TECHNICAL FIELD
[0001] Various embodiments disclosed in the disclosure relate to an antenna module and an
electronic device including the same.
BACKGROUND ART
[0002] With the development of mobile communication technology, electronic devices having
at least one antenna are widely spread. An electronic device may transmit and/or receive
a radio frequency (RF) signal including a voice signal or data (e.g., a message, photo,
video, music file, or game) using an antenna.
[0003] The antenna is able to simultaneously transmit and receive signals belonging to different
frequency bands using a plurality of frequency bands. The electronic device may service
a global communication band using signals belonging to different frequency bands.
For example, the electronic device may perform communication using a signal belonging
to a low frequency band (LB) (e.g., GPS, Legacy, or Wifi1) and/or communication using
a signal belonging to a high frequency band (HB) (e.g., Wifi2).
[0004] Meanwhile, the electronic device may transmit and receive signals using an antenna
module including a plurality of components (e.g., a patch antenna and/or a dielectric
resonator) inside a housing. For example, the dielectric resonator included in the
antenna module may be attached to a ground portion formed on a printed circuit board,
and the patch antenna (e.g., an inverted L monopole antenna) may be electrically connected
to a point on the printed circuit board to be fed with electric power. The dielectric
resonator may be referred to as a resonant antenna element that radiates or receives
an RF signal of a specified frequency band. The dielectric resonator may be made of
a material having a high permittivity. The electronic device may transmit and/or receive
signals belonging to various frequency bands using the antenna module.
DISCLOSURE OF THE INVENTION
TECHNICAL PROBLEM
[0005] An electronic device may include a plurality of antennas that transmit and/or receive
signals of different frequency bands. The electronic device may have a physical limit
(e.g., Chu-Harrington limit) in securing a frequency band through which a plurality
of antennas transmit and receive signals. For example, an antenna included in the
electronic device has to be implemented with a specific size or larger, and thus has
no choice but to have a Q (quality factor) value equal to or greater than a specified
value. The electronic device has a problem in that the electronic device supports
only frequency signals corresponding to bandwidths at or below a certain level due
to limitations in the performance of the antenna.
[0006] Further, as a mounting space of the electronic device is limited, it may be difficult
to arrange a plurality of antennas based on a desirable separation distance. For example,
mutual interference between a plurality of antenna radiators transmitting and/or receiving
signals of different frequency bands may occur. In this case, it may be difficult
for the electronic device to provide simultaneous services in a plurality of different
frequency bands.
TECHNICAL SOLUTION
[0007] An aspect of the disclosure provides an electronic device including a housing including
a first plate facing a first direction, a second plate facing a second direction opposite
to the first direction, and a side member surrounding a space between the first plate
and the second plate, a support member disposed in the space between the first plate
and the second plate, a first printed circuit board disposed on a first surface of
the support member and including a wireless communication circuit, a second printed
circuit board disposed on the first surface of the support member and electrically
connected to the first printed circuit board, a dielectric resonator antenna disposed
on the first circuit board, and a monopole antenna disposed on one surface of the
dielectric resonator antenna facing the second direction when the back plate is viewed
in the first direction. For example, when the back plate is viewed in the first direction,
one point of a bent portion included in the monopole antenna may be disposed to be
included on a specified region of the one surface of the dielectric resonator antenna.
For example, the wireless communication circuit may feed one end of the monopole antenna
with electric power.
ADVANTAGEOUS EFFECTS
[0008] According to various embodiments disclosed in the disclosure, in an electronic device,
an antenna module including a plurality of components can be mounted inside a housing
based on a specified arrangement structure, and thus it is possible to secure improved
radiation efficiency and it is possible to achieve a greater mounting space by allowing
the antenna module to be implemented in a relatively miniaturized size.
[0009] In addition, in the electronic device, a specific type of antenna(e.g., an inverted
L antenna) can be combined with another type of antenna (e.g., a dielectric resonator),
and thus it is possible to overcome physical limits of the specific type of antenna.
[0010] Furthermore, in the electronic device, the antenna module can be mounted based on
the above-described arrangement structure, and thus it is possible to extend an electrical
path of one component included in the antenna module, and it is possible to expand
a baseband, accordingly.
[0011] Besides, various effects may be provided that are directly or indirectly understood
through the disclosure.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012]
FIG. 1 is a block diagram illustrating an electronic device in a network environment
according to various embodiments.
FIG. 2 illustrates a perspective view of a front surface of an electronic device according
to various embodiments.
FIG. 3 illustrates a perspective view of a rear surface of the electronic device according
to various embodiments.
FIG. 4 illustrates an exploded perspective view of an electronic device according
to various embodiments.
FIG. 5 illustrates a mounting structural diagram of the inside of a housing of an
electronic device according to various embodiments.
FIG. 6 illustrates a mounting conceptual diagram of the inside of a housing of an
electronic device according to various embodiments.
FIG. 7 illustrates a mounting conceptual diagram of the inside of a housing of an
electronic device according to various embodiments.
FIG. 8 illustrates a flow of current induced in an antenna module according to various
embodiments.
[0013] With respect to the description of the drawings, the same or similar reference signs
may be used for the same or similar elements.
MODE FOR CARRYING OUT THE INVENTION
[0014] Hereinafter, various embodiments disclosed in the disclosure will be described with
reference to the accompanying drawings. However, this is not intended to limit the
disclosure to the specific embodiments, and it is to be construed to include various
modifications, equivalents, and/or alternatives of embodiments of the disclosure.
[0015] FIG. 1 is a block diagram illustrating an electronic device 101 in a network environment
100 according to various embodiments. Referring to FIG. 1, the electronic device 101
in the network environment 100 may communicate with an electronic device 102 via a
first network 198 (e.g., a short-range wireless communication network), or at least
one of an electronic device 104 or a server 108 via a second network 199 (e.g., a
long-range wireless communication network). According to an embodiment, the electronic
device 101 may communicate with the electronic device 104 via the server 108. According
to an embodiment, the electronic device 101 may include a processor 120, memory 130,
an input module 150, a sound output module 155, a display module 160, an audio module
170, a sensor module 176, an interface 177, a connecting terminal 178, a haptic module
179, a camera module 180, a power management module 188, a battery 189, a communication
module 190, a subscriber identification module (SIM) 196, or an antenna module 197.
In some embodiments, at least one of the components (e.g., the connecting terminal
178) may be omitted from the electronic device 101, or one or more other components
may be added in the electronic device 101. In some embodiments, some of the components
(e.g., the sensor module 176, the camera module 180, or the antenna module 197) may
be implemented as a single component (e.g., the display module 160).
