. Each of the first light emitting element ED1 and the third light emitting element
ED3 may be disposed above the first electrode RME1 and the third electrode RME3, and
each of the second light emitting element ED2 and the fourth light emitting element
ED4 may be disposed above the second electrode RME2 and the fourth electrode RME4.
The first light emitting element ED1 and the second light emitting element ED2 may
be arranged adjacent to the lower side of the emission area EMA of the corresponding
sub-pixel SPXn or adjacent to the sub-region SA, and the third light emitting element
ED3 and the fourth light emitting element ED4 may be arranged adjacent to the upper
side of the emission area EMA of the corresponding sub-pixel SPXn.
[0172] However, the light emitting elements ED may not be classified according to the arrangement
position in the emission area EMA, but may be classified according to a connection
relationship with the connection electrode CNE, which will be described later. Both
ends of each light emitting element ED may be in contact with different connection
electrodes CNE according to an arrangement method of the connection electrodes CNE.
The light emitting elements ED may be classified into different types of light emitting
elements ED according to the type of the connection electrode CNE in contact therewith.
[0173] The second insulating layer PAS2 may be disposed in a structure similar to that of
the above-described embodiment. The second insulating layer PAS2 may be disposed on
the plurality of light emitting elements ED, the first insulating layer PAS1, and
the bank layer BNL.
[0174] In accordance with one or more embodiments, the second insulating layer PAS2 may
include a plurality of openings OP1, OP2, OP3, OP4, OP5, OP6, and OPR and the plurality
of contact portions CT1, CT2, CT3, and CT4. The separation opening OPR formed to correspond
to the separation portion ROP of the sub-region SA, which is the opening of the second
insulating layer PAS2, is the same as that described above with reference to FIG.
6.
[0175] The second insulating layer PAS2 may include, in addition to the plurality of first
openings OP1 partially overlapping the first electrode RME1 and the plurality of second
openings OP2 partially overlapping the second electrode RME2, a plurality of fifth
openings OP5 partially overlapping the third electrode RME3 and a plurality of sixth
openings OP6 partially overlapping the fourth electrode RME4.
[0176] The first openings OP1 and the second openings OP2 may be disposed in the emission
area EMA, and may expose both ends of the light emitting elements ED. The first openings
OP1 may expose or may not cover the first ends of the light emitting elements ED that
are disposed on the first electrode RME1, and the second openings OP2 may expose or
may not cover the second ends of the light emitting elements ED that are disposed
on the second electrode RME2.
[0177] The plurality of first openings OP1 may be disposed to overlap one side of the first
electrode RME1 that faces (e.g., opposes) the third electrode RME3, and the plurality
of first openings OP1 disposed in one sub-pixel SPXn may be disposed to be spaced
from each other in the first direction DR1 in the emission area EMA of the corresponding
sub-pixel SPXn. One first opening OP1 may expose the first ends of the first light
emitting elements ED1, and another first opening OP1 may expose the first ends of
the third light emitting elements ED3.
[0178] The plurality of second openings OP2 may be disposed to overlap one side of the second
electrode RME2 that faces (e.g., opposes) the fourth electrode RME4, and the plurality
of second openings OP2 disposed in one sub-pixel SPXn may be disposed to be spaced
from each other in the first direction DR1 in the emission area EMA of the corresponding
sub-pixel SPXn. One second opening OP2 may expose the first ends of the second light
emitting elements ED2, and another second opening OP2 may expose the first ends of
the fourth light emitting elements ED4.
[0179] Similarly, the plurality of fifth openings OP5 may be disposed to overlap one side
of the third electrode RME3 that faces (e.g., opposes) the first electrode RME1, and
the plurality of fifth openings OP5 disposed in one sub-pixel SPXn may be disposed
to be spaced from each other in the first direction DR1 in the emission area EMA of
the corresponding sub-pixel SPXn. One fifth opening OP5 may expose the second ends
of the first light emitting elements ED1, and another fifth opening OP5 may expose
the second ends of the third light emitting elements ED3.
[0180] The plurality of sixth openings OP6 may be disposed to overlap one side of the fourth
electrode RME4 that faces (e.g., opposes) the second electrode RME2, and the plurality
of sixth openings OP6 disposed in one sub-pixel SPXn may be disposed to be spaced
from each other in the first direction DR1 in the emission area EMA of the corresponding
sub-pixel SPXn. One sixth opening OP6 may expose the second ends of the second light
emitting elements ED2, and another sixth opening OP6 may expose the second ends of
the fourth light emitting elements ED4.
[0181] According to one or more embodiments, the second insulating layer PAS2 may include
the third opening OP3 disposed in an area other than the emission area EMA, and a
fourth opening OP4 disposed in the emission area EMA without overlapping the light
emitting elements ED.
[0182] Unlike the openings OP1, OP2, OP5, and OP6 that partially overlap the electrodes
RME, the third opening OP3 may be disposed not to overlap the electrodes RME. As an
example, the third opening OP3 may have a shape extending in the first direction DR1
and may be disposed to overlap the bank layer BNL. The third opening OP3 may be disposed
on a portion of the bank layer BNL extending in the first direction DR1 and may be
disposed between the emission areas EMA of different sub-pixels SPXn adjacent in the
second direction DR2. The third opening OP3 may be disposed to expose a part of the
top surface of the bank layer BNL. The third opening OP3 may be formed in a portion
where the light emitting elements ED are not disposed. The third opening OP3 may be
disposed not to overlap the light emitting elements ED and the electrodes RME.
