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EP 4 278 797 A1

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(43) Date of publication: 22.11.2023 Bulletin 2023/47 (21) Application number: 22740058.7 (22) Date of filing: 13.01.2022

(51) International Patent Classification (IPC):  H04W 72/04(2023.01) H04L 1/18(2023.01) H04W 72/00(2023.01) H04W 4/06(2009.01) (52) Cooperative Patent Classification (CPC): H04W 4/06; H04W 72/0446; H04L 1/1825; H04W 72/23 (86) International application number: PCT/US2022/012295 (87) International publication number: WO 2022/155321 (21.07.2022 Gazette 2022/29)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 15.01.2021 US 202163138256 P 06.04.2021 US 202163171485 P 11.05.2021 US 202163187286 P 01.10.2021 US 202163251521 P (71) Applicant: INTEL Corporation Santa Clara, CA 95054 (US)

(72) Inventors: SENGUPTA, Avik San Jose, California 95134 (US) CHATTERJEE, Debdeep San Jose, California 95128 (US) XIONG, Gang Beaverton, Oregon 97006 (US) LI, Yingyang Beijing 100190 (CN) (74) Representative: Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte  Am Brauhaus 8 01099 Dresden 01099 Dresden (DE)