[0016] The processor 120 may execute, for example, software (e.g., a program 140) to control
at least one other component (e.g., a hardware or software component) of the electronic
device 101 coupled with the processor 120, and may perform various data processing
or computation. According to one embodiment, as at least part of the data processing
or computation, the processor 120 may store a command or data received from another
component (e.g., the sensor module 176 or the communication module 190) in volatile
memory 132, process the command or the data stored in the volatile memory 132, and
store resulting data in non-volatile memory 134. According to an embodiment, the processor
120 may include a main processor 121 (e.g., a central processing unit (CPU) or an
application processor (AP)), or an auxiliary processor 123 (e.g., a graphics processing
unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor
hub processor, or a communication processor (CP)) that is operable independently from,
or in conjunction with, the main processor 121. For example, when the electronic device
101 includes the main processor 121 and the auxiliary processor 123, the auxiliary
processor 123 may be adapted to consume less power than the main processor 121, or
to be specific to a specified function. The auxiliary processor 123 may be implemented
as separate from, or as part of the main processor 121.
[0017] The auxiliary processor 123 may control at least some of functions or states related
to at least one component (e.g., the display module 160, the sensor module 176, or
the communication module 190) among the components of the electronic device 101, instead
of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep)
state, or together with the main processor 121 while the main processor 121 is in
an active state (e.g., executing an application). According to an embodiment, the
auxiliary processor 123 (e.g., an image signal processor or a communication processor)
may be implemented as part of another component (e.g., the camera module 180 or the
communication module 190) functionally related to the auxiliary processor 123. According
to an embodiment, the auxiliary processor 123 (e.g., the neural processing unit) may
include a hardware structure specified for artificial intelligence model processing.
An artificial intelligence model may be generated by machine learning. Such learning
may be performed, e.g., by the electronic device 101 where the artificial intelligence
is performed or via a separate server (e.g., the server 108). Learning algorithms
may include, but are not limited to, e.g., supervised learning, unsupervised learning,
semi-supervised learning, or reinforcement learning. The artificial intelligence model
may include a plurality of artificial neural network layers. The artificial neural
network may be a deep neural network (DNN), a convolutional neural network (CNN),
a recurrent neural network (RNN), a restricted boltzmann machine (RBM), a deep belief
network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-network
or a combination of two or more thereof but is not limited thereto. The artificial
intelligence model may, additionally or alternatively, include a software structure
other than the hardware structure.
[0018] The memory 130 may store various data used by at least one component (e.g., the processor
120 or the sensor module 176) of the electronic device 101. The various data may include,
for example, software (e.g., the program 140) and input data or output data for a
command related thererto. The memory 130 may include the volatile memory 132 or the
non-volatile memory 134.
[0019] The program 140 may be stored in the memory 130 as software, and may include, for
example, an operating system (OS) 142, middleware 144, or an application 146.
[0020] The input module 150 may receive a command or data to be used by another component
(e.g., the processor 120) of the electronic device 101, from the outside (e.g., a
user) of the electronic device 101. The input module 150 may include, for example,
a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g.,
a stylus pen).
[0021] The sound output module 155 may output sound signals to the outside of the electronic
device 101. The sound output module 155 may include, for example, a speaker or a receiver.
The speaker may be used for general purposes, such as playing multimedia or playing
record. The receiver may be used for receiving incoming calls. According to an embodiment,
the receiver may be implemented as separate from, or as part of the speaker.
[0022] The display module 160 may visually provide information to the outside (e.g., a user)
of the electronic device 101. The display module 160 may include, for example, a display,
a hologram device, or a projector and control circuitry to control a corresponding
one of the display, hologram device, and projector. According to an embodiment, the
display module 160 may include a touch sensor adapted to detect a touch, or a pressure
sensor adapted to measure the intensity of force incurred by the touch.
[0023] The audio module 170 may convert a sound into an electrical signal and vice versa.
According to an embodiment, the audio module 170 may obtain the sound via the input
module 150, or output the sound via the sound output module 155 or a headphone of
an external electronic device (e.g., an electronic device 102) directly (e.g., wiredly)
or wirelessly coupled with the electronic device 101.
[0024] The sensor module 176 may detect an operational state (e.g., power or temperature)
of the electronic device 101 or an environmental state (e.g., a state of a user) external
to the electronic device 101, and then generate an electrical signal or data value
corresponding to the detected state. According to an embodiment, the sensor module
176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure
sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor,
a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor,
a humidity sensor, or an illuminance sensor.
[0025] The interface 177 may support one or more specified protocols to be used for the
electronic device 101 to be coupled with the external electronic device (e.g., the
electronic device 102) directly (e.g., wiredly) or wirelessly. According to an embodiment,
the interface 177 may include, for example, a high definition multimedia interface
(HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface,
or an audio interface.
[0026] A connecting terminal 178 may include a connector via which the electronic device
101 may be physically connected with the external electronic device (e.g., the electronic
device 102). According to an embodiment, the connecting terminal 178 may include,
for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector
(e.g., a headphone connector).
[0027] The haptic module 179 may convert an electrical signal into a mechanical stimulus
(e.g., a vibration or a movement) or electrical stimulus which may be recognized by
a user via his tactile sensation or kinesthetic sensation. According to an embodiment,
the haptic module 179 may include, for example, a motor, a piezoelectric element,
or an electric stimulator.
[0028] The camera module 180 may capture a still image or moving images. According to an
embodiment, the camera module 180 may include one or more lenses, image sensors, image
signal processors, or flashes.
[0029] The power management module 188 may manage power supplied to the electronic device
101. According to one embodiment, the power management module 188 may be implemented
as at least part of, for example, a power management integrated circuit (PMIC).
[0030] The battery 189 may supply power to at least one component of the electronic device
101. According to an embodiment, the battery 189 may include, for example, a primary
cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel
cell.
[0031] The communication module 190 may support establishing a direct (e.g., wired) communication
channel or a wireless communication channel between the electronic device 101 and
the external electronic device (e.g., the electronic device 102, the electronic device
104, or the server 108) and performing communication via the established communication
channel. The communication module 190 may include one or more communication processors
that are operable independently from the processor 120 (e.g., the application processor
(AP)) and supports a direct (e.g., wired) communication or a wireless communication.
According to an embodiment, the communication module 190 may include a wireless communication
module 192 (e.g., a cellular communication module, a short-range wireless communication
module, or a global navigation satellite system (GNSS) communication module) or a
wired communication module 194 (e.g., a local area network (LAN) communication module
or a power line communication (PLC) module). A corresponding one of these communication
modules may communicate with the external electronic device via the first network
198 (e.g., a short-range communication network, such as Bluetooth
™, wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or the second
network 199 (e.g., a long-range communication network, such as a legacy cellular network,
a 5G network, a next-generation communication network, the Internet, or a computer
network (e.g., LAN or wide area network (WAN)). These various types of communication
modules may be implemented as a single component (e.g., a single chip), or may be
implemented as multi components (e.g., multi chips) separate from each other. The
wireless communication module 192 may identify and authenticate the electronic device
101 in a communication network, such as the first network 198 or the second network
199, using subscriber information (e.g., international mobile subscriber identity
(IMSI)) stored in the subscriber identification module 196.
[0032] The wireless communication module 192 may support a 5G network, after a 4G network,
and next-generation communication technology, e.g., new radio (NR) access technology.
The NR access technology may support enhanced mobile broadband (eMBB), massive machine
type communications (mMTC), or ultra-reliable and low-latency communications (URLLC).
