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EP 4 278 814 A1

(12)

(43) Date of publication: 22.11.2023 Bulletin 2023/47 (21) Application number: 22740084.3 (22) Date of filing: 13.01.2022

(51) International Patent Classification (IPC):  H04W 72/12(2023.01) H04W 76/28(2018.01) H04W 4/06(2009.01) H04W 72/00(2023.01) H04W 76/40(2018.01) (52) Cooperative Patent Classification (CPC): H04W 4/06; H04W 76/40; H04W 76/28; H04W 76/27; H04W 72/30 (86) International application number: PCT/US2022/012357 (87) International publication number: WO 2022/155371 (21.07.2022 Gazette 2022/29)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 14.01.2021 US 202163137523 P (71) Applicant: INTEL Corporation Santa Clara, CA 95054 (US)	(72) Inventors: HEO, Youn Hyoung Seoul 11 150-705 (KR) LI, Ziyi Beijing 100190 (CN) PALAT, Sudeep Cheltenham Gloucestershire GL51 0GG (GB) SENGUPTA, Avik San Jose, California 95132 (US) ZHANG, Yujian Beijing 100081 (CN) (74) Representative: HGF  HGF Limited 1 City Walk Leeds LS11 9DX Leeds LS11 9DX (GB)