METHOD OF FORMING TSV-LAST INTERCONNECT IN WAFER ASSEMBLY AND METHOD OF FORMING THE WAFER ASSEMBLY - Patent 4233090

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EP 4 233 090 A1

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(43)	Date of publication:
	30.08.2023 Bulletin 2023/35

(21)	Application number: 20966336.8

(22)	Date of filing: 23.12.2020

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International Patent Classification (IPC):

H01L 21/46^(2006.01)

(52)	Cooperative Patent Classification (CPC):
	H01L 25/50; H01L 25/0657; H01L 2225/06541; H01L 2225/06565; H01L 21/76898; H01L 24/04; H01L 24/29; H01L 24/32; H01L 24/83

(86)	International application number:
	PCT/CN2020/138451

(87)	International publication number:
	WO 2022/133756 (30.06.2022 Gazette 2022/26)

(84)	Designated Contracting States:
	AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
	Designated Extension States:
	BA ME
	Designated Validation States:
	KH MA MD TN

(71)	Applicant: Huawei Technologies Co., Ltd.
	Shenzhen, Guangdong 518129 (CN)

(72)	Inventors:
	MULLER, Philippe Shenzhen, Guangdong 518129 (CN) ZHU, Weihua Shenzhen, Guangdong 518129 (CN) HE, Ran Shenzhen, Guangdong 518129 (CN) XU, Jeffrey Junhao Shenzhen, Guangdong 518129 (CN)

(74)	Representative: Isarpatent
	Patent- und Rechtsanwälte Barth Charles Hassa Peckmann & Partner mbB Friedrichstrasse 31 80801 München 80801 München (DE)

(54)	METHOD OF FORMING TSV-LAST INTERCONNECT IN WAFER ASSEMBLY AND METHOD OF FORMING THE WAFER ASSEMBLY