Technical field
[0001] Disclosed herein is a modular device for confinement of magnetic fields. Specifically,
the modular magnetic confinement device described is related to containment of plasma
and its applications including generation of energy in fusion reactors.
Background art
[0002] The modern world is in dire need of new energy sources. Energy sources that are not
only clean but easily renewable and highly available. Fusion energy obtained from
fusion reactions in a fusion reactor is an energy source with all of these characteristics.
[0003] Presently, the prospect of reliable and widely available fusion energy is yet to
be fulfilled. Among the biggest obstacles to achieving fusion energy is the construction
of a fusion reactor. Construction of a fusion reactor requires careful selection of
materials, complex geometries for magnetic confinement and careful considerations
regarding the extraction of produced energy.
[0004] Many different geometries for magnetic confinement can be identified in the art including
Tokamaks, Spherical Tokamaks, Spheromaks and Stellarators, each having their own benefits
and difficulties. From an engineering perspective, all of these geometries share the
same complication, that they all have to be achieved by a volumetric construction.
It is not known in the art any possible way to achieve feasible geometries without
constructing magnets in three dimensions.
[0005] A fusion reactor is described in
U.S. Pat. No. 9,959,942 to McGuire. The device described by McGuire is compact, able to fit inside airplanes and even
large cars, yet the device as described exemplifies two big engineering challenges
that still require a solution. First, although the device is small it requires a large
amount of parts, a realization of any of the embodiments described would require many
more parts than those of a car or even an airplane. Second, a large number of different
coils and coil arrangements are required to achieve magnetic encapsulation, which
is just another term for magnetic confinement.
[0006] With respect to the coils, the prior art teaches several methods for constructing
one, for instance the superconducting coil described in
U.S. Pat. No. 8,655,423 to Miyazaki, et al. Miyazaki describes a superconducting coil formed of several layers of different materials.
A group of these layers is described as constituting a superconducting coil portion
which is formed of thin-film superconducting wires. The coils described by Miyazaki
and those that are common in the art are constructed by arranging superconducting
films, also called superconducting tapes, into the shape of wires and the wires are
then further configured into the shape of coils. According to a review of the prior
art, superconducting coils are formed by stacking superconducting films or layers
so that electric current may flow in a desired direction and produce the appropriate
magnetic field configuration. To the best knowledge and understanding of the inventors,
the prior art doesn't teach any other method by which the superconducting films or
tapes may be used to conduct a current.
[0007] Superconducting tapes themselves are also in short supply, as their demand is high.
There is also the problem of the size and shape of the tapes which can only be constructed
a few centimeters wide. In addition, the process that arranges the tapes into wires
and further into coils is lengthy and error prone. The field of fusion reactor manufacturing
requires a solution that is cheaper, faster, and more reliable.
[0008] Thus, there remains a need for a magnetic confinement device that can have different
geometries, without requiring a too large number of parts, different coils and coils
arrangements. There remains also a need for a simpler, faster and less error prone
method for constructing a magnetic confinement device.
Summary of Invention
[0009] One embodiment addresses all or some of the drawbacks of known magnetic confinement
devices and coils.
[0010] One embodiment provides a magnetic confinement device comprising a plurality of modules
coupled to each other, wherein each module is adapted to conduct current in order
to form a magnetic field and has:
- a first wall having a connecting surface adapted to engage a connecting surface of
another module of the plurality of modules; and
- a groove separating the first wall into at least two different electrically conducting
regions.
[0011] In one embodiment, the groove of at least one of the plurality of modules is adapted
to be connected to a groove of another module of the plurality of modules to form
a continuous groove.
[0012] In one embodiment, the groove is adapted to guide a flow of current into a certain
direction, or into different paths, through the module.
[0013] In one embodiment, at least a module of the plurality of modules is mechanically
and/or electrically coupled to another module of the plurality of modules, the connecting
surface of the module comprising a mechanical and/or electrical connector adapted
to be coupled to a mechanical and/or electrical connector of the other module.
[0014] In one embodiment, the coupled modules comprise each an electrical connector, the
electrical connectors being positioned in order to accommodate a flow of current between
said coupled modules.
