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(11)

EP 4 201 007 A1

(12)

(43) Date of publication: 28.06.2023 Bulletin 2023/26 (21) Application number: 21858822.6 (22) Date of filing: 09.08.2021

(51) International Patent Classification (IPC):  H04L 1/00(2006.01) H04L 5/00(2006.01) H04W 52/14(2009.01) H04W 72/12(2023.01) H04L 1/08(2006.01) H04L 25/02(2006.01) H04W 72/04(2023.01) (52) Cooperative Patent Classification (CPC): H04L 1/08; H04L 25/0204; H04L 25/0224; H04B 17/327; H04W 52/48; H04L 5/0048 (86) International application number: PCT/US2021/045236 (87) International publication number: WO 2022/039959 (24.02.2022 Gazette 2022/08)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 19.08.2020 US 202063067637 P 15.01.2021 US 202163138100 P (71) Applicant: INTEL Corporation Santa Clara, CA 95054 (US)	(72) Inventors: SOSNIN, Sergey Zavolzhie, NIZ 606520 (RU) XIONG, Gang Beaverton, Oregon 97006 (US) ERMOLAEV, Gregory Nizhny Novgorod, NIZ 603000 (RU) ZHU, Jie San Jose, California 95120 (US) (74) Representative: Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte  Am Brauhaus 8 01099 Dresden 01099 Dresden (DE)