FIELD
[0001] The present invention relates to a vessel for a radiation source, such as an extreme
ultraviolet (EUV) radiation source, and associated apparatuses and systems.
BACKGROUND
[0002] A lithographic apparatus is a machine constructed to apply a desired pattern onto
a substrate. A lithographic apparatus can be used, for example, in the manufacture
of integrated circuits (ICs). A lithographic apparatus may, for example, project a
pattern at a patterning device (e.g., a mask) onto a layer of radiation-sensitive
material (resist) provided on a substrate.
[0003] To project a pattern on a substrate a lithographic apparatus may use electromagnetic
radiation. The wavelength of this radiation determines the minimum size of features
which can be formed on the substrate. A lithographic apparatus, which uses extreme
ultraviolet (EUV) radiation, having a wavelength within the range 4-20 nm, for example
6.7 nm or 13.5 nm, may be used to form smaller features on a substrate than a lithographic
apparatus which uses, for example, radiation with a wavelength of 193 nm.
[0004] A lithographic system may comprise a radiation source, a beam delivery system and
a lithographic apparatus. The beam delivery system may be arranged to deliver EUV
radiation from the radiation source to the lithographic apparatus.
[0005] The EUV radiation may be produced using a plasma. The plasma may be created, for
example, by directing a laser beam at a fuel in the radiation source. The resulting
plasma may emit the EUV radiation. A portion of the fuel may become fuel debris, which
may accumulate or be deposited on one or more components of the radiation source.
[0006] The fuel debris deposited on the one or more components of the radiation source may
lead to contamination of other components of the radiation source. Such contamination
may lead to a decrease in the performance of the radiation source, e.g. the quality
or power of the produced EUV radiation, which in turn may lead to degradation of performance
of an associated lithographic apparatus. Ultimately, this may lead to significant
down-time of the lithographic apparatus whilst components of the radiation source
are cleaned or replaced.
SUMMARY
[0007] According to a first aspect of the present invention there is provided a vessel for
an EUV radiation source, the vessel comprising a guide portion for directing fuel
debris from a plasma formation region of the EUV radiation source towards a fuel debris
removal device, a wall comprising an opening, wherein at least a part of the guide
portion is arranged in the opening of the wall so that a gap is defined between the
guide portion and the wall and a gas supply system configured to supply a gas into
the gap to control a transfer of heat between the guide portion and the wall.
[0008] By configuring the gas supply system to supply the gas into the gap, cooling or heating
of the guide portion may be controlled and/or improved. For example, it may be desirable
to cool the guide portion, when EUV radiation is produced by the EUV radiation source.
The gas may be supplied into the gap to allow for cooling of the guide portion, e.g.
to below a melting temperature of a fuel that may be used in the EUV radiation source.
In use, fuel debris may be deposited on the guide portion. By cooling the guide portion
to a temperature below the melting temperature of the fuel, dripping, bubbling and/or
spitting of liquid fuel debris may be prevented or reduced. This may result in a decrease
of the contamination of one or more components of the EUV radiation source.
[0009] Additionally or alternatively, when EUV radiation is produced by the EUV radiation
source, a temperature of the guide portion may increase to about 300°C or larger.
This may cause damage and/or corrosion of the guide portion. For example, the guide
portion may comprise a metal material or metal alloy material, such as stainless steel.
Some metal alloy materials, such as stainless steel, may start to corrode and/or become
damaged at a temperature of about 400°C or above. By configuring the gas supply system
to supply the gas into the gap, cooling of the guide portion may be controlled and/or
improved, e.g. when EUV radiation is produced by the EUV radiation source. This may
lead to a reduction in corrosion and/or damage of the guide portion and/or an increase
in the lifetime of the guide portion. It may be desirable to heat the guide portion,
e.g. when no EUV radiation is produced by the EUV radiation source, e.g. to remove
fuel debris from the guide portion.
[0010] The vessel may be or comprise a vacuum vessel, pressure vessel, vacuum chamber or
pressure chamber or the like. The vessel may be configured to enclose a vacuum or
low pressure environment of the EUV radiation source. The term "low pressure environment"
may be considered as an environment comprising a gas at a pressure below atmospheric
pressure, e.g. at a pressure between about 100 Pa and 200 Pa.
[0011] The gas supply system may be operable between a first configuration and a second
configuration. In the first configuration, the gas supply system may be configured
to supply the gas into the gap, e.g. to increase a transfer of heat between the guide
portion and the wall. In the second configuration, the gas supply system may be configured
to supply no gas into the gap, e.g. to decrease a transfer of heat between the guide
portion and the wall. For example, in the second configuration, the gas supply system
may be configured to terminate or stop a supply of gas into the gap. By operating
the gas supply system between the first configuration and the second configuration
a transfer of heat between the guide portion and the wall may be controlled. This
may allow for cooling or heating of the guide portion to be controlled and/or improved.
[0012] The gas supply system may be configured to operate in the first configuration, e.g.
when EUV radiation is produced by the EUV radiation source. The gas supply system
may be configured to operate in the second configuration, e.g. when no EUV radiation
is produced by the radiation source. The EUV radiation source may comprise an on state,
in which EUV radiation is produced. The EUV radiation source may comprise an off state,
in which no EUV radiation is produced. The EUV radiation source may be operative between
the on state and the off state.
[0013] When the gas supply system is in the first configuration, a pressure of the gas in
the gap may be greater than a pressure of the gas in the gap, when the gas supply
system is in the second configuration. When the gas supply system is in the first
configuration, the pressure of the gas in the gap may be between about 10 kPa and
20 kPa. When the gas supply system is in the second configuration, the pressure of
the gas in the gap may be between about 100 Pa and 200 Pa.
[0014] The gas supply system may be configured to control a pressure of the gas in the gap,
e.g. to control the transfer of heat between the guide portion and the wall. The gas
supply system may be configured to control the pressure of the gas in the gap based
on at least one of: a type of gas and a size of the gap.
[0015] For example in use, the wall may be subjected to a cooling source. For example in
use, the guide portion may be subjected to a heating source. The heating source comprises
a heating element. The heating element may be configured to heat the guide portion,
e.g. when no EUV radiation is produced by the EUV radiation source. The heating element
may be comprised in, part of or arranged on the guide portion. The guide portion may
be arranged in the vessel so that, for example in use, the guide portion may be subjected
to heat generated at the plasma formation region of the EUV radiation source.
[0016] The cooling source may comprise a cooling element. The cooling element may be configured
to cool the wall. The cooling element may be comprised in or part of the wall.
[0017] By configuring the gas supply system to supply the gas into the gap, cooling or heating
of the guide portion, e.g. by the cooling source or heating source, respectively,
may be controlled or adjusted more precisely. This may reduce or avoid the use of
heating elements with increased capacity, for example to counteract an increased cooling
capacity of the cooling source. For example, an increase of the capacity of the cooling
source may be necessary, when the power of the EUV radiation produced by the EUV radiation
source is increased. By reducing or avoiding the use of heating elements with an increased
capacity, damage or deformation of one or more components of the radiation source,
which may be arranged in proximity to the heating elements, may be reduced or avoided.
[0018] The gas may comprise a thermal conductivity at room temperature between about 0.02
W/mK and 0.18 W/mK
[0019] The gas may be selected from at least one of: hydrogen, nitrogen and helium.
[0020] The vessel may comprise at least one restriction element or a plurality of restriction
elements for maintaining a pressure of the gas in the gap. The at least one restriction
element, some or all of the plurality of restriction elements may be arranged in the
gap and/or in or on the wall.
[0021] The vessel may comprise at least one spacing element or a plurality of spacing elements
for maintaining a size of the gap. The at least one spacing element or the plurality
of spacing elements may be arranged between the guide portion and the wall. For example,
the at least one spacing element or the plurality of spacing elements may be arranged
on the guide portion, e.g. a portion thereof, and/or the wall.
[0022] The vessel may comprise a plurality of inlets for directing the gas into the gap.
The plurality of inlets may be part of, comprised in or arranged in the wall.
[0023] According to a second aspect of the present invention there is provided a vessel
for an EUV radiation source, the vessel comprising a vessel module comprising a wall,
the wall comprising a first portion and a second portion, wherein a gap is defined
between the first portion and the second portion of the wall; and a gas supply system
configured to supply a gas into the gap to control a transfer of heat between the
first portion and the second portion of the wall.