[0015] In one embodiment, at least a module of the plurality of modules comprises at least
a channel crossing through the first wall of said module, for example to enable a
cooling fluid, like nitrogen or helium, to flow through said module.
[0016] In one particular embodiment, each channel is adapted to form a single channel with
a channel of another module of the plurality of modules.
[0017] In one embodiment, at least a module of the plurality of modules comprises a second
wall assembled to the first wall, the groove of said module being positioned between
the first wall and the second wall.
[0018] In one embodiment, the plurality of modules comprises first modules having a first
shape, and second modules having a second shape, wherein the modules are mechanically
coupled to each other, and the first modules are electrically coupled to each other
and/or the second modules are electrically coupled to each other.
[0019] In one particular embodiment, the first and second modules are electrically coupled
to each other.
[0020] In one embodiment, the direction and/or the intensity of the current flowing through
the first modules and/or the second modules determines the shape of the magnetic field
in the magnetic confinement device.
[0021] In one embodiment, the modules are arranged in a shape of a torus.
[0022] In one embodiment, the modules are constructed to exhibit superconducting characteristics.
[0023] In one embodiment, at least a module of the plurality of modules is constructed as
a stacking of different materials, comprising at least a superconducting layer comprising
a superconducting material, like yttrium barium copper oxide or rare-earth barium
copper oxide, wherein the groove of said module is patterned at least in the superconducting
layer.
[0024] In one embodiment, the stacking comprises:
- a structural layer, for example composed or covered by a material like Hastelloy;
- a plurality of buffer layers on the structural layer;
- the superconducting layer on the plurality of buffer layers; and
- a shunt layer on the superconducting layer and in the groove, the shunt layer being
made of a metal, for example silver; wherein the groove is patterned in the buffer
layers and the superconducting layer.
[0025] In one embodiment, the stacking comprises a repeater layer under the shunt layer,
the repeater layer being made of the repetition of the buffer and superconducting
layers, and preferably several repetitions, for example between 4 and 80 repetitions,
the groove being patterned in the buffer layers, the superconducting layer and the
repeater layer.
[0026] In one embodiment, the stacking comprises another superconducting layer, for example
a non-perforated and non-grooved layer, on the shunt layer, comprising a superconducting
material like yttrium barium copper oxide or rare-earth barium copper oxide.
[0027] In one embodiment, each channel of the at least one module goes through the structural
layer.
[0028] One embodiment provides a module adapted to the magnetic confinement device according
to an embodiment.
Advantages
[0029] Advantages of an embodiment of the modular magnetic confinement device may be listed
as: simpler and less error prone construction of different modules allowing for faster
assembly; high confinement of the magnetic field, due to Meissner effect layers; servicing
of each module is easier and replacement faster, accounting for cheaper device and
a reduction of overall costs; coils may be easily changed and replaced, allowing not
only for maintenance of the device but also for testing. Other technical advantages
will become apparent to someone skilled in the art from the detailed description,
figures, and claims. Moreover, while specific advantages have been enumerated above,
different embodiments may include all, none or some of the advantages listed.
Brief description of drawings
[0030] The foregoing features and advantages, as well as others, will be described in detail
in the following description of specific embodiments given by way of illustration
and not limitation with reference to the accompanying drawings, in which:
FIG. 1 is a general perspective view of an embodiment of the disclosed modular magnetic
confinement device.
FIG. 2 is an exploded perspective view of an embodiment of the disclosed modular magnetic
confinement device.
FIG. 3A is a perspective view of a toroidal device constructed out of modules as described
by the disclosed modular magnetic confinement device.
FIG. 3B is an expanded perspective view of two modules that comprise the toroidal
device of FIG. 3A.
FIG. 3C is a perspective view of the interior of the toroidal device of FIG. 3A.
FIG. 4 is a perspective view of the interior of the wall of a module of the disclosed
modular magnetic confinement device.
Description of embodiments
[0031] Like features have been designated by like references in the various figures. In
particular, the structural and/or functional features that are common among the various
embodiments may have the same references and may dispose identical structural, dimensional
and material properties.
[0032] For the sake of clarity, only the operations and elements that are useful for an
understanding of the embodiments described herein have been illustrated and described
in detail.