[0183] The fourth opening OP4 may be disposed to overlap the electrodes RME in the emission
area EMA, and unlike the openings OP1, OP2, OP5, and OP6 that partially overlap the
light emitting elements ED, may be disposed not to overlap the light emitting elements
ED. As an example, the fourth opening OP4 may have a shape extending in the first
direction DR1 and may be disposed on the third bank pattern BP3. The fourth opening
OP4 may be disposed to partially overlap the second electrode RME2 and the third electrode
RME3 while overlapping the third bank pattern BP3. The fourth opening OP4 may be disposed
between the fifth openings OP5 and the second openings OP2 so as to be spaced from
them in the second direction DR2. The fourth opening OP4 may be disposed to overlap
a region between the second electrode RME2 and the third electrode RME3. One side
of the second electrode RME2 and one side of the third electrode RME3 facing (or opposing)
each other may overlap the fourth opening OP4.
[0184] In one or more embodiments, the lengths of the third opening OP3 and the fourth opening
OP4 measured in the first direction DR1 may be greater than those of the first opening
OP1, the second opening OP2, the fifth opening OP5, and the sixth opening OP6 measured
in the first direction DR1. However, the present disclosure is not limited thereto.
[0185] The alignment region in which the light emitting elements ED are disposed between
the electrodes RME may be formed in the emission area EMA of each sub-pixel SPXn.
During the manufacturing process of the display device 10, the light emitting elements
ED may be sprayed to the emission area EMA to be disposed in the alignment region
above the electrodes RME. However, some of the plurality of light emitting elements
ED may also be sprayed to an area other than the emission area EMA, i.e., an area
where the light emitting elements ED are not supposed to be aligned. For example,
some of the light emitting elements ED sprayed to the emission area EMA may also be
seated on the bank layer BNL, and these light emitting elements ED may remain as foreign
substances in a subsequent process.
[0186] The second insulating layer PAS2 may include the third opening OP3 and the fourth
opening OP4 that expose a region other than the alignment region between the electrodes
RME so that the light emitting elements ED remaining as foreign substances can be
removed. Similarly to the embodiment of FIG. 6, the third opening OP3 may be disposed
on the bank layer BNL. The third opening OP3 may be disposed not to overlap the electrodes
RME and the light emitting elements ED in an area other than the emission area EMA.
[0187] The fourth opening OP4 may be disposed in an area where the light emitting elements
ED are not disposed in the emission area EMA. In one or more embodiments including
four electrodes RME in each sub-pixel SPXn, the light emitting elements ED may be
disposed above the first electrode RME1 and the third electrode RME3, and above the
second electrode RME2 and the fourth electrode RME4, and may not be disposed above
the second electrode RME2 and the third electrode RME3. The light emitting elements
ED may be disposed between the first bank pattern BP1 and the third bank pattern BP3,
and between the second bank pattern BP2 and the third bank pattern BP3, but may not
be disposed on the third bank pattern BP3. The fourth opening OP4 may be disposed
on the third bank pattern BP3 to induce the light emitting elements ED seated on the
third bank pattern BP3 to be removed.
[0188] The plurality of contact portions CT1, CT2, CT3, and CT4 formed on the second insulating
layer PAS2 may be disposed to overlap different electrodes RME. For example, the plurality
of contact portions CT1, CT2, CT3, and CT4 may be disposed in the sub-region SA, and
may include the first contact portion CT1 disposed to overlap the first electrode
RME1, the second contact portion CT2 disposed to overlap the second electrode RME2,
the third contact portion CT3 disposed to overlap the third electrode RME3, and the
fourth contact portion CT4 disposed to overlap the fourth electrode RME4. The plurality
of contact portions CT1, CT2, CT3, and CT4 may penetrate the second insulating layer
PAS2 to partially expose the top surfaces of the electrodes RME1, RME2, RME3, and
RME4 disposed thereunder, respectively. Some of the contact portions CT1, CT2, CT3,
and CT4 may further penetrate another insulating layer disposed on the second insulating
layer PAS2.
[0189] The plurality of connection electrodes CNE may further include, in addition to the
first connection electrode CNE1 disposed on the first electrode RME1, the second connection
electrode CNE2 disposed on the second electrode RME2, a third connection electrode
CNE3, a fourth connection electrode CNE4, and a fifth connection electrode CNE5 arranged
across the plurality of electrodes RME.
[0190] Unlike the embodiment of FIGS. 4 to 12, each of the first connection electrode CNE1
and the second connection electrode CNE2 may have a relatively short length extending
in the first direction DR1. The first connection electrode CNE1 and the second connection
electrode CNE2 may be arranged on the lower side with respect to the center of the
emission area EMA. The first connection electrode CNE1 and the second connection electrode
CNE2 may be disposed across the emission area EMA and the sub-region SA of the corresponding
sub-pixel SPXn, and may be in direct contact with the electrode RME through the contact
portions CT1 and CT2 formed in the sub-region SA, respectively. The first connection
electrode CNE1 may be in direct contact with the first electrode RME1 through the
first contact portion CT1 penetrating the first insulating layer PAS1, the second
insulating layer PAS2, and the third insulating layer PAS3 in the sub-region SA, and
the second connection electrode CNE2 may be in direct contact with the second electrode
RME2 through the second contact portion CT2 penetrating the first insulating layer
PAS1, the second insulating layer PAS2, and the third insulating layer PAS3 in the
sub-region SA.
[0191] The third connection electrode CNE3 may include a first extension portion CN_E1 disposed
on the third electrode RME3, a second extension portion CN_E2 disposed on the first
electrode RME1, and a first connection portion CN_B1 that connects the first extension
portion CN_E1 to the second extension portion CN_E2. The first extension portion CN_E1
may be spaced from the first connection electrode CNE1 in the second direction DR2,
and the second extension portion CN_E2 may be spaced from the first connection electrode
CNE1 in the first direction DR1. The first extension portion CN_E1 may be disposed
on the lower side of the emission area EMA of the corresponding sub-pixel SPXn, and
the second extension portion CN_E2 may be disposed on the upper side of the emission
area EMA. The first extension portion CN_E1 and the second extension portion CN_E2
may be disposed in the emission area EMA. The first connection portion CN_B1 may be
disposed across the first electrode RME1 and the third electrode RME3 at the central
portion of the emission area EMA. The third connection electrode CNE3 may have a shape
substantially extending in the first direction DR1, and may have a shape that is bent
in the second direction DR2 and extends in the first direction DR1 again.