[0024] By configuring the gas supply system to supply the gas into the gap, cooling or heating
of the first portion of the wall may be controlled and/or improved. For example, it
may be desirable to cool the first portion of the wall, when EUV radiation is produced
by the EUV radiation source. The gas may be supplied into the gap to allow for cooling
of the first portion of the wall, e.g. to below a melting temperature of a fuel that
may be used in the EUV radiation source. In use, fuel debris may be deposited on the
first portion of the wall. By cooling the first portion of the wall to a temperature
below the melting temperature of the fuel, dripping, bubbling and/or spitting of liquid
fuel debris may be prevented or reduced. This may result in a decrease of the contamination
of one or more components of the EUV radiation source. It may be desirable to heat
the first portion of the wall, e.g. when no EUV radiation is produced by the EUV radiation
source SO, e.g. to remove fuel debris from the first portion of the wall.
[0025] The gas supply system may be operable between a first configuration and a second
configuration. In the first configuration, the gas supply system may be configured
to supply the gas into the gap, e.g. to increase a transfer of heat between the first
portion and the second portion of the wall. In the second configuration, the gas supply
system may be configured to supply no gas into the gap, e.g. to decrease a transfer
of heat between the first portion and the second portion of the wall. For example,
in the second configuration, the gas supply system may be configured terminate or
stop a supply of gas into the gap. By operating the gas supply system between the
first configuration and the second configuration a transfer of heat between the first
portion and the second portion of the wall may be controlled. This may allow for cooling
or heating of the first portion of the wall to be controlled and/or improved.
[0026] The gas supply system may be configured to operate in the first configuration, e.g.
when EUV radiation is produced by the EUV radiation source. The gas supply system
may be configured to operate in the second configuration, e.g. when no EUV radiation
is produced by the EUV radiation source. The EUV radiation source may comprise an
on state, in which EUV radiation is produced. The EUV radiation source may comprise
an off state, in which no EUV radiation is produced. The EUV radiation source may
be operative between the on state and the off state.
[0027] The gas supply system may be configured to control a pressure of the gas in the gap,
e.g. to control the transfer of heat between the first portion and the second portion
of the wall. The gas supply system may be configured to control a pressure of the
gas in the gap, e.g. based on at least one of: a type of gas and a size of the gap.
[0028] When the gas supply system is in the first configuration, a pressure of the gas in
the gap may be greater than a pressure of the gas in the gap, when the gas supply
system is in the second configuration. When the gas supply system is in the first
configuration, the pressure of the gas in the gap may be between about 10 kPa and
20 kPa. When the gas supply system is in the second configuration, the pressure of
the gas in the gap may be between about 100 Pa and 200 Pa.
[0029] For example in use, the first portion of the wall may be subjected to a heating source.
The second portion of the wall may be subjected to a cooling source. The heating source
comprises a heating element. The heating element may be configured to heat the first
portion of the wall, for example when no EUV radiation is produced by the EUV radiation
source. The heating element may be part of or comprised in the first portion of the
wall. For example, in use, the first portion of the wall may be subjected to heat
generated at a plasma formation region of the EUV radiation source. The cooling source
may comprise a cooling element. The cooling element may be configured to cool the
second portion of the wall. The cooling element may be part of or comprised in the
second portion of the wall.
[0030] The gas may comprise a thermal conductivity at room temperature between about 0.02
W/mK and 0.18 W/mK
[0031] The gas may be selected from at least one of: hydrogen, nitrogen and helium.
[0032] The vessel may comprise at least one restriction element or a plurality of restriction
elements for maintaining a pressure of the gas in the gap. The at least one restriction
element, at least some or all of the plurality of restriction elements may be arranged
in the gap and/or on the wall, e.g. the first portion and/or second portion of the
wall.
[0033] The vessel may comprise at least one spacing element or a plurality of spacing elements
for maintaining a size of the gap. The at least one spacing element or the plurality
of spacing elements may be arranged between the first portion and the second portion
of the wall. The at least one spacing element, at least some or all of the plurality
of spacing elements may be arranged on the first portion and/or the second portion
of the wall.
[0034] The vessel may comprise a plurality of inlets for directing the gas into the gap.
The plurality of inlets may be arranged in the wall, e.g. the first portion and/or
the second portion of the wall.
[0035] The vessel module may be configured for use in proximity to a plasma formation region
of the EUV radiation source. For example, the vessel module may be configured to surround
the plasma formation region of the EUV radiation source.
[0036] The vessel module may be configured for use in proximity to an intermediate focus
of EUV radiation produced by the EUV radiation source.
[0037] The vessel module may comprise a guide portion for directing fuel debris from a plasma
formation region of the EUV radiation source towards a fuel debris removal device.
[0038] The vessel module may comprise a reservoir for collecting fuel from at least one
component of the EUV radiation source. The vessel module may comprise another reservoir
for supplying fuel to at least one component of the EUV radiation source.
[0039] According to a third aspect of the present invention there is provided an EUV radiation
source comprising a vessel according to first aspect and/or the second aspect.
[0040] According to a fourth aspect of the present invention there is provided a lithographic
system comprising an EUV radiation source according to the third aspect and a lithographic
apparatus.
[0041] According to a fifth aspect of the present invention there is provided a guide portion
for use in a vessel, the guide portion being configured such that a gap is defined
between a wall of the vessel and the guide portion, when at least a part of the guide
portion is arranged in an opening of the wall of the vessel.
[0042] The vessel may be or comprise a vessel for an EUV radiation source. For example,
when at least the part of the guide portion is arranged in the opening of the wall
of the vessel, the guide portion may be configured to direct fuel debris from a plasma
formation region of the EUV radiation source towards a fuel debris removal device.
[0043] The guide portion may comprise a first part and a second part. The first part of
the guide portion may be configured to be arranged in the opening of the wall of the
vessel. The first part of the guide portion may comprise a shape that corresponds
to a shape of the opening of the wall of the vessel. The guide portion may be configured
such that a size or dimension of the first part of the guide portion is smaller than
a size or dimension of the opening of the wall of the vessel. This may allow for the
gap to be defined or formed between at least the first part of the guide portion and
the opening of the wall of the vessel.
[0044] The guide portion may be configured such that the second part of the guide portion
protrudes or extends from the first part of the guide portion. For example, the second
part may extend perpendicularly, e.g. substantially perpendicularly, from the first
portion. The second part may comprise a shape, e.g. a curved shape, which corresponds
to a shape of the wall of the vessel. The guide portion may be configured such that
the second part extends parallel, e.g. substantially parallel, to the wall of the
vessel, when the part, e.g. the first part, of the guide portion is arranged in the
opening of the wall of the vessel. The guide portion may be configured such that the
gap is defined or formed between at least the second part of the guide portion and
the wall of the vessel, when the part, e.g. the first part, of the guide portion is
arranged in the opening of the wall of the vessel.
[0045] Various aspects and features of the invention set out above or below may be combined
with various other aspects and features of the invention as will be readily apparent
to the skilled person.
BRIEF DESCRIPTION OF THE DRAWINGS
[0046] Embodiments of the invention will now be described, by way of example only, with
reference to the accompanying schematic drawings, in which:
- Figure 1 depicts a lithographic system comprising a lithographic apparatus and a radiation
source;
- Figure 2 depicts an exemplary vessel for use with the radiation source of Figure 1;
- Figure 3 depicts a cross-sectional view of a part of an exemplary guide portion and
wall of the vessel of Figure 2;
- Figure 4 depicts a cross-sectional view of a part of an exemplary guide portion and
wall of the vessel of Figure 2;
- Figure 5 depicts a cross-sectional view of a part of an exemplary guide portion and
wall of the vessel of Figure 2;
- Figure 6 depicts an exemplary guide portion for use with the vessel of Figure 2;
- Figure 7 depicts an exemplary guide portion for use with the vessel of Figure 2;
- Figure 8 depicts an exemplary vessel module for use in the vessel of Figure 2 with
the guide portion removed;
- Figure 9 depicts an exemplary vessel module for use in the vessel of Figure 2 with
a part of the guide portion arranged in an opening of the wall;
- Figure 10 depicts a plan view of an exemplary arrangement of a plurality of spacing
elements for use in the vessel of Figure 2;
- Figure 11 depicts a cross-sectional view of another exemplary arrangement of the plurality
of spacing elements;
- Figure 12 depicts a cross-sectional view of a first part of the guide portion arranged
in the opening of the wall of the vessel of Figure 2;
- Figure 13 depicts a part of the cross-sectional view of the first part of the guide
portion arranged in the opening of the wall of Figure 12;
- Figure 14 depicts an exemplary vessel module for use in the vessel of the radiation
source of Figure 2;
- Figure 15 depicts another exemplary vessel module for use in the vessel of the radiation
source of Figure 2; and
- Figure 16 depicts another exemplary vessel module for use in the vessel of the radiation
source of Figure 2.
