(19)

(11)

EP 4 275 341 A1

(12)

(43) Date of publication: 15.11.2023 Bulletin 2023/46 (21) Application number: 22737278.6 (22) Date of filing: 11.01.2022

(51) International Patent Classification (IPC):  H04L 41/5009(2022.01) H04L 67/51(2022.01) H04L 41/0896(2022.01) H04L 67/289(2022.01) (52) Cooperative Patent Classification (CPC): H04L 41/5009; H04L 41/0896; H04L 43/0876; H04L 43/20; H04L 41/0806; H04L 41/0895; H04L 43/028; H04L 43/06 (86) International application number: PCT/US2022/011907 (87) International publication number: WO 2022/150741 (14.07.2022 Gazette 2022/28)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 11.01.2021 US 202163135982 P (71) Applicant: INTEL Corporation Santa Clara, CA 95054-1549 (US)	(72) Inventors: CHOU, Joey Scottsdale, AZ 85258 (US) YAO, Yizhi Chandler, AZ 85248 (US) (74) Representative: Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte  Am Brauhaus 8 01099 Dresden 01099 Dresden (DE)