[0192] The fourth connection electrode CNE4 may include a third extension portion CN_E3
disposed on the fourth electrode RME4, a fourth extension portion CN_E4 disposed on
the second electrode RME2, and a second connection portion CN_B2 that connects the
third extension portion CN_E3 to the fourth extension portion CN_E4. The third extension
portion CN_E3 may face (or oppose) and may be spaced from the second connection electrode
CNE2 in the second direction DR2, and the fourth extension portion CN_E4 may be spaced
from the second connection electrode CNE2 in the first direction DR1. The third extension
portion CN_E3 may be disposed on the lower side of the emission area EMA of the corresponding
sub-pixel SPXn, and the fourth extension portion CN_E4 may be disposed on the upper
side of the emission area EMA. The third extension portion CN_E3 and the fourth extension
portion CN_E4 may be disposed in the emission area EMA. The second connection portion
CN_B2 may be disposed across the second electrode RME2 and the fourth electrode RME4
while being adjacent to the center of the emission area EMA. The fourth connection
electrode CNE4 may have a shape substantially extending in the first direction DR1,
and may have a shape that is bent in the second direction DR2 and extends in the first
direction DR1 again.
[0193] The fifth connection electrode CNE5 may include a fifth extension portion CN_E5 disposed
on the third electrode RME3, a sixth extension portion CN_E6 disposed on the fourth
electrode RME4, and a third connection portion CN_B3 that connects the fifth extension
portion CN_E5 to the sixth extension portion CN_E6. The fifth extension portion CN_E5
may face (or oppose) and may be spaced from the second extension portion CN_E2 of
the third connection electrode CNE3 in the second direction DR2, and the sixth extension
portion CN_E6 may face (or oppose) and may be spaced from the fourth extension portion
CN_E4 of the fourth connection electrode CNE4 in the second direction DR2. Each of
the fifth extension portion CN_E5 and the sixth extension portion CN_E6 may be arranged
on the upper side of the emission area EMA, and the third connection portion CN_B3
may be disposed across the third electrode RME3, the second electrode RME2, and the
fourth electrode RME4. The fifth connection electrode CNE5 may be disposed to be around
(or to surround) the fourth extension portion CN_E4 of the fourth connection electrode
CNE4 in a plan view.
[0194] The third connection electrode CNE3 may be in direct contact with the third electrode
RME3 through the third contact portion CT3 penetrating the first insulating layer
PAS1 and the second insulating layer PAS2 in the sub-region SA, and the fourth connection
electrode CNE4 may be in direct contact with the fourth electrode RME4 through the
fourth contact portion CT4 penetrating the first insulating layer PAS1 and the second
insulating layer PAS2 in the sub-region SA.
[0195] However, the present disclosure is not limited thereto. In one or more embodiments,
in the display device 10, some of the connection electrodes CNE may be directly connected
to the third conductive layer. For example, the first connection electrode CNE1 and
the second connection electrode CNE2 that are first type connection electrodes may
be directly connected to the third conductive layer and may be electrically connected
to the electrode RME. A second type connection electrode and a third type connection
electrode may not be electrically connected to the electrode RME, and may be connected
only to the light emitting elements ED. In one or more embodiments, the second type
connection electrode may be electrically connected to the electrodes RME.
[0196] The first connection electrode CNE1 and the second connection electrode CNE2 may
be the first type connection electrodes connected to the electrodes RME1 and RME2
directly connected to the third conductive layer, respectively. The third connection
electrode CNE3 and the fourth connection electrode CNE4 may be the second type connection
electrodes connected to the electrodes RME3 and RME4 that are not connected to the
third conductive layer. The fifth connection electrode CNE5 may be the third type
connection electrode that is not connected to the electrode RME. The fifth connection
electrode CNE5 may be in contact with the light emitting elements ED without being
connected to the electrode RME and may constitute an electrical connection circuit
of the light emitting elements ED together with other connection electrodes CNE.
[0197] In one or more embodiments, the third connection electrode CNE3 and the fourth connection
electrode CNE4 that are the second type connection electrodes may be connection electrodes
in which electrode extension portions extending in the first direction DR1 are not
parallel to each other in the second direction DR2. The fifth connection electrode
CNE5 that is the third type connection electrode may be the connection electrode in
which electrode extension portions extending in the first direction DR1 are parallel
to each other in the second direction DR2. The third connection electrode CNE3 and
the fourth connection electrode CNE4 may have a shape that is bent while extending
in the first direction DR1, and the fifth connection electrode CNE5 may have a shape
surrounding a part of another connection electrode.
[0198] The third insulating layer PAS3 may be disposed in a structure similar to that of
the above-described embodiment. The third insulating layer PAS3 may be disposed on
the second insulating layer PAS2 except the region in which the second connection
electrode layer is disposed.
[0199] In accordance with one or more embodiments, the third insulating layer PAS3 may include
a plurality of openings OP1, OP2, OP5, OP6, and OPR and the plurality of contact portions
CT1 and CT2. The plurality of openings may include the first opening OP1 that partially
overlaps the first electrode RME1, the second opening OP2 that partially overlaps
the second electrode RME2, the fifth opening OP5 that partially overlaps the third
electrode RME3, and the sixth opening OP6 that partially overlaps the fourth electrode
RME4.
[0200] The first opening OP1 may be disposed to overlap one side of the first electrode
RME1 that faces (e.g., opposes) the third electrode RME3. The first opening OP1 disposed
in one sub-pixel SPXn may expose the first ends of the first light emitting elements
ED1. The second opening OP2 may be disposed to overlap one side of the second electrode
RME2 that faces (e.g., opposes) the fourth electrode RME4. The second opening OP2
disposed in one sub-pixel SPXn may expose the second ends of the second light emitting
elements ED2.
