(19)

(11)

EP 4 278 519 A1

(12)

(43) Date of publication: 22.11.2023 Bulletin 2023/47 (21) Application number: 21841137.9 (22) Date of filing: 15.12.2021

(51) International Patent Classification (IPC):  H04L 5/00(2006.01) H04W 72/12(2023.01) (52) Cooperative Patent Classification (CPC): H04L 5/001; H04W 72/1268; H04L 5/0053; H04L 5/0044; H04W 72/569 (86) International application number: PCT/US2021/063628 (87) International publication number: WO 2022/154928 (21.07.2022 Gazette 2022/29)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 17.01.2021 US 202163138504 P 14.12.2021 US 202117644298 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: HUANG, Yi San Diego, California 92121 (US) YANG, Wei San Diego, California 92121 (US) GAAL, Peter San Diego, California 92121 (US) HOSSEINI, Seyedkianoush San Diego, California 92121 (US) (74) Representative: Bardehle Pagenberg Partnerschaft mbB Patentanwälte Rechtsanwälte  Prinzregentenplatz 7 81675 München 81675 München (DE)