(19)

(11)

EP 4 295 408 A1

(12)

(43) Date of publication: 27.12.2023 Bulletin 2023/52 (21) Application number: 22715957.1 (22) Date of filing: 23.03.2022

(51) International Patent Classification (IPC):  H01L 29/06(2006.01) H01L 21/336(2006.01) H01L 29/78(2006.01) (52) Cooperative Patent Classification (CPC): H01L 29/7813; H01L 29/407; H01L 29/0696; H01L 29/66734 (86) International application number: PCT/US2022/071278 (87) International publication number: WO 2022/204691 (29.09.2022 Gazette 2022/39)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 26.03.2021 US 202163166242 P 21.03.2022 US 202217655579 (71) Applicant: Semiconductor Components Industries, LLC Scottsdale, AZ 85250 (US)	(72) Inventors: VENKATRAMAN, Prasad Gilbert, Arizona 85295 (US) BURKE, Peter A. Portland, Oregon 97212 (US) LOECHELT, Gary Horst Tempe, Arizona 85281 (US) PADMANABHAN, Balaji Chandler, Arizona 85249 (US) LINEHAN, Emily M. Gilbert, Arizona 85233 (US) (74) Representative: Manitz Finsterwald Patent- und Rechtsanwaltspartnerschaft mbB  Martin-Greif-Strasse 1 80336 München 80336 München (DE)