(19)
(11) EP 4 278 436 A1

(12)

(43) Date of publication:
22.11.2023 Bulletin 2023/47

(21) Application number: 21700557.8

(22) Date of filing: 13.01.2021
(51) International Patent Classification (IPC): 
H03K 17/975(2006.01)
 H01H 13/70(2006.01)
(52) Cooperative Patent Classification (CPC):
H03K 17/975; H03K 2217/960755; H03K 2217/9651; H01H 2239/006
(86) International application number:
PCT/EP2021/050550
(87) International publication number:
WO 2022/152371 (21.07.2022 Gazette 2022/29)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(71) Applicant: MERIT AUTOMOTIVE ELECTRONICS SYSTEMS S.L.U
08620 - Barcelona (ES)

(72) Inventors:
  • WO NIAK, Marek
    81-578 Gdynia (PL)
  • KWIECIE , Leszek
    32-031 Chorowice (PL)

(74) Representative: Lukaszyk, Szymon 
Kancelaria Patentowa Lukaszyk Ul. Glowackiego 8/5
40-052 Katowice
40-052 Katowice (PL)

   


(54) HAPTIC BUTTON ASSEMBLY AND A KEYPAD CONTAINING SUCH BUTTON ASSEMBLY