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EP 4 193 688 A1

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(43) Date of publication: 14.06.2023 Bulletin 2023/24 (21) Application number: 21853163.0 (22) Date of filing: 30.07.2021

(51) International Patent Classification (IPC):  H04W 48/10(2009.01) H04W 48/02(2009.01) H04W 84/04(2009.01) H04W 48/18(2009.01) H04W 60/04(2009.01) (52) Cooperative Patent Classification (CPC): H04W 60/04; H04W 48/18; H04W 48/02; H04W 8/18; H04W 48/16; H04W 8/22; H04W 8/08 (86) International application number: PCT/US2021/044053 (87) International publication number: WO 2022/031557 (10.02.2022 Gazette 2022/06)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 05.08.2020 US 202063061700 P (71) Applicant: Intel Corporation Santa Clara, CA 95054 (US)

(72) Inventors: LIM, Seau, Sian Swindon (GB) HAN, Jaemin Portland, OR 97229 (US) PALAT, Sudeep Cheltenham Gloucestershire GLS GL51 0GG (GB) SIROTKIN, Alexander 4529555 Hod Hasharon (IL) SHAN, Changhong Shanghai 200030 (CN) BURBIDGE, Richard Shrivenham Oxfordshire SN6 8HR (GB) HEO, Youn Hyoung San Jose, CA 95134 (US) (74) Representative: Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte  Am Brauhaus 8 01099 Dresden 01099 Dresden (DE)