DETAILED DESCRIPTION
[0047] Figure 1 shows a lithographic system comprising a radiation source SO and a lithographic
apparatus LA. The radiation source SO is configured to generate an EUV radiation beam
B and to supply the EUV radiation beam B to the lithographic apparatus LA. The lithographic
apparatus LA comprises an illumination system IL, a support structure MT configured
to support a patterning device MA (e.g., a mask), a projection system PS and a substrate
table WT configured to support a substrate W.
[0048] The illumination system IL is configured to condition the EUV radiation beam B before
the EUV radiation beam B is incident upon the patterning device MA. Thereto, the illumination
system IL may include a facetted field mirror device 10 and a facetted pupil mirror
device 11. The faceted field mirror device 10 and faceted pupil mirror device 11 together
provide the EUV radiation beam B with a desired cross-sectional shape and a desired
intensity distribution. The illumination system IL may include other mirrors or devices
in addition to, or instead of, the faceted field mirror device 10 and faceted pupil
mirror device 11.
[0049] After being thus conditioned, the EUV radiation beam B interacts with the patterning
device MA. As a result of this interaction, a patterned EUV radiation beam B' is generated.
The projection system PS is configured to project the patterned EUV radiation beam
B' onto the substrate W. For that purpose, the projection system PS may comprise a
plurality of mirrors 13,14 which are configured to project the patterned EUV radiation
beam B' onto the substrate W held by the substrate table WT. The projection system
PS may apply a reduction factor to the patterned EUV radiation beam B', thus forming
an image with features that are smaller than corresponding features on the patterning
device MA. For example, a reduction factor of 4 or 8 may be applied. Although the
projection system PS is illustrated as having only two mirrors 13,14 in Figure 1,
the projection system PS may include a different number of mirrors (e.g., six or eight
mirrors).
[0050] The substrate W may include previously formed patterns. Where this is the case, the
lithographic apparatus LA aligns the image, formed by the patterned EUV radiation
beam B', with a pattern previously formed on the substrate W.
[0051] A relative vacuum, i.e. a small amount of gas (e.g. hydrogen) at a pressure well
below atmospheric pressure, may be provided in the radiation source SO, in the illumination
system IL, and/or in the projection system PS.
[0052] The radiation source SO shown in Figure 1 is, for example, of a type which may be
referred to as a laser produced plasma (LPP) source. A laser system 1, which may,
for example, include a CO
2 laser, is arranged to deposit energy via a laser beam 2 into a fuel, such as tin
(Sn), which is provided from, e.g., a fuel emitter 3. Although tin is referred to
in the following description, any suitable fuel may be used. The fuel may, for example,
be in liquid form, and may, for example, be a metal or alloy. The fuel emitter 3 may
comprise a nozzle configured to direct tin, e.g. in the form of droplets, along a
trajectory towards a plasma formation region 4. The laser beam 2 is incident upon
the tin at the plasma formation region 4. The deposition of laser energy into the
tin creates a tin plasma 7 at the plasma formation region 4. Radiation, including
EUV radiation, is emitted from the plasma 7 during de-excitation and recombination
of electrons with ions of the plasma.
[0053] The EUV radiation from the plasma is collected and focused by a collector 5. Collector
5 comprises, for example, a near-normal incidence radiation collector 5 (sometimes
referred to more generally as a normal-incidence radiation collector). The collector
5 may have a multilayer mirror structure which is arranged to reflect EUV radiation
(e.g., EUV radiation having a desired wavelength such as 13.5 nm). The collector 5
may have an ellipsoidal configuration, having two focal points. A first one of the
focal points may be at the plasma formation region 4, and a second one of the focal
points may be at an intermediate focus 6, as discussed below.
[0054] The laser system 1 may be spatially separated from the radiation source SO. Where
this is the case, the laser beam 2 may be passed from the laser system 1 to the radiation
source SO with the aid of a beam delivery system (not shown) comprising, for example,
suitable directing mirrors and/or a beam expander, and/or other optics. The laser
system 1, the radiation source SO and the beam delivery system may together be considered
to be a radiation system.
[0055] Radiation that is reflected by the collector 5 forms the EUV radiation beam B. The
EUV radiation beam B is focused at intermediate focus 6 to form an image at the intermediate
focus 6 of the plasma present at the plasma formation region 4. The image at the intermediate
focus 6 acts as a virtual radiation source for the illumination system IL. The radiation
source SO is arranged such that the intermediate focus 6 is located at or near to
an opening 8 in an enclosing structure 9 of the radiation source SO.
[0056] The radiation source SO may comprise an on state, in which EUV radiation is produced.
The radiation source SO may comprise an off state, in which no EUV radiation is produced.
The radiation source SO may be operative between the on state and the off state.
[0057] Figure 2 shows an exemplary vessel 16 for use with the radiation source shown in
Figure 1. The vessel 16 may be part of or comprised in the radiation source SO. The
enclosing structure 9, which is shown in Figure 1, may be defined by or comprised
in the vessel 16. The term "vessel" may be considered as encompassing a vacuum vessel,
pressure vessel, vacuum chamber or pressure chamber or the like. In other words, the
vessel 16 may be considered as providing an enclosure to a vacuum or low pressure
environment of the radiation source SO. As described above, a pressure of a gas in
the vessel 16 may be below atmospheric pressure. The vessel 16 may be configured to
enclose one or more components of the radiation source SO, such as the collector 5
and/or the fuel emitter 3.
[0058] The vessel 16 comprises a guide portion 18 for directing fuel debris from the plasma
formation region 4 of the radiation source SO towards a fuel debris removal device
20. Fuel debris may include particulate debris, such as Sn clusters, Sn microparticles,
Sn nanoparticles, and/or Sn deposits, molecular and/or atomic debris, such as Sn vapor,
SnH
x vapor, Sn atoms, Sn ions, e.g. when tin is used as a fuel. Fuel debris may mix with
the gas, e.g. hydrogen, which may be present in the radiation source SO. This fuel
debris-gas mixture may be directed towards the debris removal device 20 by the guide
portion 18. The fuel debris removal device 20 may be configured to separate the fuel
debris, e.g. at least a part thereof, from the gas. The fuel debris removal device
20 may be provided in the form of a scrubber or the like.
[0059] The vessel 16 comprises a wall 16a. The wall 16 may define an inner surface of the
vessel 16 or a part thereof. The wall 16a comprises an opening 16e. At least a part
of the guide portion 18 is arranged in the opening 16e of the wall 16a so that a gap
22 is defined or formed between the guide portion 18 and the wall 16a. The vessel
16 may comprise a gas supply system 24 for supplying a gas into the gap 22 to control
a transfer of heat between the guide portion 18 and the wall 16a. The gas supply system
24 may be part of or comprised in a debris mitigation system (not shown), which may
be part of the vessel 16. It will be appreciated that the terms "transfer of heat"
may be interchangeably used with the terms "flow of heat."
[0060] At least some of the fuel debris may be deposited on the guide portion 18, e.g. at
least a part thereof. For example, when EUV radiation is produced by the radiation
source SO, it may be desirable to maintain a temperature of the guide portion 18 below
a melting temperature of the fuel. For example, when tin is used as the fuel, it may
be desirable to maintain the temperature of the guide portion 18 below 200°C, which
is below a melting temperature of tin of about 230°C. This may prevent or reduce contamination
of one or more components of the radiation source SO, such as the collector 5. At
temperatures above the melting temperature of the fuel, the fuel debris may become
liquid and/or drip or be otherwise ejected on one or more components of the radiation
source SO. The ejection of the liquid fuel debris may be referred to as spitting.
The ejection of the liquid fuel debris may be due to the interaction between hydrogen
radicals and the liquid fuel debris. For example, hydrogen (H
2) molecules may split into hydrogen radicals due to their absorption of heat and/or
EUV radiation or ion collisions. Expressed differently, under the influence of, for
example, the EUV radiation a hydrogen plasma may be formed in the radiation source
SO. The hydrogen plasma may contain reactive species (H, H
+, or the like), which may be referred to as hydrogen radicals. The hydrogen radicals
may remove, e.g. etch, fuel debris from one or more components of the radiation source,
e.g. the collector 5. However, it has been found that some of the hydrogen radicals,
such as H
+, may penetrate liquid fuel debris layers and form hydrogen bubbles inside the liquid
fuel debris layers. The bubbles may breach the surface and on subsequent collapse
of one or more bubbles, fuel debris, e.g. particulate fuel debris, may be ejected
or emitted into the radiation source SO. This bubbling or spitting of liquid fuel
debris may be considered as a significant cause of contamination of one or more components
of the radiation source, such as the collector 5.