[0033] Unless indicated otherwise, when reference is made to two elements connected together,
this signifies a direct connection without any intermediate elements other than conductors,
and when reference is made to two elements coupled together, this signifies that these
two elements can be connected or they can be coupled via one or more other elements.
[0034] In the following disclosure, unless indicated otherwise, when reference is made to
absolute positional qualifiers, such as the terms "front", "back", "top", "bottom",
"left", "right", etc., or to relative positional qualifiers, such as the terms "above",
"below", "higher", "lower", etc., or to qualifiers of orientation, such as "horizontal",
"vertical", etc., reference is made to the orientation shown in the figures.
[0035] Unless specified otherwise, the expressions "around", "approximately", "substantially"
and "in the order of" signify within 10 %, and preferably within 5 %.
[0036] When reference is made to a magnetic confinement, it refers to the confinement of
the magnetic field.
[0037] The figures are not to scale. It should be noted that the drawings refer to an embodiment
of the disclosed modular magnetic confinement device, sometimes also referred simply
as device, when no ambiguity is anticipated. Other embodiments may be possible, as
someone with appropriate training may readily appreciate. The actual dimension and/or
shape of each of the components of the embodiment may vary. Only important details
of the embodiment are shown, however one of ordinary skill in the art can appreciate
how the overall device may be constructed, without undue experimentation. Some details
have been omitted from the drawings, but the inventors believe that adding these details
is unnecessary for the overall appreciation of the characteristics of the invention
disclosed. These omitted details include, among others, elements for holding or fixing
the device or its functional components. Some characteristics of the embodiment appear
exaggerated to facilitate understanding. The embodiments disclosed, and alternatives
observed should not be considered as limiting the invention in any way.
[0038] The magnetic confinement device is constructed from modules. The modules are coupled,
preferably connected, to each other and are able to conduct electricity. The conduction
of electricity in the module and the materials used for this end may require that
the module operates at certain temperatures, thus the modules may require cooling.
[0039] An embodiment of a module
100 of the modular magnetic confinement device is shown in FIG. 1. The module conducts
electricity, so that it may form an electromagnetic field. The module has an outer
wall
112 and an inner wall
110. The inner wall
110 has at least a connecting surface
102, two connecting surfaces in the shown embodiment. A least one tube, canal or channel,
or, as in the illustrated module, several tubes, canals, or channels
104 may cross through the inner wall
110. The connecting surfaces of the inner wall
110 have electrical connectors
106 and/or mechanical connectors
108.
[0040] When reference is made to a channel, this also includes a tube, a tunnel or a canal.
[0041] The inner wall may be called the "first wall", and the outer wall may be called the
"second wall".
[0042] The outer wall
112 may be electrically conducting, as it may represent a shunt layer, or electrically
isolating, or a poor conductor.
[0043] An expanded view of the module
100 is shown in FIG. 2. In this expanded view, the outer wall
112, has been separated from the inner wall
110. The inner wall
110 has a ridge, wedge or groove
202. The groove
202 separates the inner wall
110 in at least two electrically conductive regions, so that current may flow in a certain
direction, or different paths, according to the needs of the specific use. The electrical
connectors
106 are positioned to accommodate the flow of current to other modules.
[0044] When reference is made to a groove, this also includes a ridge or a wedge.
[0045] According to an embodiment, a mechanical connector can also function as an electrical
connector. Similarly, an electrical connector can also function as a mechanical connector.
A connecting surface may comprise one connector allowing for both mechanical and electrical
connection. Preferably, there is an electrical connector connecting each conductive
region from either side of the groove.
[0046] The modules are assembled into a device that is adapted to confine a magnetic field.
They are assembled together with the mechanical connectors
108. In an embodiment, the device may be described as a torus
300, as shown in FIG. 3A. In order to construct the torus
300 out of the modules, different module shapes may be used. As shown in FIG. 3B, an
upper module
100b is separate from a lower module
100a. Electrically, the modules may be coupled, preferably connected, together by using
the electrical connectors
106. When these modules are coupled together, electrical current may flow from one to
the other, resulting in the formation of a magnetic field
302 around the modules, as shown in FIG. 3C. Any number of modules may connect to each
other and virtually, the magnetic confinement device may be of any shape.