The wireless communication module 192 may support a high-frequency band (e.g., the
mmWave band) to achieve, e.g., a high data transmission rate. The wireless communication
module 192 may support various technologies for securing performance on a high-frequency
band, such as, e.g., beamforming, massive multiple-input and multiple-output (massive
MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large
scale antenna. The wireless communication module 192 may support various requirements
specified in the electronic device 101, an external electronic device (e.g., the electronic
device 104), or a network system (e.g., the second network 199). According to an embodiment,
the wireless communication module 192 may support a peak data rate (e.g., 20Gbps or
more) for implementing eMBB, loss coverage (e.g., 164dB or less) for implementing
mMTC, or U-plane latency (e.g., 0.5ms or less for each of downlink (DL) and uplink
(UL), or a round trip of 1ms or less) for implementing URLLC.
[0033] The antenna module 197 may transmit or receive a signal or power to or from the outside
(e.g., the external electronic device) of the electronic device 101. According to
an embodiment, the antenna module 197 may include an antenna including a radiating
element composed of a conductive material or a conductive pattern formed in or on
a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the
antenna module 197 may include a plurality of antennas (e.g., array antennas). In
such a case, at least one antenna appropriate for a communication scheme used in the
communication network, such as the first network 198 or the second network 199, may
be selected, for example, by the communication module 190 (e.g., the wireless communication
module 192) from the plurality of antennas. The signal or the power may then be transmitted
or received between the communication module 190 and the external electronic device
via the selected at least one antenna. According to an embodiment, another component
(e.g., a radio frequency integrated circuit (RFIC) ) other than the radiating element
may be additionally formed as part of the antenna module 197.
[0034] According to various embodiments, the antenna module 197 may form a mmWave antenna
module. According to an embodiment, the mmWave antenna module may include a printed
circuit board, a RFIC disposed on a first surface (e.g., the bottom surface) of the
printed circuit board, or adjacent to the first surface and capable of supporting
a designated high-frequency band (e.g., the mmWave band), and a plurality of antennas
(e.g., array antennas) disposed on a second surface (e.g., the top or a side surface)
of the printed circuit board, or adjacent to the second surface and capable of transmitting
or receiving signals of the designated high-frequency band.
[0035] At least some of the above-described components may be coupled mutually and communicate
signals (e.g., commands or data) therebetween via an inter-peripheral communication
scheme (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface
(SPI), or mobile industry processor interface (MIPI)).
[0036] According to an embodiment, commands or data may be transmitted or received between
the electronic device 101 and the external electronic device 104 via the server 108
coupled with the second network 199. Each of the electronic devices 102 or 104 may
be a device of a same type as, or a different type, from the electronic device 101.
According to an embodiment, all or some of operations to be executed at the electronic
device 101 may be executed at one or more of the external electronic devices 102,
104, or 108. For example, if the electronic device 101 should perform a function or
a service automatically, or in response to a request from a user or another device,
the electronic device 101, instead of, or in addition to, executing the function or
the service, may request the one or more external electronic devices to perform at
least part of the function or the service. The one or more external electronic devices
receiving the request may perform the at least part of the function or the service
requested, or an additional function or an additional service related to the request,
and transfer an outcome of the performing to the electronic device 101. The electronic
device 101 may provide the outcome, with or without further processing of the outcome,
as at least part of a reply to the request. To that end, a cloud computing, distributed
computing, mobile edge computing (MEC), or client-server computing technology may
be used, for example. The electronic device 101 may provide ultra low-latency services
using, e.g., distributed computing or mobile edge computing. In another embodiment,
the external electronic device 104 may include an internet-of-things (IoT) device.
The server 108 may be an intelligent server using machine learning and/or a neural
network. According to an embodiment, the external electronic device 104 or the server
108 may be included in the second network 199. The electronic device 101 may be applied
to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based
on 5G communication technology or loT-related technology.
[0037] The electronic device according to various embodiments may be one of various types
of electronic devices. The electronic devices may include, for example, a portable
communication device (e.g., a smartphone), a computer device, a portable multimedia
device, a portable medical device, a camera, a wearable device, or a home appliance.
According to an embodiment of the disclosure, the electronic devices are not limited
to those described above.
[0038] It should be appreciated that various embodiments of the disclosure and the terms
used therein are not intended to limit the technological features set forth herein
to particular embodiments and include various changes, equivalents, or replacements
for a corresponding embodiment. With regard to the description of the drawings, similar
reference numerals may be used to refer to similar or related elements. It is to be
understood that a singular form of a noun corresponding to an item may include one
or more of the things, unless the relevant context clearly indicates otherwise. As
used herein, each of such phrases as "A or B," "at least one of A and B," "at least
one of A or B," "A, B, or C, " "at least one of A, B, and C," and "at least one of
A, B, or C," may include any one of, or all possible combinations of the items enumerated
together in a corresponding one of the phrases. As used herein, such terms as "1st"
and "2nd," or "first" and "second" may be used to simply distinguish a corresponding
component from another, and does not limit the components in other aspect (e.g., importance
or order). It is to be understood that if an element (e.g., a first element) is referred
to, with or without the term "operatively" or "communicatively", as "coupled with,"
"coupled to," "connected with," or "connected to" another element (e.g., a second
element), it means that the element may be coupled with the other element directly
(e.g., wiredly), wirelessly, or via a third element.
[0039] As used in connection with various embodiments of the disclosure, the term "module"
may include a unit implemented in hardware, software, or firmware, and may interchangeably
be used with other terms, for example, "logic," "logic block," "part," or "circuitry".
A module may be a single integral component, or a minimum unit or part thereof, adapted
to perform one or more functions. For example, according to an embodiment, the module
may be implemented in a form of an application-specific integrated circuit (ASIC).
[0040] Various embodiments as set forth herein may be implemented as software (e.g., the
program 140) including one or more instructions that are stored in a storage medium
(e.g., internal memory 136 or external memory 138) that is readable by a machine (e.g.,
the electronic device 101). For example, a processor (e.g., the processor 120) of
the machine (e.g., the electronic device 101) may invoke at least one of the one or
more instructions stored in the storage medium, and execute it, with or without using
one or more other components under the control of the processor. This allows the machine
to be operated to perform at least one function according to the at least one instruction
invoked. The one or more instructions may include a code generated by a complier or
a code executable by an interpreter. The machine-readable storage medium may be provided
in the form of a non-transitory storage medium. Wherein, the term "non-transitory"
simply means that the storage medium is a tangible device, and does not include a
signal (e.g., an electromagnetic wave), but this term does not differentiate between
where data is semi-permanently stored in the storage medium and where the data is
temporarily stored in the storage medium.
[0041] According to an embodiment, a method according to various embodiments of the disclosure
may be included and provided in a computer program product. The computer program product
may be traded as a product between a seller and a buyer. The computer program product
may be distributed in the form of a machine-readable storage medium (e.g., compact
disc read only memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded)
online via an application store (e.g., PlayStore
™), or between two user devices (e.g., smart phones) directly. If distributed online,
at least part of the computer program product may be temporarily generated or at least
temporarily stored in the machine-readable storage medium, such as memory of the manufacturer's
server, a server of the application store, or a relay server.
