TECHNICAL FIELD
[0002] This application relates to audio processing technologies, and in particular, to
a true wireless stereo (true wireless stereo, TWS) earphone, and a play method and
apparatus of a TWS earphone.
BACKGROUND
[0003] In a scenario in which a user uses earphones, a common requirement is to implement
a stable function of active noise cancellation (active noise cancellation or active
noise control, ANC) or hear through (hear through, HT) while providing high-quality
music or wideband high-definition calls.
[0004] Although various current TWS earphones can implement the ANC function, the TWS earphones
can also cancel some music or call sound, affecting sound quality and call definition.
SUMMARY
[0005] This application provides a TWS earphone, and a play method and apparatus of a TWS
earphone, which provide a high-quality audio source in various frequency bands, and
can also support ultra-wideband audio calls.
[0006] According to a first aspect, this application provides a TWS earphone, including
an audio signal processing path, a frequency divider, and at least two speakers. An
output end of the audio signal processing path is connected to an input end of the
frequency divider, and an output end of the frequency divider is connected to the
at least two speakers. The audio signal processing path is configured to output a
speaker drive signal after noise cancellation or hear through processing is performed
on an audio source. The audio source is original music or call voice, or the audio
source includes a voice signal obtained through voice enhancement processing and the
original music or call voice. The frequency divider is configured to divide the speaker
drive signal into sub-audio signals of at least two frequency bands. The at least
two frequency bands correspond to main operating frequency bands of the at least two
speakers. Adjacent frequency bands in the at least two frequency bands partially overlap,
or adjacent frequency bands in the at least two frequency bands do not overlap. The
at least two speakers are configured to play the corresponding sub-audio signals.
[0007] A frequency band of the processed speaker drive signal corresponds to a frequency
band of the audio source, and may include low, middle, and high frequency bands. However,
because a main operating frequency band of a single speaker may cover only some of
the low, middle, and high frequency bands, the single speaker cannot provide high
sound quality in all the frequency bands.
[0008] In this application, a parameter of the frequency divider is set to control the frequency
divider to perform frequency division on the speaker drive signal in a preset manner.
The frequency divider may be configured to perform frequency division on the speaker
drive signal based on the main operating frequency bands of the at least two speakers
to obtain the sub-audio signals of the at least two frequency bands respectively corresponding
to the main operating frequency bands of the at least two speakers. Then, each speaker
plays a sub-audio signal in a corresponding frequency band, so that the speaker maintains
an optimal frequency response when playing the sub-audio signal transmitted to the
speaker. A parameter of the frequency divider is set to control the frequency divider
to perform frequency division on the speaker drive signal in a preset manner.
[0009] At least two speakers are disposed in the TWS earphone of this application, and main
operating frequency bands of the at least two speakers are not exactly same. The frequency
divider may divide the speaker drive signal into sub-audio signals of at least two
frequency bands. Adjacent frequency bands in the at least two frequency bands partially
overlap or do not overlap. In this case, each sub-audio signal is transmitted to a
speaker with a matching frequency band. The matching frequency band may mean that
a main operating frequency band of the speaker covers a frequency band of the sub-audio
signal transmitted to the speaker. In this way, the speaker maintains an optimal frequency
response when playing the sub-audio signal transmitted to the speaker, which can provide
a high-quality audio source in various frequency bands, and can also support ultra-wideband
audio calls.
[0010] In a possible implementation, the audio signal processing path includes: a secondary
path SP filter, configured to prevent cancellation of sound of the audio source by
the noise cancellation or hear through processing when the noise cancellation or hear
through processing and the audio source are concurrent.
[0011] In a possible implementation, the audio signal processing path further includes a
feedback FB microphone and a feedback filter. The FB microphone is configured to pick
up an ear canal signal. The ear canal signal includes a residual noise signal inside
an ear canal and the music or call voice. The SP filter is configured to input the
audio source, process the audio source, and transmit, to the feedback filter, a signal
obtained by superimposing an output signal on the ear canal signal. The feedback filter
is configured to generate a signal for the noise cancellation or hear through processing.
The signal for the noise cancellation or hear through processing is one superimposed
signal of the generated speaker drive signal.
[0012] In a possible implementation, the feedback FB microphone, the feedback filter, and
the SP filter are disposed in a coder-decoder CODEC.
[0013] In a possible implementation, the SP filter is configured to input the audio source
and process the audio source. An output signal is one superimposed signal of the speaker
drive signal.
[0014] In a possible implementation, the SP filter is disposed in a digital signal processing
DSP chip.
[0015] In this application, the SP filter (including a fixed SP filter or an adaptive SP
filter) is determined by using the foregoing method, so that during music playing
or calls, not only a noise cancellation or hear through function can be implemented,
but also music or call voice can be prevented from being canceled by using a hear
through or noise cancellation technology.