[0201] The fifth opening OP5 may be disposed to overlap one side of the third electrode
RME3 that faces (e.g., opposes) the first electrode RME1. The fifth opening OP5 disposed
in one sub-pixel SPXn may expose the second ends of the third light emitting elements
ED3. The sixth opening OP6 may be disposed to overlap one side of the fourth electrode
RME4 that faces (e.g., opposes) the second electrode RME2. The sixth opening OP6 disposed
in one sub-pixel SPXn may expose the first ends of the fourth light emitting elements
ED4.
[0202] The third insulating layer PAS3 may be disposed on any one of the plurality of first
openings OP1, second openings OP2, fifth openings OP5, and sixth openings OP6 of the
second insulating layer PAS2. The third connection electrode CNE3 and the fourth connection
electrode CNE4 may be disposed in any one of the plurality of first openings OP1,
second openings OP2, fifth openings OP5, and sixth openings OP6 of second insulating
layer PAS2. The third insulating layer PAS3 may be disposed to cover the third connection
electrode CNE3 and the fourth connection electrode CNE4.
[0203] The third insulating layer PAS3 may be disposed on the third opening OP3 and the
fourth opening OP4 of the second insulating layer PAS2. The third opening OP3 and
the fourth opening OP4 of the second insulating layer PAS2 are formed to expose the
first insulating layer PAS1 or the bank layer BNL therebelow so that the misaligned
light emitting elements ED are removed. The third insulating layer PAS3 may cover
a lower layer exposed through the third opening OP3 and the fourth opening OP4. The
third insulating layer PAS3 may be in direct contact with a part of the top surface
of the bank layer BNL in the third opening OP3, and may be in direct contact with
a part of the top surface of the first insulating layer PAS1 in the fourth opening
OP4.
[0204] The plurality of contact portions CT1 and CT2 formed in the third insulating layer
PAS3 may be disposed to overlap different electrodes RME, respectively. For example,
the third insulating layer PAS3 may include the first contact portion CT1 disposed
to overlap the first electrode RME1, and the second contact portion CT2 disposed to
overlap the second electrode RME2. The first contact portion CT1 and the second contact
portion CT2 may penetrate the first insulating layer PAS1, the second insulating layer
PAS2, and the third insulating layer PAS3 to expose a part of the top surfaces of
the first electrode RME1 and the second electrode RME2 therebelow.
[0205] The first connection electrode CNE1 may be disposed to partially overlap the first
opening OP1 disposed at a lower region of the emission area EMA. The second connection
electrode CNE2 may be disposed to partially overlap the second opening OP2 disposed
at a lower region of the emission area EMA. The third connection electrode CNE3 may
be disposed to partially overlap the fifth opening OP5 disposed at a lower region
of the emission area EMA and the first opening OP1 disposed at an upper region of
the emission area EMA. The fourth connection electrode CNE4 may be disposed to partially
overlap the sixth opening OP6 disposed at a lower region of the emission area EMA
and the second opening OP2 disposed at an upper region of the emission area EMA. The
fifth connection electrode CNE5 may be disposed to partially overlap the fifth opening
OP5 disposed at a upper region of the emission area EMA and the sixth opening OP6
disposed at an upper region of the emission area EMA.
[0206] The first connection electrode CNE1 may be in contact with the first end of the first
light emitting element ED1 exposed through the first opening OP1, and the second connection
electrode CNE2 may be in contact with the second end of the second light emitting
element ED2 exposed through the second opening OP2. The third connection electrode
CNE3 may be in contact with the second end of the first light emitting element ED1
exposed through the fifth opening OP5, and the first end of the third light emitting
element ED3 exposed through the first opening OP1. The fourth connection electrode
CNE4 may be in contact with the second end of the fourth light emitting element ED4
exposed through the second opening OP2, and the first end of the second light emitting
element ED2 exposed through the sixth opening OP6. The fifth connection electrode
CNE5 may be in contact with the second end of the third light emitting element ED3
exposed through the fifth opening OP5, and the first end of the fourth light emitting
element ED4 exposed through the sixth opening OP6.
[0207] The plurality of light emitting elements ED may be classified into different light
emitting elements ED depending on the connection electrodes CNE to be in contact with
both ends of the light emitting elements ED to correspond to the arrangement structure
of the connection electrodes CNE. The first light emitting element ED1 and the second
light emitting element ED2 may have first ends in contact with the first type connection
electrodes and second ends in contact with the second type connection electrodes.
The first light emitting element ED1 may be in contact with the first connection electrode
CNE1 and the third connection electrode CNE3, and the second light emitting element
ED2 may be in contact with the second connection electrode CNE2 and the second connection
electrode CNE4. The third light emitting element ED3 and the fourth light emitting
element ED4 may have first ends in contact with the second type connection electrodes
and second ends in contact with the third type connection electrodes. The third light
emitting element ED3 may be in contact with the third connection electrode CNE3 and
the fifth connection electrode CNE5, and the fourth light emitting element ED4 may
be in contact with the fourth connection electrode CNE4 and the fifth connection electrode
CNE5.
[0208] The plurality of light emitting elements ED may be connected in series through the
plurality of connection electrodes CNE. Because the display device 10 according to
the described embodiment includes a larger number of light emitting elements ED for
each sub-pixel SPXn and the light emitting elements ED are connected in series, the
light emission amount per unit area may be further increased.
[0209] FIG. 22 is a plan view illustrating a sub-pixel of a display device according to
one or more embodiments. FIG. 23 is a cross-sectional view taken along the line E6-E6'
of FIG. 22. FIG. 24 is a cross-sectional view taken along the line E7-E7' in FIG.
