(19)

(11)

EP 4 278 581 A1

(12)

(43) Date of publication: 22.11.2023 Bulletin 2023/47 (21) Application number: 22740178.3 (22) Date of filing: 14.01.2022

(51) International Patent Classification (IPC):  H04L 41/0893(2022.01) H04L 67/02(2022.01) H04L 67/51(2022.01) (52) Cooperative Patent Classification (CPC): H04L 41/0894; H04L 67/51; H04W 88/085; H04W 24/02 (86) International application number: PCT/US2022/012587 (87) International publication number: WO 2022/155511 (21.07.2022 Gazette 2022/29)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 15.01.2021 US 202163138237 P (71) Applicant: INTEL Corporation Santa Clara, CA 95054 (US)	(72) Inventors: YING, Dawei Hillsboro, Oregon 97124 (US) RUAN, Leifeng Beijing, 11, 100190 (CN) DING, Zongrui Portland, Oregon 97229 (US) HAN, Jaemin Portland, Oregon 97229 (US) LI, Qian Beaverton, Oregon 97006 (US) WU, Geng Portland, Oregon 97229 (US) (74) Representative: HGF  HGF Limited 1 City Walk Leeds LS11 9DX Leeds LS11 9DX (GB)