[0047] A lower module may be called a "first module" and an upper module may be called a
"second module".
Example of operation
[0048] FIG. 3C shows an interior view of the torus
300 during operation. The lower modules
100a are electrically interconnected. They may also be interconnected with other modules,
like the upper modules
100b in FIG. 3B. Electricity is flowing through the modules and this results in the formation
of a magnetic field
302 inside the torus
300. The shape of the magnetic field
302 may be configured by changing the direction and intensity of the current flowing
through the lower modules
100a or the upper modules
100b.
[0049] In order for the magnetic field
302 to be confined to the interior of the magnetic confinement device, be it in the torus
300 configuration or other, the construction of the modules may make at least partially
use of the Meisner effect. The Meisner effect is the phenomenon by which magnetic
fields may not exist inside perfect conductors, or superconductors. The Meisner effect
is observed in superconducting materials. For certain materials, to exhibit superconducting
properties, it is necessary that they operate inside certain temperature limits. In
order to ensure that the module operates inside this temperature range, cooling fluid
may be made to flow through the channels
104.
Example of module construction
[0050] An embodiment of the inner structure of the modules is shown in FIG. 4. A module
may be constructed as a stacking of several layers. From the bottom, which may be
closest to the side the magnetic field will be formed on, the stacking comprises a
first structural layer
414, which may be composed or covered by a material like Hastelloy. The channels
104 for the cooling fluid may go through the first structural layer
414. Several buffer layers are deposited on top of the first structural layer
414. Sputtered on top of the first structural layer
414 is a layer of a material like alumina, called the first buffer layer
412. The second buffer layer
410 is sputtered on top of the first buffer layer
412. The second buffer layer
410 is composed of a material like yttria. The third buffer layer
408 is composed of a material like magnesium oxide and may be deposited by metal-organic
chemical vapor deposition (MOCVD) or ion beam assisted deposition (IBAD). A superconducting
layer
406 is deposited on top of the third buffer layer
408. The superconducting layer
406 may be deposited by MOCVD and may be composed of a material like REBCO or YBCO or
other appropriate superconducting materials. Material from the first buffer layer
412, the second buffer layer
410, the third buffer layer
408 and the superconducting layer
406 may be removed in order to create a pattern which describes the groove
202 in the inner wall
110 of the module as shown in FIG. 2. In order to remove the material, a technique like
laser patterning may be used. Other techniques, like a mechanical technique or photolithography
may be used to remove the material.
[0051] Alternatively, it is possible to remove material only from the superconducting layer
406 to create the groove
202.
[0052] The buffer layers may form an appropriate template for the formation of the superconducting
layer. There may be only one buffer layer instead of a plurality of buffer layers.
[0053] Other appropriate materials may be used in place of the ones described here.
[0054] The groove
202 may be filled with a metal, which may be silver, forming a shunt layer
404 that may also cover the superconducting layer
406. Such a shunt layer offers a path in case of quenching of the superconducting layer
406.
[0055] Before forming the groove, the described sequence of buffer and superconducting layers
may be repeated several times (forming a repeater layer), with best results being
achieved between 4 and 80 of the layer sequence, for example between 20 and 40 repetitions
of the layer sequence for magnetic fields of about 10 Tesla. The groove may also be
formed in the repeater layer.
[0056] The repeated layer sequence may comprise a silver layer on the superconducting layer
406, or another material which is appropriate for the formation of another sequence of
buffer and superconducting layers on said stacking.
[0057] To make at least partially use of the Meisner effect or similar effect in which the
superconductor partly or fully expels magnetic field, on top of all the other layers,
a single, preferably non-perforated (and not-grooved), layer of superconducting material
should be placed. This layer is the Meisner effect layer
402 and is composed of a superconducting material like YBCO or REBCO.
[0058] Layers of other materials either above or below the ones described may be required
for the proper operation of the device, nevertheless it should be apparent to anyone
with ordinary skill in the art how to achieve the functionality described here with
a different layer configuration. As an example of this, stabilizing layers composed
of silver, copper and other metals may be placed below the first structural layer
414.
[0059] The inner wall
110 may include layers
414, 412, 410, 408, 406, 404 and the groove
202 of FIG. 4, and the outer wall
112 may include layer
402 of FIG. 4.
