(19)

(11)

EP 4 233 348 A1

(12)

(43) Date of publication: 30.08.2023 Bulletin 2023/35 (21) Application number: 21884095.7 (22) Date of filing: 20.10.2021

(51) International Patent Classification (IPC):  H04W 24/08(2009.01) H04W 36/00(2009.01) H04W 16/28(2009.01) H04W 24/10(2009.01) H04W 76/27(2018.01) (52) Cooperative Patent Classification (CPC): H04W 76/27; H04W 24/08 (86) International application number: PCT/US2021/071949 (87) International publication number: WO 2022/087604 (28.04.2022 Gazette 2022/17)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR (30) Priority: 21.10.2020 US 202063094645 P (71) Applicant: INTEL Corporation Santa Clara, CA 95054 (US)	(72) Inventors: YIU, Candy Portland, Oregon 97201 (US) GUO, Yi Shanghai 201801 (CN) LIM, Seau S. Swindon SWD SN1 4GU (GB) PALAT, Sudeep K. Cheltenham, Gloucestershire GL51 0GG (GB) HEO, Youn Hyoung Sunnyvale, California 94087 (US) (74) Representative: HGF  HGF Limited 1 City Walk Leeds LS11 9DX Leeds LS11 9DX (GB)