(19)

(11)

EP 4 218 275 A1

(12)

(43) Date of publication: 02.08.2023 Bulletin 2023/31 (21) Application number: 21873175.0 (22) Date of filing: 01.09.2021

(51) International Patent Classification (IPC):  H04W 8/18(2009.01) H04W 92/18(2009.01) H04W 60/00(2009.01) H04W 40/02(2009.01) H04W 92/10(2009.01) (52) Cooperative Patent Classification (CPC): H04W 8/18; H04W 92/18; H04W 92/10; H04W 76/14; H04W 60/04; H04W 88/04; H04W 40/22 (86) International application number: PCT/US2021/048659 (87) International publication number: WO 2022/066383 (31.03.2022 Gazette 2022/13)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 25.09.2020 US 202063083677 P (71) Applicant: INTEL Corporation Santa Clara, CA 95054 (US)	(72) Inventor: SHAN, Chang Hong Shanghai (CN) (74) Representative: Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte  Am Brauhaus 8 01099 Dresden 01099 Dresden (DE)