[0061] By configuring the gas supply system 24 to supply the gas into the gap 22, cooling
or heating of the guide portion 18 may be controlled and/or improved. It may be desirable
to cool the guide portion 18, when EUV radiation is produced by the radiation source
SO. For example, the gas may be supplied into the gap 22 to allow for cooling of the
guide portion 18 to below a melting temperature of the fuel, e.g. tin. This is in
turn may decrease contamination of one or more components of the radiation source
SO, e.g. by reducing dripping, bubbling and/or spitting of the like of liquid fuel
debris. It may be desirable to heat the guide portion 18, when the radiation source
is off, e.g. no EUV radiation is produced by the radiation source SO, as will be described
below in more detail.
[0062] When EUV radiation is produced by the radiation source SO, a temperature of the guide
portion 18 may increase to about 300°C or larger. This may cause damage and/or corrosion
of the guide portion 18. For example, the guide portion 18 may comprise a metal material
or metal alloy material, such as stainless steel. Some metal alloy materials, such
as stainless steel, may start to corrode and/or become damaged at a temperature of
about 400°C or above. By configuring the gas supply system 24 to supply the gas into
the gap 22, cooling of the guide portion 18 may be controlled and/or improved, e.g.
when EUV radiation is produced by the radiation source SO. This may lead to a reduction
in corrosion and/or damage of the guide portion 18 and/or an increase in the lifetime
of the guide portion 18.
[0063] The gas supply system 24 may be operable between a first configuration and a second
configuration. For example, the gas supply system 24 may comprise a mass flow controller
25. The mass flow controller 25 may comprise a controllable valve 25a. The mass flow
controller 25 may be configured to operate the valve 25a between an open and a closed
state. In the first configuration, the gas supply system 24 may be configured to supply
the gas into the gap 22, e.g. to increase a transfer of heat between the guide portion
18 and the wall 16a. In other words, in the first configuration of the gas supply
system 24, thermal conduction between the guide portion 18 and the wall 16a may be
increased. This may allow for cooling of the guide portion 18, e.g. when EUV radiation
is produced by the radiation source SO. In the first configuration of the gas supply
device 24, the mass flow controller 25 may be configured to operate the valve 25a
in the open state. For example, the mass flow controller 25 may be configured to open
the valve 25a so that the gas is supplied to the gap 22 at a target mass flow rate.
In this embodiment, the target mass flow rate may be in the region of about 8 × 10
-5 kg/s (5 1/min). It will be appreciated that in other embodiments, the target mass
flow rate may be between about 8 × 10
-5 kg/s (5 l/min) and 0.8 kg/s (50 l/min).
[0064] In the second configuration, the gas supply system 24 may be configured to supply
no gas into the gap 22, e.g. to decrease a transfer of heat between the guide portion
18 and the wall 16a. For example, in the second configuration, the gas supply system
24 may be configured to terminate or stop a supply of gas into the gap 22. In the
second configuration of the gas supply system 24, thermal conduction between the guide
portion 18 and the wall 16a may be decreased, e.g. relative to the thermal conduction
between the guide portion 18 and the wall 16a, when the gas supply system 24 is in
the first configuration. This may allow for heating of the guide portion 18, e.g.
when no EUV radiation is produced by the radiation source SO. In the second configuration
of the gas supply device 24, the mass flow controller 25 may be configured to operate
the valve in the closed state. The gas supply system 24 may be configured to operate
in the first configuration, when EUV radiation is produced by the radiation source
SO. The gas supply system 24 may be configured to operate in the second configuration,
when no EUV radiation is produced by the radiation source SO.
[0065] The transfer of heat may be expressed by the heat transfer coefficient
h:

where
q is the heat flux and
ΔT is a difference in temperature.
[0066] The heat transfer coefficient
h of the gas in the gap 22 may be dependent on a pressure of the gas in the gap 22.
The gas supply system 24 may be configured to control a pressure of the gas in the
gap 22 to control the transfer of heat between the guide portion 18 and the wall 16a.
For example, the gas supply system 24 may be configured to increase or decrease the
pressure of the gas in the gap 22 to increase or decrease the heat transfer coefficient
h of the gas in the gap 22. For example, when the gas supply system 24 is in the first
configuration, a pressure of the gas in the gap 22 may be greater than a pressure
of the gas in the gap 22, when the gas supply system 24 is in the second configuration.
[0067] The gas may comprise a thermal conductivity at room temperature between about 0.02
W/mK and 0.18 W/mK. The gas may comprise an inert gas. The gas may be selected from
at least one of hydrogen, nitrogen and helium. In an exemplary embodiment, hydrogen
may be used as the gas. As described above, hydrogen may already be used in the radiation
source SO. However, it will be appreciated that in other embodiments other gases,
such as nitrogen, helium or mixtures thereof may be used.
[0068] In embodiments where hydrogen is used as the gas, a pressure of the gas in the gap
22 may be between about 10 kPa (100 mbar) and 20 kPa (200 mbar), when the gas supply
system 24 is in the first configuration. This may result in a heat transfer coefficient
h between about 500 W/m
2K and 1500 W/m
2K. For example, when a size of the gap 22 is about 0.25 mm and a pressure of the gas
in the gap 22 is about 15 kPa, the heat transfer coefficient
h may be about 750 W/m
2K. A decrease in pressure of the gas in the gap 22 may result in a decrease of the
thermal heat transfer coefficient
h of the gas in the gap 22. When the gas supply system 24 is the second configuration,
a pressure of the gas in the gap 22 may be between about 100 Pa (1 mbar) and 200 Pa
(2 mbar). This may result in a heat transfer coefficient
h between 10 W/m
2K and 100 W/m
2K. For example, when the size of the gap 22 is about 0.25 mm and a pressure of the
gas in the gap 22 is of about 150 Pa (1.5 mbar), the heat transfer coefficient
h may be about 85 W/m
2K. It will be appreciated that in other embodiments, a pressure of the gas in the
gap may be different from the exemplary pressures described above. When the gas supply
system 24 is operated in the second configuration, the pressure of the gas in the
gap 22 may decrease and/or reach equilibrium with the pressure of the gas in radiation
source SO, e.g. the vessel 16. For example, the pressure of the gas in the radiation
source SO, e.g. the vessel 16, may be between about 100 Pa (1 mbar) and 200 Pa (2
mbar), such as 150 Pa (1.5 mbar). The guide portion 18 may be arranged in the opening
16e of the wall 16a so that the gap 22 is communicably coupled with an interior of
the radiation source SO, e.g. an interior of radiation source SO, e.g. the vessel
16. For example, the guide portion 18 may be arranged in the opening 16e of the wall
16a so that some of the gas in the gap 22 may be allowed to leak or flow into the
vessel 16. In other words, the guide portion 18 may be arranged in the opening 16e
of the wall 16a so that some gas exchange between the gap 22 and the vessel 16 is
allowed. This may allow for the pressure of the gas in the gap 22 to decrease and/or
reach an equilibrium with the pressure of the gas in radiation source SO, e.g. the
vessel 16, e.g. when the gas supply system 24 is in the second configuration. The
gas supply system 24 may be configured to control a pressure of the gas in the gap
22, e.g. based on a type of gas and/or a size of the gap. For example, a gas other
than hydrogen may have a different thermal conductivity, which may require a different
pressure of the gas in the gap to result in a desired heat transfer coefficient. However,
a pressure of a gas other than hydrogen may be selected to be similar or the same
as that described above, e.g. when the gas supply system is in the first or second
configuration, in order to avoid varying the pressure of the gas in the radiation
source, e.g. the vessel. Additionally or alternatively, the heat transfer coefficient
h of the gas in the gap 22 may depend on the size of the gap 22. As such, when the
size of the gap is varied, a heat transfer coefficient
h of the gas in the gap 22 may be varied too. The size of the gap 22 may be in between
about 0.1mm and 1mm, such as about 0.25mm. For example, when the pressure of the gas
in the gap 22 is in the region of about 15 kPa, the heat transfer coefficient
h may vary between about 1700 W/m
2K and 195 W/m
2K for a size of the gap 22 varying between about 0.1mm and 1mm.