[0042] According to various embodiments, each component (e.g., a module or a program) of
the above-described components may include a single entity or multiple entities, and
some of the multiple entities may be separately disposed in different components.
According to various embodiments, one or more of the above-described components may
be omitted, or one or more other components may be added. Alternatively or additionally,
a plurality of components (e.g., modules or programs) may be integrated into a single
component. In such a case, according to various embodiments, the integrated component
may still perform one or more functions of each of the plurality of components in
the same or similar manner as they are performed by a corresponding one of the plurality
of components before the integration. According to various embodiments, operations
performed by the module, the program, or another component may be carried out sequentially,
in parallel, repeatedly, or heuristically, or one or more of the operations may be
executed in a different order or omitted, or one or more other operations may be added.
[0043] FIG. 2 is a perspective view illustrating a front surface of an electronic device
200 (e.g., the electronic device 101 of FIG. 1) according to an embodiment. FIG. 3
is a perspective view illustrating a rear surface of the electronic device 200 according
to an embodiment.
[0044] Referring to FIGS. 2 and 3, the electronic device 200 according to an embodiment
may include a housing 210 including a first surface (or front surface) 210A, a second
surface (or back surface) 210B, and a side surface 210C surrounding a space between
the first surface 210A and the second surface 210B. In another embodiment (not illustrated),
the housing may refer to a structure forming some of the first surface 210A, the second
surface 210B, and the side surface 210C of FIG. 2. According to an embodiment, the
first surface 210A may be formed by a front plate 202 (e.g., a glass plate or a polymer
plate including various coating layers) that is at least partially substantially transparent.
The second surface 210B may be formed by a back plate 211 that is substantially opaque.
The back plate 211 may be formed, for example, by coated or colored glass, ceramic,
polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination
of at least two of the above materials. The side surface 210C may be coupled with
the front plate 202 and the back plate 211, and may be formed by a side bezel structure
(or "side member") 218 that includes metal and/or polymer. In some embodiments, the
back plate 211 and the side bezel structure 218 may be integrally formed and may include
the same material (e.g., a metal material such as aluminum).
[0045] In the illustrated embodiment, the front plate 202 may include two first regions
210D that are curved from the first surface 210A toward the back plate 211 and extend
seamlessly at both long edges of the front plate 202. In the illustrated embodiment
(see FIG. 3), the back plate 211 may include two second regions 210E that are curved
from the second surface 210B toward the front plate 202 and extend seamlessly at the
both long edges. In some embodiments, the front plate 202 (or the back plate 211)
may include only one of the first regions 210D (or the second regions 210E). In another
embodiment, some of the first regions 210D or the second regions 210E may not be included.
In embodiments, when viewed from the side of the electronic device 200, the side bezel
structure 218 may have a first thickness (or width) on the sides where the first regions
210D or the second regions 210E as described above are not included, and may have
a second thickness thinner than the first thickness on the sides (e.g., long sides)
where the first regions 210D or the second regions 210E are included.
[0046] In an embodiment, in the side member of the housing 210 of the electronic device
200 (e.g., the side bezel structure 218 of FIG. 3), two first regions 210D that are
curved from the first surface 210A of the front plate 302 toward the back plate 211
and extend seamlessly, or two second regions 210E that are curved from the second
surface 210B of the back plate 211 toward the front plate 202 and extend seamlessly,
at least one antenna radiator (e.g., a conductive pattern) may be disposed.
[0047] In an embodiment, the at least one antenna radiator may radiate a signal of a specified
frequency band. In an embodiment, the at least one antenna radiator may be an auxiliary
radiator. For example, the at least one antenna radiator may radiate a signal belonging
to a 5G Sub-6 frequency band of 3.5 GHz or more and about 6 GHz or less, such as n41,
n78, and/or n79. For another example, the at least one antenna radiator may radiate
a frequency of a Wifi frequency band. The Wifi frequency band may include a frequency
band such as 802.11a and/or 802.11b.
[0048] In an embodiment, the at least one antenna radiator may be a main radiator. In an
embodiment, a frequency band radiated by the main radiator and a frequency band radiated
by the auxiliary radiator may be partially the same and different in others.
[0049] In an embodiment, for another example, the at least one antenna radiator may radiate
a frequency in a mmWave frequency band. For example, the mmWave frequency band may
include a frequency band such as about 24 to 34 GHz and/or about 37 to 44 GHz. For
another example, the at least one antenna radiator may radiate a frequency of a 11ay
frequency band.
[0050] According to an embodiment, the electronic device 200 may include at least one of
a display 201 (e.g., the display module 160 of FIG. 1), audio modules 303, 307, and
314 (e.g., the audio module 170 of FIG. 1), sensor modules 304, 316, and 319 (e.g.,
the sensor module 176 of FIG. 1), camera modules 205, 212, and 213 (e.g., the camera
module 180 of FIG. 1), key input devices 217, a light emitting element 206, and connector
holes 208 and 209. In some embodiments, the electronic device 200 may omit at least
one of the components (e.g., the key input devices 217 or the light emitting element
206) or may additionally include other components.
[0051] The display 201 may be exposed through a significant portion of the front plate 202,
for example. In some embodiments, at least a portion of the display 201 may be exposed
through the front plate 202 forming the first surface 210A and the first regions 210D
of the side surface 210C. In some embodiments, an edge of the display 201 may be formed
to be substantially the same as the outer edge of the front plate 202 adjacent to
the edge. In another embodiment (not illustrated), in order to expand the area where
the display 201 is exposed, a distance between the outer edge of the display 201 and
the outer edge of the front plate 202 may be formed to be substantially the same as
each other.
[0052] In another embodiment (not illustrated), in a portion of a screen display region
of the display 201, a recess or opening may be formed, and at least one of an audio
module 214, a sensor module 204, a camera module 205, and the light emitting element
206, which are aligned with the recess or the opening may be included. In another
embodiment (not illustrated), the display 201 may include, on the back of the screen
display region of the display 201, at least one of the audio module 214, the sensor
module 204, the camera module 205, a fingerprint sensor 216, and the light emitting
element 206. In another embodiment (not illustrated), the display 201 may be coupled
with or disposed adjacent to a touch sensing circuit, a pressure sensor capable of
measuring the intensity (pressure) of the touch, and/or a digitizer detecting a magnetic
field type stylus pen. In some embodiments, at least some of the sensor modules 204
and 219, and/or at least some of the key input devices 217 may be disposed on the
first regions 210D and/or the second regions 210E.
[0053] The audio modules 203, 207, and 214 may include a microphone hole 203 and speaker
holes 207 and 214. In the microphone hole 203, a microphone for acquiring external
sound may be disposed therein, and in some embodiments, a plurality of microphones
may be disposed to sense the direction of sound. The speaker holes 207 and 214 may
include an external speaker hole 207 and a call receiver hole 214. In some embodiments,
the speaker holes 207 and 214 and the microphone hole 203 may be implemented as one
hole, or a speaker without the speaker holes 207 and 214 (e.g., a piezo speaker) may
be included.