22. FIG. 25 is a cross-sectional view taken along the line E8-E8' in FIG. 22.
[0210] FIG. 22 illustrates planar arrangement of the electrodes RME (RME1 and RME2), the
bank patterns BP1 and BP2, the bank layer BNL, the plurality of light emitting elements
ED, and the connection electrodes CNE (CNE1, CNE2, and CNE3) disposed in one pixel
PX of the display device 10. FIG. 23 illustrates a cross section across both ends
of the light emitting elements ED (ED1 and ED2) disposed on different electrodes RME.
FIGS. 24 and 25 illustrate cross sections across a plurality of electrode contact
holes CTD, CTS, and CTA, and the contact portions CT1 and CT2.
[0211] Referring to FIGS. 22 to 25, in the display device 10 according to one or more embodiments,
the structures of the electrode RME, the connection electrode CNE, and the bank patterns
BP1 and BP2 may be different from those in the above-described embodiments. Hereinafter,
the redundant description of the above-described embodiments will be omitted while
focusing on differences.
[0212] The plurality of bank patterns BP1 and BP2 may have a shape extending in the first
direction DR1, and may have different widths measured in the second direction DR2.
Any one of the bank patterns BP1 and BP2 may be disposed across the sub-pixels SPXn
adjacent in the second direction DR2. For example, the bank patterns BP1 and BP2 may
include the first bank pattern BP1 disposed in the emission area EMA of each sub-pixel
SPXn and the second bank pattern BP2 disposed across the emission areas EMA of different
sub-pixels SPXn adjacent in the second direction DR2.
[0213] The first bank pattern BP1 is disposed in the center of the emission areas EMA, and
the second bank patterns BP2 are disposed to be spaced apart from the first bank pattern
BP1 interposed therebetween. The first bank pattern BP1 and the second bank pattern
BP2 may be alternately disposed along the second direction DR2. The light emitting
elements ED may be disposed between the first bank pattern BP1 and the second bank
pattern BP2 that are spaced from each other.
[0214] The first bank pattern BP1 and the second bank pattern BP2 may have the same length
in the first direction DR1, but may have different widths measured in the second direction
DR2. In the bank layer BNL, a portion extending in the first direction DR1 may overlap
the second bank pattern BP2 in the thickness direction (e.g., the third direction
DR3). The first bank pattern BP1 may be disposed to overlap the first electrode RME1,
and the second bank pattern BP2 may be disposed to overlap electrode branch portions
RM_B1 and RM_B2 of the second electrode RME2 and the bank layer BNL.
[0215] The first bank pattern BP1 and the second bank pattern BP2 may have the same length
in the first direction DR1, but may have different widths measured in the second direction
DR2. In the bank layer BNL, a portion extending in the first direction DR1 may overlap
the second bank pattern BP2 in the thickness direction (e.g., the third direction
DR3). The bank patterns BP1 and BP2 may be disposed in an island-like pattern on the
entire surface of the display area DPA.
[0216] The plurality of electrodes RME include the first electrode RME1 disposed at the
central portion of each sub-pixel SPXn and the second electrode RME2 disposed across
different sub-pixels SPXn. The first electrode RME1 and the second electrode RME2
may substantially have a shape extending in the first direction DR1, and the portions
of the first electrode RME1 and the second electrode RME2 disposed in the emission
area EMA may have different shapes.
[0217] The first electrode RME1 may be disposed at the center of the sub-pixel SPXn, and
the portion of the first electrode RME1 disposed in the emission area EMA may be disposed
on the first bank pattern BP1. The first electrode RME1 may extend from the sub-region
SA in the first direction DR1 to the sub-region SA of another sub-pixel SPXn. The
first electrode RME1 may have a shape in which the width measured in the second direction
DR2 changes depending on positions, and at least a portion of the first electrode
RME1 overlapping the first bank pattern BP1 in the emission area EMA may have a width
greater than that of the first bank pattern BP1.
[0218] The second electrode RME2 may include a portion extending in the first direction
DR1 and portions branched near the emission area EMA. In one or more embodiments,
the second electrode RME2 may include an electrode stem portion RM_S extending in
the first direction DR1, the plurality of electrode branch portions RM_B1 and RM_B2
branched from the electrode stem portion RM_S to be bent in the second direction DR2
and extending in the first direction DR1 again. The electrode stem portion RM_S may
be disposed to overlap the portion of the bank layer BNL extending in the first direction
DR1, and may be disposed at one side in the second direction DR2 of the sub-region
SA. The electrode branch portions RM_B1 and RM_B2 may be branched from the electrode
stem portion RM_S disposed at the portion of the bank layer BNL extending in the first
direction DR1 and the portion of the bank layer BNL in the second direction DR2, and
may be bent toward both sides in the second direction DR2. The electrode branch portions
RM_B1 and RM_B2 may be disposed across the emission area EMA in the first direction
DR1, and may be bent again to be integrally connected to the electrode stem portion
RM_S. That is, the electrode branch portions RM_B1 and RM_B2 of the second electrode
RME2 may be branched on the upper side of the emission area EMA of any one sub-pixel
SPXn, and may be connected to each other again on the lower side thereof.
[0219] The second electrode RME2 may include a first electrode branch portion RM_B1 disposed
on the left side of the first electrode RME1 and a second electrode branch portion
RM_B2 disposed on the right side of the first electrode RME1. The electrode branch
portions RM_B1 and RM_B2 included in one second electrode RME2 may be disposed in
the emission areas EMA of the sub-pixels SPXn adjacent in the second direction DR2,
and the electrode branch portions RM_B1 and RM_B2 of different second electrodes RME2
may be disposed in one sub-pixel SPXn. The first electrode branch portion RM_B1 of
the second electrode RME2 may be disposed on the left side of the first electrode
RME1, and the second electrode branch portion RM_B2 of another second electrode RME2
may be disposed on the right side of the first electrode RME1.
