(19)
(11) EP 4 251 721 A1

(12)

(43) Date of publication:
04.10.2023 Bulletin 2023/40

(21) Application number: 21811087.2

(22) Date of filing: 23.11.2021
(51) International Patent Classification (IPC): 
C11D 1/00(2006.01)
C23C 18/24(2006.01)
C23C 18/20(2006.01)
C23C 18/30(2006.01)
(52) Cooperative Patent Classification (CPC):
C23C 18/2086; C23C 18/24; C23C 18/30
(86) International application number:
PCT/EP2021/082572
(87) International publication number:
WO 2022/112196 (02.06.2022 Gazette 2022/22)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 24.11.2020 EP 20209518

(71) Applicant: Atotech Deutschland GmbH & Co. KG
10553 Berlin (DE)

(72) Inventors:
  • BAYER, Frank
    10553 Berlin (DE)
  • FELS, Carl Christian
    10553 Berlin (DE)
  • HARTMANN, Philip
    10553 Berlin (DE)

(74) Representative: Atotech Deutschland GmbH & Co. KG 
Intellectual Property Erasmusstraße 20
10553 Berlin
10553 Berlin (DE)

   


(54) METHOD FOR ETCHING AT LEAST ONE SURFACE OF A PLASTIC SUBSTRATE