(19)

(11)

EP 4 281 946 A1

(12)

(43) Date of publication: 29.11.2023 Bulletin 2023/48 (21) Application number: 22702408.0 (22) Date of filing: 17.01.2022

(51) International Patent Classification (IPC):  G06V 20/59(2022.01) B60K 37/06(2006.01) G06V 40/10(2022.01) (52) Cooperative Patent Classification (CPC): B60K 37/06; B60K 2370/1464; B60K 2370/176; B60K 2370/741; B60K 2370/736; B60K 2370/733; G06V 20/597; G06V 20/593; G06V 40/11; G06V 40/113 (86) International application number: PCT/EP2022/050823 (87) International publication number: WO 2022/157090 (28.07.2022 Gazette 2022/30)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 25.01.2021 EP 21153255 (71) Applicants: Sony Semiconductor Solutions Corporation Atsugi-shi, Kanagawa 243-0014 (JP) Sony Depthsensing Solutions SA/NV 1050 Ixelles (Brussels) (BE) AL

(72) Inventors: ARORA, Varun 70327 Stuttgart (DE) EYNARD, Damien 70327 Stuttgart (DE) TOCINO DIAZ, Juan Carlos 70327 Stuttgart (DE) DAL ZOT, David 70327 Stuttgart (DE) (74) Representative: MFG Patentanwälte Meyer-Wildhagen Meggle-Freund Gerhard PartG mbB  Amalienstraße 62 80799 München 80799 München (DE)