[0220] The electrode branch portions RM_B1 and RM_B2 of the second electrode RME2 may overlap
one side of the second bank pattern BP2. The first electrode branch portion RM_B1
may partially overlap the second bank pattern BP2 disposed on the left side of the
first bank pattern BP1, and the second electrode branch portion RM_B2 may partially
overlap the second bank pattern BP2 disposed on the right side of the first bank pattern
BP1. Both sides of the first electrode RME1 may face (or oppose) and may be spaced
from different electrode branch portions RM_B1 and RM_B2 of different second electrodes
RME2, and the gap between the first electrode RME1 and each of the electrode branch
portions RM_B1 and RM_B2 may be smaller than the gap between different bank patterns
BP1 and BP2.
[0221] The width of the first electrode RME1 measured in the second direction DR2 may be
greater than the widths of the electrode stem portion RM_S and the electrode branch
portions RM_B1 and RM_B2 of the second electrode RME2. The first electrode RME1 may
have a width greater than that of the first bank pattern BP1 and overlap both sides
of the first bank pattern BP1, whereas the second electrode RME2 may have a relatively
small width so that the electrode branch portions RM_B1 and RM_B2 may overlap only
one side of the second bank pattern BP2.
[0222] The first electrode RME1 may be in contact with the first conductive pattern CDP1
of the third conductive layer through the first electrode contact hole CTD at the
portion overlapping the portion of the bank layer BNL extending in the second direction
DR2. The second electrode RME2 may be in contact with the second voltage line VL2
of the third conductive layer through the second electrode contact hole CTS at the
electrode stem portion RM_S. The portion of the first electrode RME1 disposed in the
sub-region SA may be disposed to overlap the first contact portion CT1. The second
electrode RME2 may have a portion that protrudes from the electrode stem portion RM_S
in the second direction DR2 to be disposed in the sub-region SA, and the second electrode
RME2 may overlap the second contact portion CT2 at the protruding part.
[0223] Between the first electrode RME1 and the second electrode RME2, the first electrode
RME1 may extend to separation portions ROP1 and ROP2 of the sub-region SA, whereas
the second electrode RME2 may not be separated in the sub-region SA. One second electrode
RME2 may include a plurality of electrode stem portions RM_S and the electrode branch
portions RM_B1 and RM_B2, and may have a shape extending in the first direction DR1
and branched near the emission area EMA of each sub-pixel SPXn. The first electrode
RME1 may be disposed between the separation portions ROP1 and ROP2 disposed in different
sub-regions SA1 and SA2 of each sub-pixel SPXn and may be disposed across the emission
area EMA.
[0224] In accordance with one or more embodiments, the display device 10 may include a wire
connection electrode EP disposed between the first electrodes RME1 of different sub-pixels
SPXn in the first sub-region SA1 among the plurality of sub-regions SA1 and SA2 of
each sub-pixel SPXn. The wire connection electrode EP may not be disposed in the second
sub-region SA of the sub-pixel SPXn, and the first electrodes RME1 of different sub-pixels
SPXn adjacent in the first direction DR1 may be spaced from each other. In the sub-pixel
SPXn illustrated in FIG. 22 among the plurality of sub-pixels SPXn, the first sub-region
SA1 in which the wire connection electrode EP is disposed may be disposed on the upper
side of the emission area EMA, and the second sub-region SA2 may be disposed on the
lower side of the emission area EMA. On the other hand, in the sub-pixel SPXn adjacent
to the sub-pixel SPXn of FIG. 22 in the first direction DR1, the first sub-region
SA1 in which the wire connection electrode EP is disposed may be disposed on the lower
side of the emission area EMA, and the second sub-region SA2 may be disposed on the
upper side of the emission area EMA.
[0225] The first electrode RME1 may be spaced from the wire connection electrode EP with
the first separation part ROP1 interposed therebetween in the first sub-region SA1.
Two first separation portions ROP1 may be disposed in one first sub-region SA1. The
wire connection electrode EP may be spaced from the first electrode RME1 disposed
in the corresponding sub-pixel SPXn with a lower first separation portion ROP1 interposed
therebetween, and may be spaced from the first electrode RME1 disposed in another
sub-pixel SPXn with an upper first separation portion ROP1 interposed therebetween.
One second separation portion ROP2 may be disposed in the second sub-region SA2, and
different first electrodes RME1 may be spaced from each other in the first direction
DR1.
[0226] In one or more embodiments, the wire connection electrode EP may be connected to
the first voltage line VL1 of the third conductive layer through the third electrode
contact hole CTA penetrating the via layer VIA. The first electrode RME1 may be connected
to the wire connection electrode EP, and the electric signal applied to arrange the
light emitting elements ED may be applied from the first voltage line VL1 to the first
electrode RME1 through the wire connection electrode EP. In the process of arranging
the light emitting elements ED, signals may be applied to the first voltage line VL1
and the second voltage line VL2, and may be transmitted to the first electrode RME1
and the second electrode RME2.
[0227] In one or more embodiments, a relative arrangement of the second electrode contact
hole CTS may be different from that of the third electrode contact hole CTA to be
described later. The second electrode contact hole CTS may be disposed at the portion
of the bank layer BNL surrounding the second sub-region SA2, and the third electrode
contact hole CTA may be disposed in the first sub-region SA1. Because the second electrode
contact hole CTS and the third electrode contact hole CTA expose the top surfaces
of different voltage lines VL2 and VL1, respectively, the positions of the electrode
contact holes may be determined to correspond thereto.
[0228] The bank layer BNL may surround the emission area EMA and the plurality of sub-regions
SA1 and SA2 similarly to the above-described embodiment. However, in the embodiment
in which the display device 10 includes the sub-regions SA1 and SA2 distinguished
from each other, the areas surrounded by the bank layer BNL may be distinguished from
each other. The bank layer BNL is the same as that in the above-described embodiment
except that it surrounds different sub-regions SA1 and SA2.
