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EP 4 193 656 A1

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(43) Date of publication: 14.06.2023 Bulletin 2023/24 (21) Application number: 21852306.6 (22) Date of filing: 29.07.2021

(51) International Patent Classification (IPC):  H04W 28/02(2009.01) H04W 72/00(2023.01) H04W 80/02(2009.01) H04W 72/04(2023.01) H04W 4/06(2009.01) (52) Cooperative Patent Classification (CPC): H04W 28/02; H04W 4/06; H04W 80/02; H04W 4/50; H04W 76/40; H04L 47/806 (86) International application number: PCT/US2021/043642 (87) International publication number: WO 2022/031507 (10.02.2022 Gazette 2022/06)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 06.08.2020 US 202063062348 P (71) Applicant: INTEL Corporation Santa Clara, CA 95054 (US)	(72) Inventors: HEO, Youn Hyoung Seoul 11, 150-705 (KR) LI, Ziyi Beijing, 100190 (CN) PALAT, Sudeep K. Cheltenham, Gloucestershire GL51 0GG (GB) ZHANG, Yujian Beijing 100081 (CN) (74) Representative: Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte  Am Brauhaus 8 01099 Dresden 01099 Dresden (DE)