(19)
(11) EP 4 223 442 A8

(12) CORRECTED EUROPEAN PATENT APPLICATION
Note: Bibliography reflects the latest situation

(15) Correction information:
Corrected version no 1 (W1 A1)

(48) Corrigendum issued on:
20.09.2023 Bulletin 2023/38

(43) Date of publication:
09.08.2023 Bulletin 2023/32

(21) Application number: 22217061.5

(22) Date of filing: 29.12.2022
(51) International Patent Classification (IPC): 
B23K 1/00(2006.01)
B23K 3/08(2006.01)
H01L 21/607(2006.01)
B23K 26/362(2014.01)
 B23K 1/06(2006.01)
A61B 5/00(2006.01)
B23K 26/08(2014.01)
(52) Cooperative Patent Classification (CPC):
B23K 1/06; B23K 1/0016; B23K 3/087; B23K 3/08; A61B 5/6858; B23K 26/0861; B23K 26/362; H01L 24/71
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
KH MA MD TN

(30) Priority: 30.12.2021 US 202117566400

(71) Applicant: Biosense Webster (Israel) Ltd
2066717 Yokneam (IL)

(72) Inventors:
  • GOVARI, Assaf
    Yokneam 2066717 (IL)
  • BEECKLER, Christopher Thomas
    Irvine 92618 (US)
  • KEYES, Joseph Thomas
    Irvine 92618 (US)
  • PAPAIOANNOU, Athanassios
    Irvine 92618 (US)
  • HERRERA, Kevin Justin
    Irvine 92618 (US)

(74) Representative: Carpmaels & Ransford LLP 
One Southampton Row
London WC1B 5HA
London WC1B 5HA (GB)

   


(54) SOLDERING LEADS TO PADS IN PRODUCING BASKET CATHETER


(57) A system includes a fixture, a laser assembly, and a positioning assembly. The fixture is configured to hold (i) a substrate of a distal-end assembly of a catheter and (ii) a lead placed on a given solder pad disposed on the substrate, the laser assembly is configured to emit a laser beam, and the positioning assembly is configured to move the fixture, with the substrate and the lead, relative to the laser assembly, so as to mark a soldering position, at which the lead is to be attached to the given solder pad, with a laser spot of the laser beam.