[0229] The plurality of light emitting elements ED may be disposed on different electrodes
RME between different bank patterns BP1 and BP2. The light emitting element ED may
include the first light emitting element ED1 having both ends disposed on the first
electrode RME1 and the second electrode branch portion RM_B2 of the second electrode
RME2, and the second light emitting element ED2 having both ends disposed on the first
electrode RME1 and the first electrode branch portion RM_B1 of another second electrode
RME2. The first light emitting elements ED1 may be disposed on the right side with
respect to the first electrode RME1, and the second light emitting elements ED2 may
be disposed on the left side with respect to the first electrode RME1. The first light
emitting elements ED1 may be disposed on the first electrode RME1 and the second electrode
RME2, and the second light emitting elements ED2 may be disposed on the first electrode
RME1 and the second electrode RME2.
[0230] The plurality of connection electrodes CNE (CNE1, CNE2, and CNE3) may include a first
connection electrode CNE1, a second connection electrode CNE2, and a third connection
electrode CNE3.
[0231] The first connection electrode CNE1 may have a shape extending in the first direction
DR1 and may be disposed on the first electrode RME1. A portion of the first connection
electrode CNE1 disposed on the first bank pattern BP1 may overlap the first electrode
RME1, and may extend therefrom in the first direction DR1 to be disposed in the first
sub-region SA1 located on the upper side of the emission area EMA over the bank layer
BNL. The first connection electrode CNE1 may be in contact with the first electrode
RME1 through the first contact portion CT1 in the first sub-region SA1.
[0232] The second connection electrode CNE2 may have a shape extending in the first direction
DR1 and may be disposed on the second electrode RME2. A portion of the second connection
electrode CNE2 disposed on the second bank pattern BP2 may overlap the second electrode
RME2, and may extend therefrom in the first direction DR1 to be disposed in the first
sub-region SA1 located on the upper side of the emission area EMA over the bank layer
BNL. The second connection electrode CNE2 may be in contact with the second electrode
RME2 through the second contact portion CT2 in the first sub-region SA1.
[0233] In one or more embodiments, in the sub-pixel SPXn adjacent to the sub-pixel SPXn
of FIG. 22 in the first direction DR1, the first connection electrode CNE1 and the
second connection electrode CNE2 may be in contact with the first electrode RME1 and
the second electrode RME2 through the contact portions CT1 and CT2 disposed in the
second sub-region SA2, respectively.
[0234] The third connection electrode CNE3 may include the extension portions CN_E1 and
CN_E2 extending in the first direction DR1 and a first connection portion CN_B1 connecting
the extension portions CN_E1 and CN_E2. The first extension portion CN_E1 may be disposed
on the second electrode branch portion RM_B2 of the second electrode RME2 while facing
(e.g., opposing) the first connection electrode CNE1 in the emission area EMA, and
the second extension portion CN_E2 may be disposed on the first electrode RME1 while
facing (e.g., opposing) the second connection electrode CNE2 in the emission area
EMA. The first connection portion CN_B1 may extend in the second direction DR2 on
the bank layer BNL disposed on the lower side of the emission area EMA to connect
the first extension portion CN_E1 to the second extension portion CN_E2. The third
connection electrode CNE3 may be disposed on the emission area EMA and the bank layer
BNL, and may not be directly connected to the electrode RME. The second electrode
branch portion RM_B2 disposed under the first extension portion CN_E1 may be electrically
connected to the second voltage line VL2, and the second power voltage applied to
the second electrode branch portion RM_B2 may not be transmitted to the third connection
electrode CNE3.
[0235] Similarly to the above-described embodiments, in the display device 10_2 of FIG.
22, the second insulating layer PAS2 may include the plurality of openings OP1, OP2,
OP3, and OP4. The first opening OP1 and the second opening OP2 of the second insulating
layer PAS2 may be disposed to overlap a part of the electrodes RME1 and RME2 while
exposing one end of the light emitting elements ED. The third opening OP3 of the second
insulating layer PAS2 may be disposed on the bank layer BNL, and the fourth opening
OP4 may be disposed on the first electrode RME1 to overlap the first bank pattern
BP1. The third opening OP3 may be disposed in an area other than the emission area
EMA, and the fourth opening OP4 may be disposed in an area where the light emitting
elements ED are not disposed above the electrodes RME of emission area EMA, while
being spaced from the first and second openings OP1 and OP2.
[0236] According to one or more embodiments, the display device 10 may include a hole disposed
between the second electrode branch portion RM_B2 of the second electrode RME2 and
the bank layer BNL in the emission area EMA. The hole may be formed to extend in the
first direction DR1 between the second electrode branch portion RM_B2 and the bank
layer BNL while penetrating the second insulating layer PAS2 and the third insulating
layer PAS3. The hole HP may provide a path through which lights emitted from the light
emitting element ED and totally reflected in the connection electrode CNE or the first
insulating layer PAS1 are emitted. However, the present disclosure is not limited
thereto, and the hole HP may be omitted.
[0237] In concluding the detailed description, those skilled in the art will appreciate
that many variations and modifications can be made to the embodiments without substantially
departing from the scope of the present invention as defined by the claims.
1. A display device comprising:
a plurality of electrodes, RME, comprising a first electrode, RME1, on a substrate
and extending in a first direction, a second electrode, RME2, spaced from the first
electrode in a second direction, a third electrode, RME3, between the first electrode
and the second electrode, and a fourth electrode, RME4, spaced from the second electrode
in the second direction;
a first insulating layer, PAS1, on the plurality of electrodes;
a plurality of light emitting elements, ED, on the plurality of electrodes that are
spaced from each other in the second direction on the first insulating layer;
a second insulating layer, PAS2, on the first insulating layer and the plurality of
light emitting elements;
a plurality of connection electrodes, CNE, on at least some of the plurality of electrodes,
in contact with the plurality of light emitting elements, and spaced from each other
in the first direction and the second direction,
wherein the second insulating layer, PAS2, includes:
a plurality of first openings, OP1, overlapping the first electrode and the plurality
of light emitting elements and spaced from each other in the first direction,
a plurality of second openings, OP2, overlapping the second electrode and the plurality
of light emitting elements and spaced from each other in the first direction,
a third opening, OP3, that does not overlap the plurality of light emitting elements
and the plurality of electrodes, and
a fourth opening, OP4, that overlaps the second electrode and the third electrode
without overlapping the light emitting elements.
