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(11)

EP 4 233 419 A1

(12)

(43) Date of publication: 30.08.2023 Bulletin 2023/35 (21) Application number: 21884030.4 (22) Date of filing: 22.10.2021

(51) International Patent Classification (IPC):  H04W 72/00(2023.01) H04W 72/12(2023.01) H04W 72/04(2023.01) H04W 4/06(2009.01) (52) Cooperative Patent Classification (CPC): H04W 4/06; H04L 1/1864; H04L 1/1685; H04L 1/189; H04W 72/30; H04W 72/23 (86) International application number: PCT/US2021/056345 (87) International publication number: WO 2022/087482 (28.04.2022 Gazette 2022/17)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 23.10.2020 US 202063105100 P 06.08.2021 US 202163230648 P (71) Applicant: INTEL Corporation Santa Clara, CA 95054 (US)	(72) Inventors: CHATTERJEE, Debdeep San Jose, California 95128 (US) DAVYDOV, Alexei Vladimirovich Nizhny Novgorod, 603132 (RU) LI, Yingyang Beijing 100032 (CN) SENGUPTA, Avik San Jose, California 95132 (US) XIONG, Gang Portland, Oregon 97229 (US) (74) Representative: Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte  Am Brauhaus 8 01099 Dresden 01099 Dresden (DE)