[0069] Referring to Figure 2, the vessel 16 may be provided in the form of a modular vessel.
For example, the vessel 16 may comprise three modules 16b, 16d, 16c. A first module
16b of the vessel 16 may be arranged in proximity to the plasma formation region 4.
The first module 16b of the vessel 16 may be arranged to surround the plasma formation
region 4. A second module 16c of the vessel 16 may be arranged in proximity to the
intermediate focus 6. A third module 16d of the vessel 16 may be arranged between
the first and second modules 16b, 16c of the vessel 16. The wall 16a may be comprised
in the third module 16d of the vessel 16. Each of the first, second and third modules
16b, 16c, 16d of the vessel 16 may comprise a truncated conical shape. It will be
appreciate that the modules of the vessel disclosed herein are not limited to having
a truncated conical shape. For example, in other embodiments, the modules of the vessel
may each comprise cylindrical or polyhedral shape or the like. Additionally or alternatively,
it will be appreciated that the vessel disclosed herein is not limited to having three
modules. For example, in other embodiments, the vessel may have more or less than
three modules. It will be appreciated that the guide portion 18 may be or define another
module of the vessel 16.
[0070] Figure 3 shows a cross-sectional view of a part of the guide portion 18 and the wall
16a. As can be seen in Figure 3, the gap 22 is defined between the guide portion 18
and the wall 16a. For example, in use, the wall 16a may be subjected to a cooling
source. The vessel 16 may comprise a plurality of cooling elements 26, five of which
are shown in Figure 3. The cooling elements 26 may be part of or comprised in the
cooling source. It will be appreciated that in other embodiments, the vessel may comprise
more or less than five cooling elements. The cooling elements 26 may be part of or
comprised in the wall 16a of the vessel 16. The cooling source may be configured to
cool the wall 16a of the vessel 16. The cooling source may be configured to cool the
wall 16a to a temperature below 150°C. For example, the cooling source may be configured
to cool the wall 16a to a temperature in the region of about 40°C to 60°C, such as
about 50°C. The cooling elements 26 may be provided in the form of coolant channels.
The cooling elements 26 may be configured for transporting a coolant, such as a coolant
fluid or gas. For example, the coolant may comprise water. The wall 16a may comprise
a metal material or metal alloy material. The metal material or metal alloy material
may be selected to have a thermal conductivity of about 200 W/mK or greater at room
temperature, e.g. to allow for sufficient cooling by the cooling source. In this embodiment,
the metal material or metal alloy material may comprise aluminium.
[0071] For example, in use, the guide portion 18 may be subjected to a heating source. The
guide portion 18 may be arranged in the vessel 16 so that, for example in use, the
guide portion 18 is subjected to heat generated at the plasma formation region 4 of
the radiation source SO. The heat generated at the plasma formation region 4 of the
radiation source SO is indicated by the arrows in Figure 3. This heat may result in
an increase of the temperature of the guide portion 18, e.g. to above the melting
temperature of the fuel. This may in turn result in dripping, spitting and/or bubbling
of fuel debris deposited on the guide portion 18, which may cause contamination of
one or more components of the radiation source SO, such as the collector 5. As described
above, when EUV radiation is produced by the radiation source SO, the gas supply system
24 may be operated in the first configuration. The gas supply system 24 may supply
the gas into the gap 22, e.g. to increase the transfer of heat between the guide portion
18 and the wall 16a. Expressed differently, by supplying the gas in the gap 22, heat
may be transferred from the guide portion 18 to the wall 16a. This may lead a decrease
of a temperature of the guide portion 18. In examples, where the heat generated at
the plasma formation region 4 is in the region of about 2 kW, the pressure of the
gas in the gap 22 may be between about 10 kPa and 20 kPa. This pressure of the gas
in the gap 22 may result in a heat transfer coefficient
h between about 500 W/m
2K and 1500 W/m
2K between the guide portion 18 and the wall 16a, as described above. As such, a temperature
of the guide portion 18 may be decreased to below 150°C, such as between about 70
°C and 120°C. By reducing a temperature of the guide portion 18 to below 150°C, dripping,
spitting and/or bubbling of fuel debris deposited on the guide portion 18 may be reduced
or prevented. This may lead to a reduction in the contamination of other components
of the radiation source SO, such as the collector 5. Additionally or alternatively,
by reducing a temperature of the guide portion 18 to below 150°C, damage, degradation
and/or corrosion of the guide portion 18 may be reduced.
[0072] The heating source may comprise a plurality of heating elements 28, six of which
are shown in Figure 3. The heating elements 28 may be part of or comprised in the
guide portion 18. It will be appreciated that in other embodiments, the guide portion
may comprise more or less than six heating elements. The heating elements 28 may be
configured to heat the guide portion 18, e.g. when no EUV radiation is produced by
the radiation source SO. The heating elements 28 may be configured to heat the guide
portion 18 during maintenance operations of the radiation source SO, e.g. to allow
removal of fuel debris from the guide portion 18 and/or other components of the radiation
source SO. The heating source may be configured to heat the guide portion 18 to a
temperature greater than a melting temperature of the fuel. In embodiments, where
tin is used as the fuel, the heating source may be configured to heat the guide portion
18 to a temperature above 230°C. This may allow for removal of fuel debris from the
guide portion 18. As described above, the gas supply system 24 may be configured to
operate in the second configuration, e.g. when no EUV radiation is produced by the
radiation source SO. In the second configuration, the gas supply system 24 may supply
no gas to the gap 22, e.g. to decrease the transfer of heat between the guide portion
18 and the wall 16a. In such examples, a pressure of the gas in the gap 22 may be
between about 100 Pa and 200 Pa, which may result in a heat transfer coefficient
h between about 10 W/m
2K and 100 W/m
2K. As such, heat transfer between the guide portion 18 and the wall 16a may be reduced,
e.g. to allow the heating elements 28 to heat the guide portion 18 to a temperature
above the melting temperature of the fuel. For example, when a power of about 2 kW
is applied to the heating elements 28, a temperature of the guide portion 18 may be
increased to between about 270°C and 330°C. This may allow for removal of fuel debris
from the guide portion 18, e.g. during maintenance operations of the radiation source
SO. For example, the fuel debris may become liquid and drip-off from the guide portion
18 or parts thereof. The liquid fuel debris may be collected in a reservoir, such
as a fuel reservoir.
[0073] By configuring the gas supply system 24 to supply the gas into the gap 22, cooling
or heating of the guide portion 18 may be controlled or adjusted more precisely. This
may reduce or avoid the use of heating elements with increased capacity, for example
to counteract an increased cooling capacity of the cooling source, e.g. the cooling
elements. For example, an increase of the capacity of the cooling source may be necessary,
when the power of the EUV radiation produced by the radiation source SO is increased.
By reducing or avoiding the use of heating elements with an increased capacity, damage
or deformation of one or more components of the radiation source, which may be arranged
in proximity to the heating elements, may be reduced or avoided.
[0074] Figure 4 shows another cross-sectional view of a part of the guide portion 18 and
the wall 16a. The embodiment shown in Figure 4 is similar to that described above
in relation to Figure 3. As such, any features described above in relation to Figure
3 may also apply to the embodiment shown in Figure 4. In Figure 4, the cooling elements
26 have been omitted for the sake of clarity. However, it will be appreciated that
in the embodiment shown in Figure 4, the vessel 16 may comprise the cooling elements
26, as described above.
[0075] The vessel 16 may comprises at least one restriction element or a plurality of restriction
elements 30 for maintaining a pressure of the gas in the gap 22. For example, the
restriction element(s) 30 may be configured to reduce a flow of gas in and/or along
the gap 22, e.g. into the radiation source SO, to maintain the pressure in the gap
22. The restriction element(s) 30 may be configured to create a pressure differential
between the pressure of the gas in the gap 22 and the pressure of the gas in the radiation
source SO, e.g. the vessel 16, for example, when the gas supply system 24 is in the
first configuration. The restriction element(s) 30 may be provided in the form of
a plurality of restriction elements. In the embodiment shown in Figure 4, the restriction
element(s) 30 are arranged in the gap 22. It will be appreciated that in other embodiments,
the restriction elements may be arranged in or on other parts of the vessel, such
as in the wall.
