(19)
(11) EP 4 199 108 B8

(12) CORRECTED EUROPEAN PATENT SPECIFICATION
Note: Bibliography reflects the latest situation

(15) Correction information:
Corrected version no 1 (W1 B1)

(48) Corrigendum issued on:
12.06.2024 Bulletin 2024/24

(45) Mention of the grant of the patent:
24.04.2024 Bulletin 2024/17

(21) Application number: 22211090.0

(22) Date of filing: 02.12.2022
(51) International Patent Classification (IPC): 
H01L 29/423(2006.01)
H01L 29/786(2006.01)
H01L 29/08(2006.01)
H01L 29/66(2006.01)
 H01L 29/775(2006.01)
H01L 29/06(2006.01)
H01L 29/10(2006.01)
B82Y 10/00(2011.01)
(52) Cooperative Patent Classification (CPC):
H01L 29/42392; H01L 29/78696; H01L 29/775; H01L 29/78615; B82Y 10/00; H01L 29/0673; H01L 29/66439; H01L 29/0847; H01L 29/1079; H01L 29/66545; H01L 29/0653

(54)

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

HALBLEITERBAUELEMENT UND VERFAHREN ZUR HERSTELLUNG EINES HALBLEITERBAUELEMENTS

DISPOSITIF SEMI-CONDUCTEUR ET PROCÉDÉ DE FABRICATION DE DISPOSITIF SEMI-CONDUCTEUR

(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR

(30) Priority: 14.12.2021 JP 2021202722

(43) Date of publication of application:
21.06.2023 Bulletin 2023/25

(73) Proprietor: United Semiconductor Japan Co., Ltd.
Kuwana-shi, Mie 511-0118 (JP)

(72) Inventor:
  • Ohkawa, Narumi
    Kuwana-shi, 511-0118 (JP)

(74) Representative: Hoffmann Eitle 
Patent- und Rechtsanwälte PartmbB Arabellastraße 30
81925 München
81925 München (DE)


(56) References cited: : 
US-A- 5 393 681
US-A1- 2018 261 668
 US-A1- 2007 023 756
US-A1- 2020 279 916
   
       
    Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).