(19)
(11) EP 4 282 001 A1

(12)

(43) Date of publication:
29.11.2023 Bulletin 2023/48

(21) Application number: 22742340.7

(22) Date of filing: 19.01.2022
(51) International Patent Classification (IPC): 
H01L 25/16(2023.01)
H01L 33/00(2010.01)
(52) Cooperative Patent Classification (CPC):
H01L 25/0753; H01L 25/167
(86) International application number:
PCT/IB2022/050444
(87) International publication number:
WO 2022/157643 (28.07.2022 Gazette 2022/30)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 22.01.2021 US 202117155518

(71) Applicant: Jade Bird Display (Shanghai) Limited
Shanghai 201306 (CN)

(72) Inventors:
  • XU, Qunchao
    Shanghai 201306 (CN)
  • LI, Qiming
    Albuquerque, New Mexico 87123 (US)

(74) Representative: Finnegan Europe LLP 
1 London Bridge
London SE1 9BG
London SE1 9BG (GB)

   


(54) SLICING MICRO-LED WAFER AND SLICING MICRO-LED CHIP