2. The display device of claim 1, further comprising a bank layer, BNL, on the first
insulating layer and surrounding an emission area, EMA, in which the light emitting
elements are located,
wherein the plurality of first openings, the plurality of second openings, and the
fourth opening are located in the emission area, and the third opening, OP3, is located
on the bank layer.
3. The display device of claim 2, further comprising one electrode, CSE1, CSE2, of a
storage capacitor located on the substrate and overlapping the bank layer, BNL,
wherein the third opening, OP3, overlaps the one electrode of the storage capacitor.
4. The display device of any one of the preceding claims, wherein the second insulating
layer, PAS2, further includes:
a plurality of fifth openings, OP5, overlapping the third electrode and the plurality
of light emitting elements and spaced from each other in the first direction; and
a plurality of sixth openings, OP6, overlapping the fourth electrode and the plurality
of light emitting elements and spaced from each other in the first direction.
5. The display device of claim 4, wherein the fourth opening, OP4, is located between
the plurality of fifth openings, OP5, and the plurality of second openings, OP2, to
overlap a region between the second electrode, RME2, and the third electrode, RME3.
6. The display device of claim 4, wherein the plurality of light emitting elements comprise
a first light emitting element, ED1, on the first electrode, RME1, and the third electrode,
RME3,
a second light emitting element, ED2, on the second electrode, RME2, and the fourth
electrode, RME4,
a third light emitting element, ED3, on the first electrode, RME1, and the third electrode,
RME3, and spaced from the first light emitting element, ED1, in the first direction,
and
a fourth light emitting element, ED4, on the second electrode, RME2, and the fourth
electrode, RME4, and spaced from the second light emitting element, ED2, in the first
direction.
7. The display device of claim 6, wherein the plurality of first openings overlap first
ends of the first light emitting element and the third light emitting element,
wherein the plurality of second openings overlap second ends of the second light emitting
element and the fourth light emitting element,
wherein the plurality of fifth openings overlap second ends of the first light emitting
element and the third light emitting element, and
wherein the plurality of sixth openings overlap first ends of the second light emitting
element and the fourth light emitting element.
8. The display device of any one of claims 4 to 7, wherein the plurality of connection
electrodes, CNE, comprise:
a first connection electrode, CNE1, on the first electrode and overlapping a first
opening from among the plurality of first openings located at a lower region of the
emission area; and
a second connection electrode, CNE2, located on the second electrode and overlapping
a second opening from among the plurality of second openings located at a lower region
of the emission area.
9. The display device of claim 8, wherein the plurality of connection electrodes further
comprise:
a third connection electrode, CNE3, comprising a first extension portion, CN_E1, on
the third electrode, RME3, and a second extension portion, CN_E2, on the first electrode,
RME1, and spaced from the first connection electrode, CNE1, in the first direction;
a fourth connection electrode, CNE4, comprising a third extension portion, CN_E3,
on the fourth electrode, RME4, and a fourth extension portion, CN_E4, on the second
electrode, RME2, and spaced from the second connection electrode, CNE2, in the first
direction; and
a fifth connection electrode, CNE5, comprising a fifth extension portion, CN_E5, on
the third electrode, RME3, and a sixth extension portion, CN_E6, on the fourth electrode,
RME4, and spaced from the third extension portion, CN_E3, in the first direction.
10. The display device of claim 9, wherein the first extension portion overlaps the plurality
of fifth openings located at the lower region of emission area,
wherein the second extension portion overlaps the plurality of first openings located
at an upper region of the emission area,
wherein the third extension portion overlaps the plurality of sixth openings located
at the lower region of the emission area,
wherein the fourth extension portion overlaps the plurality of second openings located
at the upper region of the emission area,
wherein the fifth extension portion overlaps the plurality of fifth openings located
at the upper region of the emission area, and
wherein the sixth extension portion overlaps the plurality of sixth openings located
at the upper region of the emission area.
11. The display device of any one of claims 4 to 10, further comprising a third insulating
layer, PAS3, on the second insulating layer,
wherein the third insulating layer is on the third opening and the fourth opening.
12. The display device of claim 11, wherein the third insulating layer is in contact with
a portion of the first insulating layer exposed by the fourth opening.
13. The display device of claim 11 or 12, wherein the plurality of first openings and
the plurality of second openings that are located at a lower region of the emission
area, and the plurality of fifth openings and the plurality of sixth openings that
are located at an upper region of the emission area penetrate the third insulating
layer.
14. The display device of any one of claims 4 to 13, wherein lengths of the third opening
and the fourth opening measured in the first direction are greater than lengths of
each of the plurality of first openings, the plurality of second openings, the plurality
of fifth openings, and the plurality of sixth openings measured in the first direction.
15. A display device comprising:
a first electrode, RME1, RME2 and a second electrode, RME3, RME4, spaced from the
first electrode;
a first insulating layer, PAS1, on the first electrode and the second electrode;
a plurality of light emitting elements, ED, each having a first end on the first electrode,
RME1, and a second end on the second electrode, RME3, on the first insulating layer;
a bank layer, BNL, on the first insulating layer and surrounding an emission area,
EMA, in which the plurality of light emitting elements are located;
a second insulating layer, PAS2, on the first insulating layer and the plurality of
light emitting elements;
a first connection electrode on the first electrode; and
a second connection electrode on the second electrode,
wherein the second insulating layer includes:
a first opening, OP1, overlapping the first electrode, RME1, and one end of the plurality
of light emitting elements;
a second opening, OP5, overlapping the second electrode, RME3, and other ends of the
plurality of light emitting elements, and
a third opening, OP3, that does not overlap the plurality of light emitting elements,
the first electrode, and the second electrode.