(19)
(11) EP 4 189 741 A1

(12)

(43) Date of publication:
07.06.2023 Bulletin 2023/23

(21) Application number: 20760405.9

(22) Date of filing: 17.08.2020
(51) International Patent Classification (IPC): 
H01L 25/00(2006.01)
H01L 21/683(2006.01)
H01L 21/56(2006.01)
H01L 25/03(2006.01)
H01L 23/00(2006.01)
H01L 23/31(2006.01)
(52) Cooperative Patent Classification (CPC):
H01L 2224/94; H01L 2924/18162; H01L 2224/04105; H01L 2224/214; H01L 2224/12105; H01L 24/19; H01L 2224/16227; H01L 2224/96; H01L 21/561; H01L 21/568; H01L 21/6835; H01L 2221/68327; H01L 2221/68345; H01L 23/3171; H01L 25/50; H01L 25/03
 
C-Sets:
H01L 2224/94, H01L 2224/214;
(86) International application number:
PCT/EP2020/072972
(87) International publication number:
WO 2022/037754 (24.02.2022 Gazette 2022/08)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(71) Applicant: Huawei Technologies Co., Ltd.
Shenzhen, Guangdong 518129 (CN)

(72) Inventor:
  • CHEN, Wu
    80992 Munich (DE)

(74) Representative: Grünecker Patent- und Rechtsanwälte PartG mbB 
Leopoldstraße 4
80802 München
80802 München (DE)

   


(54) A METHOD FOR MANUFACTURING A DIE ASSEMBLY