[0016] In a possible implementation, the TWS earphone further includes a first digital-to-analog
converter DAC. An input end of the first DAC is connected to the output end of the
audio signal processing path, and an output end of the first DAC is connected to the
input end of the frequency divider. The first DAC is configured to convert the speaker
drive signal from a digital format to an analog format. Correspondingly, the frequency
divider is an analog frequency divider.
[0017] After the speaker drive signal is obtained, if the signal is in a digital format
before transmitted to the DAC, but a signal to be played by the speaker needs to be
in an analog format, the speaker drive signal in the digital format may be first converted
into a speaker drive signal in the analog format by the first DAC, and then the speaker
drive signal in the analog format is divided into sub-audio signals of at least two
frequency bands by the analog frequency divider.
[0018] In this embodiment, a structure of conversion before frequency division is used.
[0019] In a possible implementation, the TWS earphone further includes at least two second
DACs. Input ends of the at least two second DACs are all connected to the output end
of the frequency divider, and output ends of the at least two second DACs are respectively
connected to the at least two speakers. Each second DAC is configured to convert one
of the sub-audio signals of the at least two frequency bands from a digital format
to an analog format. Correspondingly, the frequency divider is a digital frequency
divider.
[0020] In this embodiment, a structure of frequency division before conversion is used.
[0021] In a possible implementation, the main operating frequency bands of the at least
two speakers are not exactly same.
[0022] In a possible implementation, the at least two speakers include a moving-coil speaker
and a moving-iron speaker.
[0023] The TWS earphone in this embodiment is provided with two speakers: a moving-coil
speaker and a moving-iron speaker. A main operating frequency band of the moving-coil
speaker is less than 8.5 kHz, and a main operating frequency band of the moving-iron
speaker is more than 8.5 kHz. In this case, a frequency divider may be provided to
divide a speaker drive signal in an analog format into a sub-audio signal of less
than 8.5 kHz and a sub-audio signal of more than 8.5 kHz. The moving-coil speaker
plays the sub-audio signal of less than 8.5 kHz to maintain an optimal frequency response,
and the moving-iron speaker plays the sub-audio signal of more than 8.5 kHz to maintain
an optimal frequency response. Therefore, the TWS earphone can provide a high-quality
audio source in various frequency bands, and can also support ultra-wideband audio
calls.
[0024] In a possible implementation, the at least two speakers include a moving-coil speaker,
a moving-iron speaker, a micro-electro-mechanical system MEMS speaker, and a planar
vibrating diaphragm.
[0025] The TWS earphone in this embodiment is provided with four speakers: a moving-coil
speaker, a moving-iron speaker, a MEMS speaker, and a planar vibrating diaphragm.
A main operating frequency band of the moving-coil speaker is less than 8.5 kHz, and
a main operating frequency band of the moving-iron speaker is more than 8.5 kHz. Amain
operating frequency band of the MEMS speaker depends on an application form. The main
operating frequency band for an in-ear headphone is a full frequency band. The main
operating frequency band for an over-ear headphone is less than 7 kHz, which is weak,
and thus a main action frequency band is high frequency of more than 7 kHz. A main
operating frequency band of the planar vibrating diaphragm is 10 kHz to 20 kHz. In
this case, a frequency divider may be provided to divide a speaker drive signal in
an analog format into four sub-frequency bands. The moving-coil speaker plays a sub-audio
signal of less than 8.5 kHz to maintain an optimal frequency response, the moving-iron
speaker plays a sub-audio signal of more than 8.5 kHz to maintain an optimal frequency
response, the MEMS speaker plays a sub-audio signal of more than 7 kHz to maintain
an optimal frequency response, and the planar vibrating diaphragm plays a sub-audio
signal of more than 10 kHz to maintain an optimal frequency response. Therefore, the
TWS earphone can provide a high-quality audio source in various frequency bands, and
can also support ultra-wideband audio calls.
[0026] According to a second aspect, this application provides a play method of a TWS earphone.
The method is applied to the TWS earphone according to the first aspect. The method
includes: obtaining an audio source, where the audio source is original music or call
voice, or the audio source includes a voice signal obtained through voice enhancement
processing and the original music or call voice; performing noise cancellation or
hear through processing on the audio source to obtain a speaker drive signal; dividing
the speaker drive signal into sub-audio signals of at least two frequency bands, where
adjacent frequency bands in the at least two frequency bands partially overlap, or
adjacent frequency bands in the at least two frequency bands do not overlap; and playing
the sub-audio signals of the at least two frequency bands respectively through at
least two speakers.
[0027] In a possible implementation, the performing noise cancellation or hear through processing
on the audio source to obtain a speaker drive signal includes: obtaining a fixed secondary
path SP filter by using a coder-decoder CODEC; processing the audio source by using
the fixed SP filter to obtain a filtered signal; and performing the noise cancellation
or hear through processing on the filtered signal to obtain the speaker drive signal.