[0060] According to an embodiment, the module is a modular coil.
[0061] Other layer configurations and/or methods for constructing or manufacturing a module,
for example a modular coil, should be apparent to anyone with ordinary skill in the
art. Another example of a method for manufacturing superconducting coils, which can
be modular coils, and an example of device is given in European patent application
number
EP22305437, filed on April 4, 2022 by the same applicant "RENAISSANCE FUSION", entitled "METHOD FOR MANUFACTURING SUPERCONDUCTING
COILS AND DEVICE", which is hereby incorporated by reference to the maximum extent
allowable by law.
[0062] Example embodiments of the invention are summarized here. Other embodiments can also
be understood from the entirety of the specification as well as the claims filed herein.
[0063] Example 1. A magnetic confinement device (300) comprising a plurality of modules
coupled to each other, wherein each module (100; 100a, 100b) is adapted to conduct
current in order to form a magnetic field and has:
- a first wall (110) having a connecting surface (102) adapted to engage a connecting
surface of another module of the plurality of modules; and
- a groove (202) separating the first wall (110) into at least two different electrically
conducting regions.
[0064] Example 2. The magnetic confinement device according to example 1, wherein the groove
of at least one of the plurality of modules is adapted to be connected to a groove
of another module of the plurality of modules to form a continuous groove.
[0065] Example 3. The magnetic confinement device according to example 1 or 2, wherein the
groove (202) is adapted to guide a flow of current into a certain direction, or into
different paths, through the module.
[0066] Example 4. The magnetic confinement device according to any one of examples 1 to
3, wherein at least a module (100) of the plurality of modules is mechanically and/or
electrically coupled to another module of the plurality of modules, the connecting
surface of the module comprising a mechanical (108) and/or electrical connector (106)
adapted to be coupled to a mechanical and/or electrical connector of the other module.
[0067] Example 5. The magnetic confinement device according to example 4, wherein the coupled
modules comprise each an electrical connector, the electrical connectors being positioned
in order to accommodate a flow of current between said coupled modules.
[0068] Example 6. The magnetic confinement device according to any one of examples 1 to
5, wherein at least a module (100) of the plurality of modules comprises at least
a channel (104) crossing through the first wall (110) of said module, for example
to enable a cooling fluid, like nitrogen or helium, to flow through said module.
[0069] Example 7. The magnetic confinement device according to example 6, wherein each channel
is adapted to form a single channel with a channel of another module of the plurality
of modules.
[0070] Example 8. The magnetic confinement device according to any one of examples 1 to
7, wherein the first wall (110) of at least a module (100) of the plurality of modules
comprises at least two connecting surfaces (102), each adapted to engage a connecting
surface of another module of the plurality of modules.
[0071] Example 9. The magnetic confinement device according to any one of examples 1 to
8, wherein at least a module (100) of the plurality of modules comprises a second
wall (112) assembled to the first wall (110), the groove (202) of said module being
positioned between the first wall and the second wall.
[0072] Example 10. The magnetic confinement device according to any one of examples 1 to
9, wherein at least two modules (100a, 100b) of the plurality of modules have different
shapes.
[0073] Example 11. The magnetic confinement device according to any one of examples 1 to
10, wherein the plurality of modules comprises first modules (100a) having a first
shape, and second modules (100b) having a second shape, wherein the modules are mechanically
coupled to each other, and the first modules are electrically coupled to each other
and/or the second modules are electrically coupled to each other.
[0074] Example 12. The magnetic confinement device according to example 11, wherein the
first and second modules are electrically coupled to each other.
[0075] Example 13. The magnetic confinement device according to example 11 or 12, wherein
the direction and/or the intensity of the current flowing through the first modules
(100a) and/or the second modules (100b) determines the shape of the magnetic field
(302) in the magnetic confinement device.
[0076] Example 14. The magnetic confinement device according to any one of examples 1 to
13, wherein the modules are arranged in a shape of a torus.
[0077] Example 15. The magnetic confinement device according to any one of examples 1 to
14, wherein the modules are constructed to exhibit superconducting characteristics.
