(19)

(11)

EP 4 238 289 A1

(12)

(43) Date of publication: 06.09.2023 Bulletin 2023/36 (21) Application number: 21887606.8 (22) Date of filing: 29.10.2021

(51) International Patent Classification (IPC):  H04L 41/00(2022.01) H04W 88/18(2009.01) G06N 5/04(2023.01) H04L 9/40(2022.01) G06N 20/00(2019.01) (52) Cooperative Patent Classification (CPC): G06N 20/00; H04W 88/18; H04L 41/16; H04L 41/145; H04L 43/20; H04L 43/0876; H04L 41/142; H04L 41/147; H04L 43/0852; H04L 43/06; H04L 43/0829; G06N 3/006; H04W 88/085; H04L 63/0823; H04W 12/06 (86) International application number: PCT/US2021/057274 (87) International publication number: WO 2022/094224 (05.05.2022 Gazette 2022/18)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 29.10.2020 US 202063107307 P (71) Applicant: INTEL Corporation Santa Clara, CA 95054 (US)	(72) Inventors: YEH, Shu-ping Campbell, California 95008 (US) HAN, Jaemin PORTLAND, Oregon 97229 (US) YING, Dawei Hillsboro, Oregon 97124 (US) BAI, Jingwen San Jose, California 95125 (US) ORHAN, Oner San Jose, California 95129 (US) RUAN, Leifeng Beijing, 11, 100190 (CN) (74) Representative: HGF  HGF Limited 1 City Walk Leeds LS11 9DX Leeds LS11 9DX (GB)