[0076] In this embodiment, the restriction element 30 may be provided in the form of a corrugated
structure 30a. The corrugated structure 30a may be formed from a metal or metal alloy,
such as stainless steel. The corrugated structure 30 may comprise a plurality of troughs
30b and peaks 30c. The corrugated structure 30a, may be configured to reduce a flow
of the gas 32 along the gap 22, e.g. in a direction parallel, e.g. substantially parallel,
to the wall 16a. For example, the corrugated structure 30a may be configured so that
a flow of gas 32 between the troughs 30b and the peaks is reduced. However, the corrugated
structure 30a may be configured so that some gas may flow between the troughs 30b
and peaks 30c, e.g. adjacent troughs 30b and peaks 30c. This may prevent a pressure
built-up or pressure drop in one or more of the troughs 30b and/or peaks 30c of the
corrugated structure 30a. For example, a size of the through 30b and peaks 30c may
be smaller than a size of the gap 22. A gap 31a may be defined between the corrugated
structure 30, e.g. the troughs 30b thereof, and the guide portion 18 and/or a gap
31b may be formed between the corrugated structure 30a, e.g. the peaks 30c thereof,
and the wall 16a.
[0077] Figure 5 shows another cross-sectional view of a part of the guide portion 18 and
the wall 16a. The embodiment shown in Figure 5 is similar to the embodiments described
above in relation to Figures 3 and 4. As such, any features described above in relation
to Figures 3 and 4 may also apply to the embodiment shown in Figure 5. In Figure 5,
the cooling elements 26 have been omitted for the sake of clarity. However, it will
be appreciated that in the embodiment shown in Figure 5, the vessel 16 may comprise
the cooling elements 26, as described above.
[0078] Referring to Figure 5, the vessel 16 may comprise a plurality of inlets 34, five
of which are shown in Figure 5, for directing the gas into the gap 22. It will be
appreciated that in other embodiments, the vessel may comprise more or less than five
inlets. The inlets 34 may be arranged in the wall 16a. The inlets 34 may be provided
in the form of nozzles, which may be arranged to direct the flow of gas 32 into the
gap 22. Although the inlets 34 are only shown in the embodiment shown in Figure 5,
it will be appreciated that any of the features of the inlets 34 may also apply to
the embodiments described above.
[0079] In this embodiment, the restriction elements 30 may be provided in the form of a
plurality of outlets 30d. The outlets 30d may be part of the wall 16a. The outlets
30d may be configured to restrict the flow of gas 32 from the gap 22, e.g. to maintain
a pressure in the gap 22. For example, the outlets 30c may be provided in the form
of slits or orifice or the like. A size of each outlet 30d may be selected so that
the flow of gas 32 from the gap 22 through the outlets 30d is restricted or reduced.
The outlets 30d may each comprise a sealing element (not shown), such a leaking sealing
element or O-ring or the like. The outlets 30d may each comprise the sealing element
to reduce or restrict the flow of gas 32 from the gap 22 through the outlets 30d.
This may allow for a pressure of the gas in the gap 22 to be maintained. It will appreciated
that the outlets 30d may be used in addition or alternatively to the corrugated structure
30a. Although in the above description the restriction element(s) are described as
being provided in the form of a corrugated structure and/or outlets, it will be appreciated
that in other embodiments another structure or element may be used to maintain the
pressure of the gas in the gap.
[0080] Figures 6 and 7 show an exemplary guide portion 18 for use with the vessel 16. The
guide portion 18 may comprise a first part 18a and a second part 18b. The first part
18a of the guide portion 18 may be configured to be arranged in the opening 16e of
the wall 16a. The first part 18a of the guide portion 18 may be provided in the form
of a tubular portion or conduit. The first part 18a of the guide portion 18 may comprise
a shape that corresponds to a shape of the opening 16e of the wall 16a. For example,
the first part 18a may comprise a round shape, such as a shape having a circular cross-section,
e.g. substantially circular cross-section, or elliptical cross-section, e.g. substantially
elliptical cross-section, or the like. A size or dimension, such as a radius and/or
circumference, of the first part 18a of the guide portion 18 may be smaller than a
size or dimension, such as a radius and/or circumference, of the opening 16e of the
wall 16a of the vessel 16. This may allow for the gap 22 to be defined or formed between
at least the first part 18a of the guide portion and the opening 16e of the wall 16a
of the vessel 16.
[0081] The first part 18a of the guide portion 18 may be configured for connection to another
conduit (not shown), which may be configured to connect the guide portion 18 to the
fuel debris removal device 20.
[0082] The second part 18b of the guide portion 18 may protrude or extend from the first
part 18a of the guide portion 18. For example, the second part 18b of the guide portion
18 may extend perpendicularly, e.g. substantially perpendicularly, from the first
part 18a of the guide portion 18. The second part 18b of the guide portion 18 may
comprise a curved shape, which may correspond, e.g. substantially correspond, to a
shape of the wall 16a. For example, when the first part 18a the guide portion 18 is
arranged in the opening 16e of the wall 16a, the second part 18b of the guide portion
18 may extend parallel, e.g. substantially parallel, to the wall 16a of the vessel
16, as for example shown in Figure 2.
[0083] The heating elements 28 are schematically indicated by the blocks in Figures 6 and
7. Although two blocks 28 are shown in Figures 6 and 7, it will be appreciated that
each block may be indicative of one or more heating elements 28. The heating elements
28 may be arranged on the guide portion 18, e.g. so that the heating elements 28 are
located in the gap 22, when the first part 18a of the guide portion 18 is arranged
in the opening 16e of the wall 16a. For example, the heating elements 28 may be arranged
on a surface 18c of the guide portion 18. The gap 22 may be defined between the surface
18c of the guide portion 18 and the wall 16a, when the first part 18a of the guide
portion 18 is arranged in the opening 16e. The heating elements 28 may be arranged
on the surface 18c of the guide portion 18 so as to uniformly heat the guide portion
18, for example during maintenance operations of the heating source SO.
[0084] Figures 8 and 9 show an exemplary vessel module for use in the vessel 16 of the radiation
source SO shown in Figure 2. The vessel module shown in each of Figure 8 and 9 may
be provided in the form of the third vessel module 16d, as described above in relation
to Figure 2. Figure 8 shows the third vessel module 16d with the guide portion 18
removed. Figure 9 shows the third vessel module 16d with the first part 18a of the
guide portion 18 arranged in the opening 16e of the wall 16a.
[0085] The third vessel module 16d may comprise an enclosing structure 36. The enclosing
structure 36 may be configured to surround the wall 16a of the third vessel module
16d. The enclosing structure 36 may form an outer surface of the third vessel module
16d. The enclosing structure 36 may comprise an opening 36a. A size and/or shape of
the opening 36a of the enclosing structure 36 may correspond to a size and/or shape
of the opening 16e in the wall 16a.
[0086] Referring to Figure 8, the opening 16e of the wall 16a may comprise a round shape.
For example, the opening 16e may comprise a circular cross-section, e.g. substantially
circular cross-section, or elliptical cross-section, e.g. substantially elliptical
cross-section, or the like.
[0087] When the first part 18a of the guide portion 18 is arranged in the opening 16e of
the wall 16a, the gap 22 may be defined between the first part 18a of the guide portion
18 and a periphery 16f of the opening 16e in the wall 16a. The gap 22 may extend between
first part 18a of the guide portion 18 and the opening 36a of the enclosing structure
36, e.g. a periphery thereof. The gap 22 may also be defined between the second part
18b of the guide portion 18 and the wall 16a, e.g. a part 16g of the wall 16a, which
can be best seen in Figure 2. The gap 22 may extend between the second part 18b of
the guide portion 18 and the wall 16a, e.g. the part 16g thereof.
[0088] Referring to Figure 9, when the first part 18a of the guide portion 18 is arranged
in the opening 16e of the wall 16a, the first part 18a of the guide portion 18 may
protrude from the wall 16a in an outward direction. The first part 18a of the guide
portion 18 may also protrude from the enclosing structure 36 in the outward direction.
This may facilitate connection of the guide portion 18 to the other conduit and/or
the fuel debris removal device 20.
[0089] Figure 10 shows a plan view of an exemplary arrangement 42 of a plurality of spacing
elements 40 for use in the vessel 16. The plurality of spacing elements 40 may be
part of or comprised in the vessel 16. The plurality of spacing elements 40 may be
configured for maintaining a size of the gap 22. For example, the spacing elements
40 may be configured to control the size of the gap 22. The spacing elements 40 be
configured to determine a tolerance of the size of the gap 22, e.g. during manufacture
of the guide portion 18 and/or the third vessel module 16. As described above, the
size of the gap 22 may be between about 0.1mm and 1mm, such as about 0.25mm. For example,
the spacing elements 40 may be part of the wall 16a. Alternatively or additionally,
the spacing elements 40 may be part of the guide portion 18.