[0054] The sensor modules 204, 216, and 219 may generate an electrical signal or data value
corresponding to an internal operational state or an external environmental state
of the electronic device 200. The sensor modules 204, 216, and 219 may include, for
example, a first sensor module 204 (e.g., a proximity sensor) and/or a second sensor
module (not illustrated)(e.g., the fingerprint sensor) disposed on the first surface
210A of the housing 210, and/or a third sensor module 219 (e.g., an HRM sensor) and/or
a fourth sensor module 216 (e.g., the fingerprint sensor) disposed on the second surface
210B of the housing 210. The fingerprint sensor may be disposed on the second surface
210B as well as the first surface 210A (e.g., the display 201) of the housing 210.
The electronic device 200 may further include a sensor module, which is not illustrated,
for example, a at least one of a gesture sensor, a gyro sensor, an atmospheric pressure
sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor,
an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor,
or an illuminance sensor 204.
[0055] The camera modules 205, 212, and 213 may include a first camera device 205 disposed
on the first surface 210A of the electronic device 200, and a second camera device
212 and/or a flash 213 disposed on the second surface 210B. The camera devices 205
and 212 may include one or more lenses, an image sensor, and/or an image signal processor.
The flash 213 may include, for example, a light emitting diode or a xenon lamp. In
some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses)
and image sensors may be disposed on one surface of the electronic device 200.
[0056] The key input devices 217 may be disposed on the side surface 210C of the housing
210. In another embodiment, the electronic device 200 may not include some or all
of the key input devices 217 mentioned above, and the key input device(s) 217, which
is (are) not included, may be implemented in other forms, such as a soft key, on the
display 201. In some embodiments, the key input device may include the sensor module
216 disposed on the second surface 210B of the housing 210.
[0057] The light emitting element 206 may be disposed on the first surface 210A of the housing
210, for example. The light emitting element 206 may provide, for example, state information
about the electronic device 200 in the form of light. In another embodiment, the light
emitting element 206 may provide, for example, a light source linked with the operation
of the camera module 205. The light emitting element 206 may include, for example,
an LED, an IR LED, and a xenon lamp.
[0058] The connector holes 208 and 209 may include a first connector hole 208 capable of
accommodating a connector (for example, a USB connector) for transmitting and receiving
electric power and/or data to and from an external electronic device, and/or a second
connector hole 209 (e.g., an earphone jack) capable of accommodating a connector for
transmitting and receiving audio signals to and from an external electronic device.
[0059] FIG. 4 is an exploded perspective view 400 illustrating an electronic device (e.g.,
the electronic device 200 of FIG. 2 and/or FIG. 3) according to an embodiment. Referring
to FIG. 2, the electronic device 200 may include a side bezel structure 410 (e.g.,
the side bezel structure 218 of FIG. 2), a first support member 411 (e.g., a bracket),
a front plate 420, a display 430 (e.g., the display 201 of FIG. 2), a printed circuit
board (PCB) 440, a battery 450, a second support member 460 (e.g., a rear case), a
short-range antenna 470, and a back plate 480 (e.g., the back plate 211 of FIG. 3).
In some embodiments, the electronic device 200 may omit at least one of the components
(e.g., the first support member 411 or the second support member 460) or may additionally
include other components. At least one of the components of the electronic device
200 may be the same as or similar to at least one of the components of the electronic
device 200 of FIG. 2 or FIG. 3, and the description thereof will not be repeated below.
[0060] The side bezel structure 410 may include at least one conductive member that surrounds
a space between the front plate 420 and the back plate 480 of the electronic device
200 and is spaced apart by a slit. For example, the side bezel structure 410 may further
include a plurality of slits (not illustrated). The side bezel structure 410 may further
include a plurality of conductive members spaced apart by the plurality of slits.
Each of the conductive members may be fed with electric power from a printed circuit
board mounted inside the electronic device 200 to transmit and/or receive signals
of a specified frequency band.
[0061] The first support member 411 may be disposed in the space between the front plate
420 and the back plate 480. The first support member 411 may be disposed inside the
electronic device 200 to be connected to the side bezel structure 410 or may be integrally
formed with the side bezel structure 410. The first support member 411 may be formed
of, for example, a metal material and/or a non-metal (e.g., polymer) material. The
display 430 may be disposed on a first surface (e.g., one surface facing a +z-axis
direction) of the first support member 411, and the PCB 440 may be disposed on a second
surface (e.g., one surface facing a -z-axis direction) facing the opposite direction
to the first surface.
[0062] On the PCB 440, a processor (e.g., the processor 120 of FIG. 1), a memory (e.g.,
the memory 130 of FIG. 1), an interface (e.g., the interface 177 of FIG. 1), and/or
a wireless communication circuit (e.g., the wireless communication module 192 of FIG.
1) may be disposed. The processor 120 may include, for example, one or more of a central
processing unit (CPU), an application processor (AP), a graphic processing unit (GPU),
an image signal processor (ISP), a sensor hub processor (SHP), or a communication
processor (CP). The memory may include, for example, a volatile memory or a non-volatile
memory. The interface may include, for example, a high definition multimedia interface
(HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface,
and/or an audio interface. The interface may electrically or physically connect the
electronic device 200 with an external electronic device (e.g., the electronic devices
102 and 104 of FIG. 1), for example, and may include a USB connector, an SD card/MMC
connector, or an audio connector. The wireless communication circuit may be a radio
frequency integrated circuit (RFIC). For example, the wireless communication circuit
may feed electric power to at least a portion of the side bezel structure 410 (e.g.,
a plurality of conductive members spaced apart by slits). For another example, the
wireless communication circuit may feed electric power to the antenna module (e.g.,
the monopole antenna) mounted inside the electronic device 200.
[0063] The battery 450 may be a device for supplying power to at least one of the components
of the electronic device 200, and may include, for example, a primary cell which is
not rechargeable, a secondary cell which is rechargeable, or a fuel cell. At least
a portion of the battery 450 may be disposed on substantially the same plane as the
PCB 440, for example. The battery 450 may be integrally disposed inside the electronic
device 200 or may be disposed to be detachable from the electronic device 200.
[0064] The short-range antenna 470 may be disposed between the back plate 480 and the battery
450. The antenna 470 may include, for example, a near field communication (NFC) antenna,
a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
The antenna 470 may, for example, perform short range communication with an external
device, or may wirelessly transmit and receive electric power required for charging.
In another embodiment, an antenna structure may be formed by the side bezel structure
410 and/or a portion of the first support member 411 or a combination thereof. For
example, the wireless communication circuit may feed electric power to a portion of
the side bezel structure 410 (e.g., a plurality of conductive members spaced apart
by slits), so that the portion may operate as an antenna radiator. Hereinafter, various
antenna structures of the electronic device will be described in more detail.
[0065] FIG. 5 illustrates a mounting structural diagram of the inside of a housing of an
electronic device according to various embodiments.
