(19)
(11) EP 4 214 756 A1

(12)

(43) Date of publication:
26.07.2023 Bulletin 2023/30

(21) Application number: 21706421.1

(22) Date of filing: 20.01.2021
(51) International Patent Classification (IPC): 
H01L 27/11546(2017.01)
H01L 29/423(2006.01)
(52) Cooperative Patent Classification (CPC):
H01L 29/42328; H10B 41/49
(86) International application number:
PCT/US2021/014244
(87) International publication number:
WO 2022/060402 (24.03.2022 Gazette 2022/12)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 21.09.2020 CN 202010993707
19.01.2021 US 202117151944

(71) Applicant: Silicon Storage Technology, Inc.
San Jose, CA 95134 (US)

(72) Inventors:
  • WANG, Chunming
    Shanghai 201203 (CN)
  • SONG, Guo Xiang
    Shanghai 201203 (CN)
  • XING, Leo
    Shanghai 201203 (CN)
  • SUN, Jack
    Shanghai 201203 (CN)
  • LIU, Xian
    Sunnyvale, California 94087 (US)
  • DO, Nhan
    Saratoga, California 95070 (US)

(74) Representative: Betten & Resch 
Patent- und Rechtsanwälte PartGmbB Maximiliansplatz 14
80333 München
80333 München (DE)

   


(54) METHOD OF FORMING A DEVICE WITH PLANAR SPLIT GATE NON-VOLATILE MEMORY CELLS, HIGH VOLTAGE DEVICES AND FINFET LOGIC DEVICES