[0090] Referring to Figure 10, the arrangement 42 of the spacing elements 40 may be arranged
on the wall 16a, e.g. opposite to the second part 18b of the guide portion 18. For
example, the arrangement 42 of the spacing elements 40 may be arranged on the part
16g of the wall 16a, which may be opposite to the second part 18b of the guide portion
18, when the first part 18a of the guide portion 18 is arranged in the opening 16e
of the wall 16a, as shown in Figure 2. The spacing elements 40 may be arranged on
the wall 16a to extend into the gap 22 and to face the second part 18b of the guide
portion 18. The arrangement 42 of the spacing elements 40 may comprise the inlets
34 and the outlets 30d, as described above. The inlets 34 may be arranged between
at least two of the spacing elements 40. For example, the inlets 34 may be equidistantly
arranged between the spacing elements 40. It will be appreciated that in other embodiments,
the inlets may be differently arranged. The outlets 30d may be arranged so as to surround
the spacing elements 40 and the inlets 34. For example, the outlets 30d may be arranged
on a periphery 42a of the arrangement 42. However, it will be appreciated that in
other embodiments, the outlets may be differently arranged.
[0091] Figure 11 shows a cross-sectional view of another exemplary arrangement 44 of the
spacing elements 40. The arrangement 44 shown in Figure 11 may comprise any of the
features of the arrangement 42 shown in Figure 10. However, it will be appreciated
that the arrangement 44 of the spacing elements 40 shown in Figure 11 may find applicability
on a different part of the wall 16a. For example, the spacing elements 40 may be arranged
between the first part 18a of the guide portion 18 and the opening 16e of the wall
16a. The spacing elements 40 may be arranged on the periphery 16f of the opening 16e.
The spacing elements 40 may be arranged on the wall 16a, e.g. on the periphery 16f
of the opening 16e, e.g. so as to extend towards an interior or centre of the opening
16e, as will be described below. It will be appreciated that in other embodiments,
the spacing elements may additionally or alternatively be arranged on the guide portion.
[0092] In the exemplary embodiments shown in Figures 10 and 11, each spacing element 40
may be provided in the form of a round or semi-round structure, such as a burl. However,
it will be appreciated that in other embodiments, each spacing element may have a
different shape. The size G of the gap 22 is indicated in Figure 11. A height H of
each spacing element 40 may be determined by one or more manufacturing tolerances
of the size G of the gap 22. However, it will be appreciated that the height H of
each spacing element 40 may correspond to a minimum of the allowed size G of the gap
22. Although a plurality of spacing elements are described above, it will be appreciated
that in other embodiments, the vessel may comprise single or at least one spacing
element.
[0093] The vessel 16 may comprise a fastening element 46 for fastening the guide portion
18 to the wall 16a. The fastening element 46 may be configured for detachably fastening
the guide portion 18 to the vessel 16, e.g. the wall 16a. For example, the fastening
element 46 may be provided in the form of a bolt and nut arrangement or a bolt and
bolt-hole arrangement or the like. Although only one fastening element 46 is shown
in Figure 11, it will be appreciated that the vessel may comprise more than one fastening
element for fastening the guide portion to the vessel, e.g. the wall.
[0094] Figure 12 shows a cross-sectional view of the first part 18a of the guide portion
18 arranged in the opening 16e of the wall 16a. The first part 18a of the guide portion
18 may be concentrically arranged in the opening 16e of the wall 16a. In the exemplary
embodiment shown in Figure 12, three inlets 34 are provided in the wall 16a.
[0095] Figure 13 shows a part of the cross-sectional view of the first part 18a of the guide
portion 18 arranged in the opening 16e of the wall 16a shown in Figure 12. The spacing
elements 40 may be arranged between the first part 18a of the guide portion 18a and
the opening 16e of the wall 16a. By arranging the spacing elements 40 between the
first part 18a of the guide portion 18 and the opening 16e of the wall 16a, the spacing
elements 40 may apply a tension or pre-tension on the first part 18a of the guide
portion 18 and/or prevent expansion of at least the first part 18a of the guide portion
18, in use.
[0096] The spacing elements 40 may be arranged between the first part 18a of the guide portion
18a and the opening 16e of the wall 16a, e.g. so as to extend towards a centre of
the opening 16e. The spacing elements 40 may be circumferentially arranged on the
periphery 16f of the opening 16e of the wall 16a. It will be appreciated that in other
embodiments, the spacing elements may additionally or alternatively be arranged on
the guide portion, e.g. the first part and/or second part thereof.
[0097] Figure 14 shows an exemplary vessel module 48 for use in a vessel, such as the vessel
16 of the radiation source SO shown in Figure 2. The vessel module 48 may be provided
in the form of the third vessel module 16d, described above. As such, any features
described above in relation to the third vessel module 16d may also apply to the vessel
module 48 shown in Figure 14.
[0098] The vessel module 48 comprise a wall 50 comprising a first portion 50a and a second
portion 50b. The first portion 50a of the wall 50 may be provided in the form of an
inner wall of the vessel module 48. The second portion 50b may be provided in the
form of an outer wall of the vessel module 48. A gap 52 is defined between the first
portion 50a and the second portion 50b of the wall 50. In the exemplary embodiment
shown in Figure 14, the vessel module 48 comprises the guide portion 18 for directing
fuel debris from the plasma formation region 4 of the radiation source SO towards
the fuel debris removal device 20, as described above. However, it will be appreciated
that in other embodiments the vessel module may not comprise the guide portion. The
wall 50 may comprise an opening 50c. At least a part of the guide portion 18 is arranged
in the opening 50c of the wall, e.g. so that the gap 52 extends between the guide
portion 18, the first portion 50a and the second portion 50b of the wall 50. The second
portion 50b of the wall 50 may comprise any features of the wall 16a described above.
[0099] The vessel module 48 may be configured for connection to the gas supply system 24.
In this embodiment, the gas supply system 24 may be configured to supply a gas into
the gap 52 to control a transfer of heat between the first portion 50a and the second
portion 50b of the wall 50. The gas supply system 24 shown in Figure 14 may comprise
any of the features of the gas supply system, described above. It will be appreciated
that in other embodiments, the gas supply system may be part of or comprised in the
vessel module.
[0100] As described above, the gas supply system 24 may be operable between the first configuration
and the second configuration. The gas supply system 24 may comprise the mass flow
controller 25. The mass flow controller 25 may comprise the controllable valve 25a.
The mass flow controller 25 may be configured to operate the valve 25a between the
open and the closed state. In the first configuration, the gas supply system 24 may
be configured to supply the gas into the gap 52, for example to increase a transfer
of heat between the first portion 50a and the second portion 50b of the wall 50. In
other words, in the first configuration of the gas supply system 24, thermal conduction
between the first portion 50a and the second portion 50b of the wall 50 may be increased.
In the first configuration of the gas supply device 24, the mass flow controller 25
may be configured to operate the valve in the open state. For example, the mass flow
controller 25 may be configured to open the valve 25a so that gas is supplied to the
gap 52 at a target mass flow rate.
[0101] In the second configuration, the gas supply system 24 may be configured to terminate
a supply of gas into the gap 52, for example to decrease a flow of heat between the
first portion 50a and the second portion 50b of the wall 50. Expressed differently,
in the second configuration, the gas supply system 24 may be configured to supply
no gas into the gap 52. In the second configuration of the gas supply system 24, thermal
conduction between the first portion 50a and the second portion 50b may be decreased,
for example relative to the thermal conduction between the first portion 50a and the
second portion 50b of the wall 50, when the gas supply system 24 is in the first configuration.
In the second configuration of the gas supply device 24, the mass flow controller
25 may be configured to operate the valve in the closed state. The gas supply system
24 may be operated in the first configuration, when EUV radiation is produced by the
radiation source SO. The gas supply system 24 may be operated in the second configuration,
when no EUV radiation is produced by the radiation source SO.