[0066] An electronic device (e.g., the electronic device 101 of FIG. 1) may include a side
member 510 (e.g., the side bezel structure 410 of FIG. 4). A drawing shown at reference
number 501 of FIG. 5 may be a cross-sectional view of a back plate of the electronic
device viewed in a first direction (e.g., a +z-axis direction). The electronic device
may include various components inside a housing. For example, the electronic device
may include a battery 550 inside the housing. For another example, the electronic
device may include various components shown in a region corresponding to reference
numeral 520 inside the housing.
[0067] Referring to reference numeral 520, the electronic device may include various components
inside the housing. For example, the electronic device may include the side member
510, a first printed circuit board 550 electrically connected to the side member 510,
and an antenna module 560 disposed on one surface of the first printed circuit board
550, but the electronic device is not limited thereto and may further include a second
printed circuit board (not illustrated). According to an embodiment, the first printed
circuit board 550 may be a flexible printed circuit board (FPCB). For example, the
first printed circuit board 550 may include a bending region 553 that is bent at a
specified angle (e.g., 90 degrees), and a first region 551 and a second region 552
which are divided from each other based on the bending region 553. For example, one
point of the first region 501 of the first printed circuit board 550 may be electrically
connected to the side member 510, and one point of the second region 552 thereof may
be electrically connected to at least a portion of the antenna modules 560. At least
a portion of the first region 551 of the first printed circuit board 550 may correspond
to a power feeder that feeds electric power to a conductive member included in the
side member 510, and at least a portion of the second region 552 thereof may correspond
to a ground region for at least one component of the antenna module 560. To this end,
the first printed circuit board 550 may include a power feeding circuit for feeding
electric power to the antenna module 560 and a planar ground portion. The first printed
circuit board 550 may be disposed formed on a first surface of a support member (e.g.,
the support member 411 or the second support member 460 of FIG. 4) (e.g., one surface
facing a -z direction of the support member) inside the housing. The first printed
circuit board 550 may be electrically connected to the second printed circuit board
(e.g., a main PCB). Descriptions of mounting structures of the first printed circuit
board 550 and the second printed circuit board may be replaced with descriptions of
FIGS. 6 and 7 to be described below. The antenna module 560 may be referred to as
one component including a plurality of antennas of different types. For example, the
antenna module 560 may include a dielectric resonator antenna. The dielectric resonator
antenna included in the antenna module 560 may be substantially built in a rectangular
parallelepiped shape. The dielectric resonator antenna may be disposed on one surface
of the first printed circuit board 550. For another example, the antenna module 560
may further include a monopole antenna. The monopole antenna may be disposed on a
first surface of the dielectric resonator antenna facing a second direction (e.g.,
the -z direction). For example, when the back plate is viewed in the first direction,
one point of a bent portion included in the monopole antenna may be included on a
specified region of the one surface of the dielectric resonator antenna. A description
of an arrangement structure of the dielectric resonator antenna and the monopole antenna
may be referred to in more detail in the descriptions of FIGS. 6 and 7 to be described
below.
[0068] FIG. 6 illustrates a mounting conceptual diagram of the inside of a housing of an
electronic device according to various embodiments.
[0069] Referring to FIG. 6, according to an embodiment, an electronic device (e.g., the
electronic device 101 of FIG. 1) may include various components mounted inside a housing.
For example, the electronic device may include a side member 610 (e.g., the side bezel
structure 410 of FIG. 4) , a first printed circuit board 650 (e.g., the first printed
circuit board 550 of FIG. 5) electrically connected to the side member 610 and disposed
on a first surface of a support member (e.g., the first support member 411 or the
second support member 460 of FIG. 4) (e.g., one surface of the support member facing
the - z direction), a second printed circuit board 640 disposed on the first surface
of the support member and electrically connected to the first printed circuit board
650, a dielectric resonator antenna 661 and/or a monopole antenna 662. According to
an embodiment, the side member 610 may include a plurality of members physically divided
by at least one nonconductive material. For example, the plurality of members may
be conductive members, and may be fed with electric power from a wireless communication
circuit (e.g., the communication module 190 of FIG. 1) to transmit and/or receive
signals of a specified frequency band. Hereinafter, components included in a region
corresponding to reference numeral 620 will be described in more detail.
[0070] Referring to reference numeral 620, according to an embodiment, the electronic device
may include the side member 610, the second printed circuit board 640, and the first
printed circuit board 650 electrically connected to the dielectric resonator antenna
661 and/or the monopole antenna 662, and including a wireless communication circuit
(e.g., the communication module 190 of FIG. 1).
[0071] According to an embodiment, the first printed circuit board 650 may be an FPCB. For
example, the first printed circuit board 650 may include a bending region 653 that
is bent at a specified angle (e.g., 90 degrees), and a first region 651 and a second
region 652 which are divided from each other based on the bending region. For example,
the first region 651 of the first printed circuit board 650 may be electrically connected
to the side member 610. A power feeding circuit for feeding electric power to the
conductive member included in the side member 610 may be included in the first region
651 of the first printed circuit board 650. In other words, a power feeder for the
conductive member included in the side member 610 may be formed in at least a portion
of the first region 651. One point 611 of the first region 651 may be electrically
connected to the side member 610, and the side member 610 may be fed with electric
power from the one point 611 of the first region 651. For another example, the second
region 652 of the first printed circuit board 650 may be electrically connected to
the dielectric resonator antenna 661 and/or the monopole antenna 662. The second region
652 of the first printed circuit board 650 may include a power feeding circuit for
feeding electric power to the monopole antenna 662 and a ground region for providing
a ground for the dielectric resonator antenna 661. For example, one point 663 of the
second region 652 of the first printed circuit board 650 may be electrically connected
to the monopole antenna 662 and feed electric power to one end of the monopole antenna
662. For another example, at least a portion of the second region 652 of the first
printed circuit board 650 may correspond to the ground region for the dielectric resonator
antenna 661, and the ground region may include a planar ground portion.
[0072] According to an embodiment, the second printed circuit board 640 may be referred
to as a main PCB electrically connected to the first printed circuit board 650. For
example, at least a portion of the second printed circuit board 640 may include a
ground region. In FIG. 6, the dielectric resonator antenna 661 and the monopole antenna
662 are illustrated as being coupled on one surface of the first printed circuit board
650, but according to another embodiment, the dielectric resonator antenna 661 and
the monopole antenna 662 may be coupled to at least a portion of a ground region included
in the second printed circuit board 640 to be grounded.
[0073] According to an embodiment, the dielectric resonator antenna 661 may be coupled on
one surface of the first printed circuit board 650. The dielectric resonator antenna
661 may be substantially built in a rectangular parallelepiped shape. A relative permittivity
of the dielectric resonator antenna may be 10 to 50 F/m. For example, the dielectric
resonator antenna 661 may be disposed in a form in which it is coupled to one surface
included in the second region 652 of the first printed circuit board 650. For example,
the one surface included in the second region 652 may correspond to one surface of
the first printed circuit board 650 facing a third direction (e.g., a - x direction)
that is one direction substantially orthogonal to a first direction (e.g., the +z
direction) and a second direction (e.g., the -z direction) and oriented when the side
member 610 is viewed toward the outside of the housing. At least a portion of the
one surface may include a planar ground portion, and the dielectric resonator antenna
661 may be disposed on and grounded on the planar ground portion. For another example,
the dielectric resonator antenna 661 may be disposed to be spaced apart from the side
member 610 by a specified distance. As illustrated in FIG. 6, the dielectric resonator
antenna 661 may be coupled to one surface of the first printed circuit board 650 and
disposed to be spaced apart from the side member 610 by a specified distance in the
+ x direction. Various types of antennas may be disposed on one surface of the dielectric
resonator antenna 661.
