(19)
(11) EP 4 294 960 A1

(12)

(43) Date of publication:
27.12.2023 Bulletin 2023/52

(21) Application number: 22707950.6

(22) Date of filing: 11.02.2022
(51) International Patent Classification (IPC): 
C23C 16/448(2006.01)
C10L 3/04(2006.01)
C23C 16/26(2006.01)
F17C 11/00(2006.01)
(52) Cooperative Patent Classification (CPC):
C23C 16/26; C23C 16/448; C10L 3/04; F17C 11/002
(86) International application number:
PCT/US2022/016103
(87) International publication number:
WO 2022/177816 (25.08.2022 Gazette 2022/34)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 17.02.2021 US 202163150203 P
09.02.2022 US 202217667861

(71) Applicants:
  • Praxair Technology, Inc.
    Danbury, CT 06810 (US)
  • Samsung Electronics Co., Ltd.
    Gyeonggi-Do, 445-701 (KR)

(72) Inventors:
  • SINHA, Ashwini, K.
    Amherst, NY 14051 (US)
  • SONG, Xuemei
    Amherst, NY 14051 (US)
  • KANE, William, S.
    Tonawanda, NY 14223 (US)
  • CHO, Youn-Joung
    Hwaseong-si, Gyeonggi-do, 18448 (KR)
  • CHUNG, Wonwoong
    Hwaseong-si, Gyeonggi-do, 18448 (KR)
  • HAN, Yeonock
    Hwaseong-si, Gyeonggi-do, 18448 (KR)

(74) Representative: Schwan Schorer & Partner mbB 
Patentanwälte Bauerstraße 22
80796 München
80796 München (DE)

   


(54) ACETYLENE FLUID SUPPLY PACKAGE, SYSTEM COMPRISING THE SAME AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME