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(11)

EP 4 197 253 A1

(12)

(43) Date of publication: 21.06.2023 Bulletin 2023/25 (21) Application number: 21856392.2 (22) Date of filing: 25.06.2021

(51) International Patent Classification (IPC):  H04W 64/00(2009.01) H04B 17/364(2015.01) H04B 7/08(2006.01) H04W 56/00(2009.01) H04L 5/00(2006.01) G01S 5/02(2010.01) (52) Cooperative Patent Classification (CPC): H04W 64/00; H04L 5/0094; H04L 5/0048; H04B 7/0695; H04W 56/0015; H04W 76/28; G01S 5/0205 (86) International application number: PCT/US2021/039250 (87) International publication number: WO 2022/035514 (17.02.2022 Gazette 2022/07)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 13.08.2020 US 202063065397 P 17.08.2020 US 202063066768 P (71) Applicant: INTEL Corporation Santa Clara, CA 95054 (US)	(72) Inventors: HUANG, Rui Beijing 100085 (CN) LI, Qiming Beijing 100085 (CN) CHERVYAKOV, Andrey Nizhny Novgorod, 603006 (RU) LI, Hua Beijing 100086 (CN) (74) Representative: HGF  HGF Limited 1 City Walk Leeds LS11 9DX Leeds LS11 9DX (GB)