[0074] According to an embodiment, the monopole antenna 662 may be disposed on one surface
of the dielectric resonator antenna 661. The monopole antenna 662 may correspond to
an inverted L antenna. For example, the monopole antenna 662 may be disposed on one
surface of the dielectric resonator antenna 661 facing the second direction. The monopole
antenna 662 may be attached to the one surface or may be disposed to be spaced apart
from the one surface by a specified distance in the second direction. For example,
when the monopole antenna 662 is disclosed to be spaced apart from the dielectric
resonator antenna 661 by a specified distance, a dielectric may be formed in the separation
space between the monopole antenna and the dielectric resonator antenna. In other
words, the monopole antenna 662 may be disposed to be spaced apart from the dielectric
resonator antenna 661 by the specified distance by the dielectric. One end of the
monopole antenna 662 may be electrically connected to at least one point of the second
region 652 of the first printed circuit board 650 and fed with electric power. As
illustrated in FIG. 6, when the back plate is viewed in the first direction, the monopole
antenna 662 may be disposed so that one point of the bent portion included in the
monopole antenna 662 is included on a specified region of one surface of the dielectric
resonator antenna facing the second direction. The specified region of the dielectric
resonator 661 may be a central region on the one surface of the dielectric resonator
antenna 661 facing the second direction. The one point of the bent portion may correspond
to a point adjacent to the first printed circuit board 650 in the bent portion of
the monopole antenna 662. A description of the specified region of the dielectric
resonator antenna 661 may be referred to in more detail in FIG. 7 to be described
below.
[0075] FIG. 7 illustrates a mounting conceptual diagram 700 of the inside of a housing of
an electronic device according to various embodiments.
[0076] Referring to FIG. 7, according to an embodiment, an electronic device (e.g., the
electronic device 101 of FIG. 1) may include a plurality of components mounted inside
a housing. For example, the electronic device may include a side member 710, a first
printed circuit board 750, a dielectric resonator antenna 761, and/or a monopole antenna
762. Hereinafter, an arrangement structure between components may be described below
in more detail.
[0077] According to an embodiment, the dielectric resonator antenna 761 may be disposed
on one surface 750-1 of the first printed circuit board 750. A relative permittivity
of the dielectric resonator antenna 761 included in the electronic device may be 10
to 50 F/m. For example, the dielectric resonator antenna 761 may substantially correspond
to a rectangular parallelepiped shape, and the dielectric resonator antenna 761 may
be disposed so that one surface thereof is coupled to one surface 750-1 of the first
printed circuit board 750. The one surface 750-1 may be at least a portion of a second
region (e.g., the second region 652 of FIG. 6) of the first printed circuit board
750 and include a planar ground portion. For example, the one surface 750-1 may be
one surface included in the second region and facing the third direction (e.g., the
-x direction) and referred to as one surface of the first printed circuit board 750
facing the outside of the housing when the side member 710 is viewed. For example,
the dielectric resonator antenna 761 may be grounded by being coupled to the planar
ground portion. For another example, a plurality of conductive members (not illustrated)
included in the side member 710 and divided by slits (or openings) may be grounded
by the planar ground portion. The dielectric resonator antenna 761 may be disposed
to be coupled to the one surface 750-1 and spaced apart from the side member 10 by
a specified distance.
[0078] According to an embodiment, the monopole antenna 762 may be disposed so that at least
a portion thereof overlaps the dielectric resonator antenna 761 when the back plate
(e.g., the back plate 480 of FIG. 4) is viewed in the first direction (e.g., the +
z direction). For example, the monopole antenna 762 may be disposed on one surface
of the dielectric resonator antenna 761 facing the second direction (e.g., the - z
direction). The monopole antenna 762 may be disposed to be included on a specified
region 770 of the dielectric resonator antenna 761. For example, one point 762-1 of
a bent portion included in the monopole antenna 762 may be disposed to be included
on the specified region 770 of one surface of the dielectric resonator antenna 761
facing the second direction. The one point 762-1 may be referred to as a point of
the bent portion included in the monopole antenna 762 that is adjacent to the first
printed circuit board 750. The specified region 770 may be referred to as a central
region on the one surface of the dielectric resonator antenna 761. One end of the
monopole antenna 762 may be electrically connected to one point 750-2 of the second
region included in the first printed circuit board 750 and fed with electric power.
[0079] According to an embodiment, the specified region 770 may be referred to as one region
divided based on a plurality of axes on one surface of the dielectric resonator antenna
761 facing the second direction. For example, the specified region 770 may correspond
to a region between a first axis 771 on the one surface of the dielectric resonator
antenna 761, a second axis 772 substantially parallel to the first axis 771, and a
third axis 773 substantially orthogonal to the first axis 771 and the second axis
772, and at least a portion of the first printed circuit board 750 (e.g., the one
surface 750-1). The first axis 771 and the second axis 772 may correspond to one axis
horizontally crossing the dielectric resonator antenna 761 when the back plate (or
the dielectric resonator antenna 761) is viewed in the first direction. The third
axis 773 may correspond to one axis substantially orthogonal to the first axis 771
and the second axis 772 when the back plate (or the dielectric resonator antenna 761)
is viewed in the first direction, and vertically crossing the dielectric resonator
antenna 761. For example, when the back plate (or the dielectric resonator antenna
761) is viewed in the first direction, a vertical length d10 of one surface of the
dielectric resonator antenna 761 may be 8 mm. A distance d11 between the first axis
771 and one end of the dielectric resonator antenna 761 and a distance d13 between
the second axis 772 and one end opposite to the one end of the dielectric resonator
antenna 761 may be 2 mm, and a distance d12 between the first axis 771 and the second
axis 772 may be 4 mm. Accordingly, the vertical length d12 of the specified region
770 may be 4 mm. For another example, when the back plate (or the dielectric resonator
antenna 761) is viewed in the first direction, a horizontal length d20 of the one
surface of the dielectric resonator antenna 761 may be 4 mm. A distance d22 between
the third axis 773 and one end of the dielectric resonator antenna 761 may be 1 mm,
and a distance d21 between the third axis 773 and one end opposite to the one end
of the dielectric resonator antenna 761 may be 3 mm. Accordingly, the horizontal length
d21 of the specified region 770 may be 3 mm. The monopole antenna 762 may be disposed
so that one point 761-1 of the bent portion is included in the specified region 770
on the dielectric resonator antenna 761 defined by the foregoing when the back plate
(or the dielectric resonator antenna 761) is viewed in the first direction.
