(19)

(11)

EP 4 292 321 A1

(12)

(43) Date of publication: 20.12.2023 Bulletin 2023/51 (21) Application number: 22710923.8 (22) Date of filing: 11.02.2022

(51) International Patent Classification (IPC):  H04W 16/14(2009.01) H04L 5/00(2006.01) H04W 72/12(2023.01) H04W 24/02(2009.01) (52) Cooperative Patent Classification (CPC): H04W 16/14; H04W 72/1215; H04L 5/0048; H04L 5/0094; H04W 8/24; H04W 88/06 (86) International application number: PCT/US2022/070624 (87) International publication number: WO 2022/174250 (18.08.2022 Gazette 2022/33)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 11.02.2021 US 202163148592 P 10.02.2022 US 202217650548 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: LEI, Jing San Diego, California 92121-1714 (US) TAKEDA, Kazuki San Diego, California 92121-1714 (US) XU, Huilin San Diego, California 92121-1714 (US) GAAL, Peter San Diego, California 92121-1714 (US) (74) Representative: Tomkins & Co  5 Dartmouth Road Dublin 6, D06 F9C7 Dublin 6, D06 F9C7 (IE)