[0102] The heat transfer coefficient of the gas in the gap 52 may be dependent on a pressure
of the gas in the gap 52. The gas supply system 24 may be configured to control a
pressure of the gas in the gap 52 to control the transfer of heat between the first
portion 50a and the second portion 50b of the wall. For example, the gas supply system
24 may be configured to increase or decrease the pressure of the gas in the gap 52
to increase or decrease the heat transfer coefficient
h of the gas in the gap 52. For example, when the gas supply system 24 is in the first
configuration, a pressure of the gas in the gap 52 may be greater than a pressure
of the gas in the gap 52, when the gas supply system 24 is in the second configuration.
For example, when the gas supply system 24 is in the first configuration, the pressure
of the gas in the gap 52 may be between about 10 kPa and 20 kPa. For example, when
the gas supply system 24 is in the second configuration, the pressure of the gas in
the gap 52 may be between about 100 Pa and 200 Pa. A pressure of the gas in the gap
52 may depend on the size of the gap 52 and/or the type of gas. The gas may comprise
a thermal conductivity at room temperature between about 0.02 W/mK and 0.18 W/mK.
The gas may comprise an inert gas. The gas may be selected from at least one of hydrogen,
nitrogen and helium. In an exemplary embodiment, hydrogen may be used as the gas.
As described above, hydrogen may already be used in the radiation source SO. However,
it will be appreciated that in other embodiments another gas, such as nitrogen, helium
or mixtures thereof may be used.
[0103] As described above, for example, in use, the wall 50 may be subjected to a cooling
source. The vessel module 48 may comprise a plurality of cooling elements. The cooling
elements may be part of or comprised in the cooling source. The cooling elements may
be part of or comprised in the second portion 50b of the wall 50. The cooling elements
of the vessel module 48 may comprise any of the features of the cooling elements 26
described above.
[0104] For example, in use, the first portion 50a of the wall 50 may be subjected to a heating
source. For example, in use, the first portion 50a of the wall 50 may be subjected
to heat generated at the plasma formation region 4 of the radiation source SO. This
heat may result in an increase of the temperature of first portion 50a of the wall
50 to above the melting temperature of the fuel. As described above, this may in turn
result in dripping, spitting and/or bubbling of fuel debris deposited on the first
portion 50a of the wall 50, which may cause contamination of one or more components
of the radiation source SO, such as the collector 5. As described above, when the
radiation source is on, the gas supply system 24 may be operated in the first configuration.
The gas supply system 24 may supply the gas into the gap 52, e.g. to increase the
transfer of heat between the first portion 50a and the second portion 50b of the wall
50. Expressed differently, by supplying the gas in the gap 22, heat may be transferred
from the first portion 50a to the second portion 50b of the wall 50. This may lead
a decrease of a temperature first portion 50a of the wall 50, for example to below
the melting temperature of the fuel. By reducing the temperature of the first portion
50a of the wall to below the melting temperature of the fuel, dripping, spitting and/or
bubbling of fuel debris deposited on the first portion 50a of the wall may be reduced
or prevented. This may lead to a reduction in the contamination of other components
of the radiation source SO, such as the collector 5.
[0105] The heating source may comprise the heating elements 28. The heating elements 28
may be part of or comprised in first portion 50a of the wall 50. The heating elements
28 may be configured to heat the first portion 50a of the wall 50, for example when
no EUV radiation is produced by the radiation source SO. The heating elements 28 may
heat the guide portion 18 during maintenance operations of the radiation source SO,
e.g. to allow removal of fuel debris from the first portion 50a of the wall and/or
other components of the radiation source SO. The heating elements 28 may be configured
to heat the first portion 50a of the wall 50 to a temperature greater than a melting
temperature of the fuel. In embodiments, where tin is used as the fuel, the heating
source may be configured to heat the first portion 50a of the wall to a temperature
above 230°C. This may allow for removal of fuel debris from the first portion 50a
of the wall 50. As described above, the gas supply system 24 may be configured to
operate in the second configuration, when no EUV radiation is produced by the radiation
source SO. In the second configuration, the gas supply system 24 may supply no gas
to the gap 52, e.g. to decrease a transfer of heat between the first portion 50a and
the second portion 50b of the wall 50. This may allow the heating element 28 to heat
the first portion 50a of the wall 50 to a temperature above the melting temperature
of the fuel. This in turn may allow for removal of fuel debris from the first portion
50a of the wall 50, e.g. during maintenance operations of the radiation source SO.
For example, the fuel debris may become liquid and drip-off from the first portion
50 of the wall or parts thereof. The liquid fuel debris may be collected in a reservoir,
such as a fuel reservoir.
[0106] It will be appreciated that the vessel module 48 may comprise any of the features
of the restriction elements, inlets and/or spacing elements, as described above. For
example, the restriction elements may be arranged in the gap 52 and/or in the second
portion 50b of the wall 50. The inlets may be arranged in the second portion 50b of
the wall 50. The spacing elements may be arranged on the first portion 50a and/or
the second portion 50b of the wall 50, e.g. such that the spacing elements extend
into the gap 52, as described above.
[0107] Although in vessel module 48 has been described herein as being provided in the form
of the third vessel module 16d, it will be appreciated that in other embodiments,
the vessel module may be provided in the form of the first module 16b or the second
module 16c.
[0108] Figure 15 shows another exemplary vessel module 48 for use in a vessel of the radiation
source SO. In the embodiment shown in Figure 15, the vessel module 48 is provided
in the form of the first vessel module 16b described above.
[0109] Figure 16 shows another exemplary vessel module 48 for use in a vessel of the radiation
source SO. In the embodiment shown in Figure 16, the vessel module 48 is provided
in the form of the second vessel module 16c described above.
[0110] It will be appreciated that each of the first, second and third vessel modules 16b,
16c, 16d of the vessel 16, as shown in Figure 2, may comprise the feature of the vessel
module 48. In some embodiments, the gaps the modules may be in communication with
each other. Expressed differently, the vessel 16, e.g. the first, second and/or third
vessel modules 16b, 16c, 16d, may be configured such that gas exchange between the
gap 52 of one of the first, second and third vessel modules 16b, 16c, 16d and the
gap 52 of at least one other the first, second and third vessel modules 16b, 16c,
16d is allowed. In other embodiments, the vessel 16, e.g. the first, second and/or
third vessel modules 16b, 16c, 16d, may be configured such that gas exchange between
the gap of one of the first, second and third vessel modules 16b, 16c, 16d and the
gap of at least one other the first, second and third vessel modules 16b, 16c, 16d
is prevented. The first, second and/or third vessel modules 16b, 16c, 16d may be configured
such that gas exchange between the gap 52 of at least one of the first, second and
third vessel modules 16b, 16c, 16d and the radiation source SO, e.g. the vessel 16,
may be allowed, e.g. to decrease a pressure in the gap 52, when the gas supply system
24 is in the second configuration.
[0111] Although in the above description the vessel module 48 may be provided in the form
of the first, second and/or third vessel module 16b, 16c, 16d, it will be appreciated
that the present disclosure is not limited to this. For example, it will be appreciated
that in other embodiments, the vessel module may be provided in the form of a reservoir
for supplying fuel to the radiation source. The vessel module may be provided in the
form of another reservoir for collecting fuel from the radiation source.
[0112] Although in the above description the gas supply system is operated in the first
configuration, when radiation is produced by the radiation source, it will be appreciated
that in other embodiments, the gas supply system may additionally or alternatively
be operated in the first configuration, when no radiation is produced by the radiation
source. Additionally or alternatively, the gas supply system may be operated in the
second configuration, when radiation is produced by the radiation source.
[0113] Although in the above description hydrogen is used as the gas. It will be appreciated
that in other embodiments, a gas other than hydrogen may be used. For example, in
other embodiments, the gas may comprise helium, nitrogen or a mixture thereof. In
such other embodiments, a pressure of the gas in the gap may be similar to, the same
as or different from the exemplary pressure(s) disclosed herein, e.g. when the gas
supply system is in the first or second configuration.
[0114] Although specific reference may be made in this text to the use of lithographic apparatus
in the manufacture of ICs, it should be understood that the lithographic apparatus
described herein may have other applications. Possible other applications include
the manufacture of integrated optical systems, guidance and detection patterns for
magnetic domain memories, flat-panel displays, liquid-crystal displays (LCDs), thin-film
magnetic heads, etc.
[0115] While specific embodiments of the invention have been described above, it will be
appreciated that the invention may be practiced otherwise than as described. The descriptions
above are intended to be illustrative, not limiting. Thus it will be apparent to one
skilled in the art that modifications may be made to the invention as described without
departing from the scope of the claims set out below.