[0078] Example 16. The magnetic confinement device according to any one of examples 1 to
15, wherein at least a module of the plurality of modules is constructed as a stacking
of different materials, comprising at least a superconducting layer (406) comprising
a superconducting material, like yttrium barium copper oxide or rare-earth barium
copper oxide, wherein the groove (202) of said module is patterned at least in the
superconducting layer.
[0079] Example 17. The magnetic confinement device according to example 16, wherein the
stacking comprises:
- a structural layer (414), for example composed or covered by a material like Hastelloy;
- a plurality of buffer layers on the structural layer;
- the superconducting layer (406) on the plurality of buffer layers; and
- a shunt layer (404) on the superconducting layer and in the groove, the shunt layer
being made of a metal, for example silver;
wherein the groove is patterned in the buffer layers and the superconducting layer.
[0080] Example 18. The magnetic confinement device according to example 17, wherein the
plurality of buffer layers comprises:
- a first buffer layer (412) on the structural layer, for example a layer of a material
like alumina;
- a second buffer layer (410) on the first buffer layer, for example a layer of a material
like yttria;
- a third buffer layer (408) on the second buffer layer, for example a layer of a material
like magnesium oxide.
[0081] Example 19. The magnetic confinement device according to example 17 or 18, wherein
the stacking comprises a repeater layer under the shunt layer (404), the repeater
layer being made of the repetition of the buffer and superconducting layers, and preferably
several repetitions, for example between 4 and 80 repetitions, the groove being patterned
in the buffer layers, the superconducting layer and the repeater layer.
[0082] Example 20. The magnetic confinement device according to any one of examples 17 to
19, wherein the stacking comprises another superconducting layer (402), for example
a non-perforated and non-grooved layer, on the shunt layer (404), comprising a superconducting
material like yttrium barium copper oxide or rare-earth barium copper oxide.
[0083] Example 21. The magnetic confinement device according to any one of examples 17 to
20 in combination with example 6 or 7, wherein each channel (104) of the at least
one module goes through the structural layer (414).
[0084] Example 22. A module (100) adapted to the magnetic confinement device according to
any one of examples 1 to 21.
[0085] Example 23. A method for fabricating a module (100) according to example 22, the
method comprising:
- providing a structural layer (414);
- forming a plurality of buffer layers on the structural layer;
- depositing, for example by metal-organic chemical vapor deposition, a superconducting
layer (406) on the plurality of buffer layers; and
- removing material at least from the superconducting layer, for example using a laser
patterning technique, to form a groove (202);
- depositing a layer of a metal on the superconducting layer, comprising filling the
groove with said metal, for example silver, to form a shunt layer (404).
[0086] - Example 24. The method according to example 23, further comprising:
- repeating the buffer and superconducting layers before forming the groove and forming
the shunt layer (404), preferably several times, for example or between 4 and 80 repetitions.
[0087] Example 25. The method according to example 23 or 24, wherein forming the plurality
of buffer layers comprises:
- sputtering a first buffer layer (412) on the structural layer, for example a layer
of a material like alumina;
- sputtering a second buffer layer (410) on the first buffer layer, for example a layer
of a material like yttria;
- depositing, for example by metal-organic chemical vapor deposition or ion beam assisted
deposition, a third buffer layer (408) on the second buffer layer, for example a layer
of a material like magnesium oxide.
[0088] Example 26. The method according to any of examples 23 to 25, further comprising:
- depositing another superconducting layer (402), for example a non-perforated and non-grooved
layer, on the shunt layer (404), comprising a superconducting material like yttrium
barium copper oxide or rare-earth barium copper oxide.
[0089] Various embodiments and variants have been described. Those skilled in the art will
understand that certain features of these embodiments can be combined and other variants
will readily occur to those skilled in the art.
[0090] Finally, the practical implementation of the embodiments and variants described herein
is within the capabilities of those skilled in the art based on the functional description
provided hereinabove.
List of acronyms:
[0091]
- MOCVD
- Metal-organic chemical vapor deposition
- IBAD
- Ion beam assisted deposition
- REBCO
- Rare-earth barium copper oxide
- YBCO
- Yttrium barium copper oxide
1. A magnetic confinement device (300) comprising a plurality of modules coupled to each
other, wherein each module (100; 100a, 100b) is adapted to conduct current in order
to form a magnetic field and has:
- a first wall (110) having a connecting surface (102) adapted to engage a connecting
surface of another module of the plurality of modules; and
- a groove (202) separating the first wall (110) into at least two different electrically
conducting regions.
