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EP 4 233 243 A1

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(43) Date of publication: 30.08.2023 Bulletin 2023/35 (21) Application number: 21884104.7 (22) Date of filing: 21.10.2021

(51) International Patent Classification (IPC):  H04L 1/18(2023.01) H04L 12/18(2006.01) H04W 72/12(2023.01) H04L 5/00(2006.01) H04W 4/06(2009.01) H04L 1/00(2006.01) (52) Cooperative Patent Classification (CPC): H04W 4/06; H04L 12/189; H04L 2001/0093; H04L 1/1861; H04L 1/1864; H04L 5/0055; H04L 5/0094 (86) International application number: PCT/US2021/071972 (87) International publication number: WO 2022/087620 (28.04.2022 Gazette 2022/17)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 23.10.2020 US 202063105120 P (71) Applicant: INTEL Corporation Santa Clara, CA 95054 (US)	(72) Inventors: CHATTERJEE, Debdeep San Jose, California 95128 (US) DAVYDOV, Alexei Nizhny Novgorod, 603132 (RU) LI, Yingyang Beijing, 100190 (US) SENGUPTA, Avik San Jose, California 95134 (US) XIONG, Gang Beaverton, Oregon 97006 (US) (74) Representative: Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte  Am Brauhaus 8 01099 Dresden 01099 Dresden (DE)