(19)
(11) EP 4 268 437 A1

(12)

(43) Date of publication:
01.11.2023 Bulletin 2023/44

(21) Application number: 22704113.4

(22) Date of filing: 21.01.2022
(51) International Patent Classification (IPC): 
H04L 67/00(2022.01)
H04W 72/04(2023.01)
(52) Cooperative Patent Classification (CPC):
H04W 88/085; H04W 24/02; H04W 88/12; H04L 41/0806
(86) International application number:
PCT/US2022/013427
(87) International publication number:
WO 2022/186912 (09.09.2022 Gazette 2022/36)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 05.03.2021 US 202163157351 P
05.03.2021 US 202163157600 P
19.04.2021 US 202163176859 P
27.04.2021 US 202163180627 P
15.07.2021 US 202117376801
15.07.2021 US 202117376835
15.07.2021 US 202117376758
15.07.2021 US 202117376817
25.07.2021 US 202163225519 P
25.07.2021 US 202117384777

(71) Applicant: VMware, Inc.
Palo Alto, CA 94304 (US)

(72) Inventors:
  • SINGH, Amit
    Palo Alto, CA 94304 (US)
  • MISRA, Rakesh
    Palo Alto, CA 94304 (US)
  • GUDIPATI, Aditya
    Palo Alto, CA 94304 (US)
  • SUBRAMANI JAYAVELU, Giridhar
    Palo Alto, CA 94304 (US)

(74) Representative: Appleyard Lees IP LLP 
15 Clare Road
Halifax HX1 2HY
Halifax HX1 2HY (GB)

   


(54) RIC SDK