[0080] In FIG. 7, the monopole antenna 762 is illustrated as being disposed on one surface
of the dielectric resonator antenna 761 facing the second direction, but the embodiments
of the disclosure are not limited thereto. For example, the monopole antenna 762 may
be disposed to be spaced apart from the one surface of the dielectric resonator antenna
761 by a specified distance in the second direction. In this case, a dielectric may
be formed in the separation space between the monopole antenna 762 and the dielectric
resonator antenna 761. In other words, the dielectric resonator 761 and the monopole
antenna 762 may be disposed in a form spaced apart by a specified distance by the
dielectric.
[0081] FIG. 8 illustrates a flow of current induced in an antenna module according to various
embodiments.
[0082] Referring to FIG. 8, according to an embodiment, a monopole antenna 862 may be disposed
so that one point 862-1 of a bent portion is included in a specified region (e.g.,
the specified region 770 of FIG. 7) of a dielectric resonator antenna 862 (e.g., the
dielectric resonator antenna 562 of FIG. 5) when the back plate (or the dielectric
resonator antenna 861) is viewed in the first direction. The monopole antenna 861
may be disposed in a form in which it is attached to one surface of the dielectric
resonator antenna 862 facing the second direction (e.g., the -z direction), and disposed
to be spaced apart from the dielectric resonator 862 by a specified distance with
a dielectric interposed therebetween. The monopole antenna 861 and the dielectric
resonator antenna 862 may be disposed on one surface 850-1 of a first printed circuit
board 850. One end of the monopole antenna 862 may be electrically connected to one
point 850-2 of a second region included in the first printed circuit board 850 and
fed with electric power.
[0083] According to an embodiment, at least a portion of one surface 850-1 of the first
printed circuit board 850 may include a planar ground portion, and the dielectric
resonator antenna 862 may be grounded by the ground portion. The one surface 850-1
may be one surface of the second region (e.g., the second region 652 of FIG. 6) of
the first printed circuit board 850 facing the third direction (e.g., the -x direction),
and referred to as one surface facing the outside of the housing when a side member
820 is viewed. The dielectric resonator antenna 861 may be disposed to be spaced apart
from the side member 810 by a specified distance d30.
[0084] According to an embodiment, current may be induced in at least a portion of the monopole
antenna 862 and the first printed circuit board 850 due to the arrangement structure
of the above-described components. The current induced in the monopole antenna 862
may have different intensities for each section. The monopole antenna 862 may be divided
into three sections based on the intensity of the current. For example, in a first
section 820 and a second section 821, the intensity of the current induced in the
monopole antenna 862 may gradually increase. For example, the intensity of current
may gradually increase from one end of the monopole antenna 862 to the one point 850-2
of the first printed circuit board 850, and the intensity of the current measured
at the one point 850-2 may have a maximum value. For another example, in a third section
822, the intensity of the current induced in the first printed circuit board 850 may
gradually decrease. For example, the intensity of the current induced from the one
point 850-2 of the first printed circuit board 850 in the +y direction may gradually
decrease.
[0085] According to various embodiments of the disclosure, an electronic device may include
a housing including a first plate facing a first direction, a second plate facing
a second direction opposite to the first direction, and a side member surrounding
a space between the first plate and the second plate, a support member disposed in
the space between the first plate and the second plate, a first printed circuit board
disposed on a first surface of the support member and including a wireless communication
circuit, a second printed circuit board disposed on the first surface of the support
member and electrically connected to the first printed circuit board, a dielectric
resonator antenna disposed on the first circuit board, and a monopole antenna disposed
on one surface of the dielectric resonator antenna facing the second direction when
the back plate is viewed in the first direction. For example, when the back plate
is viewed in the first direction, one point of a bent portion included in the monopole
antenna may be disposed to be included on a specified region of the one surface of
the dielectric resonator antenna, and the wireless communication circuit may feed
electric power to one end of the monopole antenna.
[0086] According to an embodiment, the dielectric resonator antenna may have a rectangular
parallelepiped shape.
[0087] According to an embodiment, the monopole antenna may correspond to an inverted L
antenna, and the one point may be a point of the bent portion adjacent to the first
printed circuit board.
[0088] According to an embodiment, when the back plate is viewed in the first direction,
the specified region of the dielectric resonator antenna may be a central region on
the one surface of the dielectric resonator.
[0089] According to an embodiment, when the back plate is viewed in the first direction,
the specified region of the dielectric resonator antenna may be a region between a
first axis on the one surface of the dielectric resonator antenna, a second axis substantially
parallel to the first axis, and a third axis substantially orthogonal to the first
axis and the second axis, and at least a portion of the first printed circuit board.
[0090] According to an embodiment, when the back plate is viewed in the first direction,
the first axis and the second axis may correspond to one axis horizontally crossing
the dielectric resonator antenna.
[0091] According to an embodiment, when the back plate is viewed in the first direction,
the first printed circuit board may include a bent region curved at a specified angle,
and a first region and a second region which are divided from each other based on
the bent region.
[0092] According to an embodiment, one point of the first region may be electrically connected
to the side member, and one point of the second region may be electrically connected
to the monopole antenna.
[0093] According to an embodiment, at least a portion of the first region may correspond
to a power feeder for a conductive member included in the side member, and at least
a portion of the second region may correspond to a ground region for the dielectric
resonator antenna.
[0094] According to an embodiment, the dielectric resonator antenna may be disposed on at
least a portion of one surface of the first printed circuit board facing a third direction
in the second region, and the third direction may correspond to one direction substantially
orthogonal to the first direction and the second direction and oriented when the side
member is viewed toward the outside of the housing.
[0095] According to an embodiment, the first region of the first printed circuit board may
include a power feeding circuit for feeding electric power to a conductive member
included in the side member.
[0096] According to an embodiment, the second region of the first printed circuit board
may include a power feeding circuit for feeding electric power to the monopole antenna.
[0097] According to an embodiment, at least a portion of the one surface of the first printed
circuit board may include a planar ground portion.
[0098] According to an embodiment, the dielectric resonator antenna may be grounded by the
planar ground portion.
[0099] According to an embodiment, the conductive member included in the side member may
be grounded by the planar ground portion.
[0100] According to an embodiment, when the back plate is viewed in the first direction,
the dielectric resonator antenna may be disposed on one surface of the first printed
circuit board to be spaced apart from the side member by a specified distance.
[0101] According to an embodiment, a relative permittivity of the dielectric resonator antenna
may be 10 to 50 F/m.
[0102] According to an embodiment, when the back plate is viewed in the first direction,
the dielectric resonator antenna may be disposed on one surface of the first printed
circuit board, and the one surface of the first printed circuit board may be a surface
of the first printed circuit board facing a third direction substantially orthogonal
to the first direction and the second direction and oriented when the side member
is viewed toward the outside of the housing.
[0103] According to an embodiment, the monopole antenna may be disposed to be spaced apart
from the one surface of the dielectric resonator antenna by a specified distance in
the second direction.
[0104] According to an embodiment, a dielectric may be included in a separation space between
the monopole antenna and the dielectric resonator antenna.