2. The magnetic confinement device according to claim 1, wherein the groove of at least
one of the plurality of modules is adapted to be connected to a groove of another
module of the plurality of modules to form a continuous groove.
3. The magnetic confinement device according to claim 1 or 2, wherein the groove (202)
is adapted to guide a flow of current into a certain direction, or into different
paths, through the module.
4. The magnetic confinement device according to any one of claims 1 to 3, wherein at
least a module (100) of the plurality of modules is mechanically and/or electrically
coupled to another module of the plurality of modules, the connecting surface of the
module comprising a mechanical (108) and/or electrical connector (106) adapted to
be coupled to a mechanical and/or electrical connector of the other module.
5. The magnetic confinement device according to claim 4, wherein the coupled modules
comprise each an electrical connector, the electrical connectors being positioned
in order to accommodate a flow of current between said coupled modules.
6. The magnetic confinement device according to any one of claims 1 to 5, wherein at
least a module (100) of the plurality of modules comprises at least a channel (104)
crossing through the first wall (110) of said module, for example to enable a cooling
fluid, like nitrogen or helium, to flow through said module.
7. The magnetic confinement device according to claim 6, wherein each channel is adapted
to form a single channel with a channel of another module of the plurality of modules.
8. The magnetic confinement device according to any one of claims 1 to 7, wherein at
least a module (100) of the plurality of modules comprises a second wall (112) assembled
to the first wall (110), the groove (202) of said module being positioned between
the first wall and the second wall.
9. The magnetic confinement device according to any one of claims 1 to 8, wherein the
plurality of modules comprises first modules (100a) having a first shape, and second
modules (100b) having a second shape, wherein the modules are mechanically coupled
to each other, and the first modules are electrically coupled to each other and/or
the second modules are electrically coupled to each other.
10. The magnetic confinement device according to claim 9, wherein the first and second
modules are electrically coupled to each other.
11. The magnetic confinement device according to claim 9 or 10, wherein the direction
and/or the intensity of the current flowing through the first modules (100a) and/or
the second modules (100b) determines the shape of the magnetic field (302) in the
magnetic confinement device.
12. The magnetic confinement device according to any one of claims 1 to 11, wherein the
modules are arranged in a shape of a torus.
13. The magnetic confinement device according to any one of claims 1 to 12, wherein the
modules are constructed to exhibit superconducting characteristics.
14. The magnetic confinement device according to any one of claims 1 to 13, wherein at
least a module of the plurality of modules is constructed as a stacking of different
materials, comprising at least a superconducting layer (406) comprising a superconducting
material, like yttrium barium copper oxide or rare-earth barium copper oxide, wherein
the groove (202) of said module is patterned at least in the superconducting layer.
15. The magnetic confinement device according to claim 14, wherein the stacking comprises:
- a structural layer (414), for example composed or covered by a material like Hastelloy;
- a plurality of buffer layers on the structural layer;
- the superconducting layer (406) on the plurality of buffer layers; and
- a shunt layer (404) on the superconducting layer and in the groove, the shunt layer
being made of a metal, for example silver;
wherein the groove is patterned in the buffer layers and the superconducting layer.
16. The magnetic confinement device according to claim 14 or 15, wherein the stacking
comprises a repeater layer under the shunt layer (404), the repeater layer being made
of the repetition of the buffer and superconducting layers, and preferably several
repetitions, for example between 4 and 80 repetitions, the groove being patterned
in the buffer layers, the superconducting layer and the repeater layer.
17. The magnetic confinement device according to claim 15 or 16, wherein the stacking
comprises another superconducting layer (402), for example a non-perforated and non-grooved
layer, on the shunt layer (404), comprising a superconducting material like yttrium
barium copper oxide or rare-earth barium copper oxide.
18. The magnetic confinement device according to any one of claims 15 to 17 in combination
with claim 6 or 7, wherein each channel (104) of the at least one module goes through
the structural layer (414).
19. A module (100) adapted to the magnetic confinement device according to any one of
claims 1 to 18.