[0028] In a possible implementation, the obtaining a fixed secondary path SP filter by using
a coder-decoder CODEC includes: obtaining an estimated SP filter based on a preset
speaker drive signal and an ear canal signal picked up by a feedback FB microphone,
where the ear canal signal includes a residual noise signal inside an ear canal; and
determining the estimated SP filter as the fixed SP filter when a difference signal
between a signal obtained through the estimated SP filter and the ear canal signal
is within a specified range.
[0029] In a possible implementation, after the obtaining an estimated SP filter based on
a preset speaker drive signal and an ear canal signal picked up by a feedback FB microphone,
the method further includes: obtaining a parameter of a cascaded second-order filter
based on a target frequency response of the estimated SP filter and a preset frequency
division requirement when the difference signal between the signal obtained through
the estimated SP filter and the ear canal signal is within the specified range; and
obtaining an SP cascaded second-order filter based on the parameter of the cascaded
second-order filter, and using the SP cascaded second-order filter as the fixed SP
filter.
[0030] In a possible implementation, the performing noise cancellation or hear through processing
on the audio source to obtain a speaker drive signal includes: obtaining an adaptive
SP filter by using a digital signal processing DSP chip; processing the audio source
by using the adaptive SP filter to obtain a filtered signal; and performing the noise
cancellation or hear through processing on the filtered signal to obtain the speaker
drive signal.
[0031] In a possible implementation, the obtaining an adaptive SP filter by using a digital
signal processing DSP chip includes: obtaining a real-time noise signal; obtaining
an estimated SP filter based on the audio source and the real-time noise signal; and
determining the estimated SP filter as the adaptive SP filter when a difference signal
between a signal obtained through the estimated SP filter and the real-time noise
signal is within a specified range.
[0032] In a possible implementation, the obtaining a real-time noise signal includes: obtaining
an external signal picked up by a feedforward FF microphone and an ear canal signal
picked up by a feedback FB microphone, where the external signal includes an external
noise signal and the music or call voice, and the ear canal signal includes a residual
noise signal inside an ear canal and the music or call voice; obtaining a voice signal
picked up by a main microphone; and subtracting the external signal and the ear canal
signal from the voice signal to obtain the real-time noise signal.
[0033] In a possible implementation, main operating frequency bands of the at least two
speakers are not exactly same.
[0034] In a possible implementation, the at least two speakers include a moving-coil speaker
and a moving-iron speaker.
[0035] In a possible implementation, the at least two speakers include a moving-coil speaker,
a moving-iron speaker, a micro-electro-mechanical system MEMS speaker, and a planar
vibrating diaphragm.
[0036] According to a third aspect, this application provides a play apparatus of a TWS
earphone. The apparatus is used in the TWS earphone in the first aspect. The apparatus
includes: an obtaining module, configured to obtain an audio source, where the audio
source is original music or call voice, or the audio source includes a voice signal
obtained through voice enhancement processing and the original music or call voice;
a processing module, configured to perform noise cancellation or hear through processing
on the audio source to obtain a speaker drive signal; a frequency division module,
configured to divide the speaker drive signal into sub-audio signals of at least two
frequency bands, where adjacent frequency bands in the at least two frequency bands
partially overlap, or adjacent frequency bands in the at least two frequency bands
do not overlap; and a play module, configured to play the sub-audio signals of the
at least two frequency bands respectively through at least two speakers.
[0037] In a possible implementation, the processing module is specifically configured to:
obtain a fixed secondary path SP filter by using a coder-decoder CODEC; process the
audio source by using the fixed SP filter to obtain a filtered signal; and perform
the noise cancellation or hear through processing on the filtered signal to obtain
the speaker drive signal.
[0038] In a possible implementation, the processing module is specifically configured to:
obtain an estimated SP filter based on a preset speaker drive signal and an ear canal
signal picked up by a feedback FB microphone, where the ear canal signal includes
a residual noise signal inside an ear canal and the music or call voice; and determine
the estimated SP filter as the fixed SP filter when a difference signal between a
signal obtained through the estimated SP filter and the ear canal signal is within
a specified range.
[0039] In a possible implementation, the processing module is further configured to: obtain
a parameter of a cascaded second-order filter based on a target frequency response
of the estimated SP filter and a preset frequency division requirement when the difference
signal between the signal obtained through the estimated SP filter and the ear canal
signal is within the specified range; and obtain an SP cascaded second-order filter
based on the parameter of the cascaded second-order filter, and use the SP cascaded
second-order filter as the fixed SP filter.
[0040] In a possible implementation, the processing module is specifically configured to:
obtain an adaptive SP filter by using a digital signal processing DSP chip; process
the audio source by using the adaptive SP filter to obtain a filtered signal; and
perform the noise cancellation or hear through processing on the filtered signal to
obtain the speaker drive signal.
[0041] In a possible implementation, the processing module is specifically configured to:
obtain a real-time noise signal; obtain an estimated SP filter based on the audio
source and the real-time noise signal; and determine the estimated SP filter as the
adaptive SP filter when a difference signal between a signal obtained through the
estimated SP filter and the real-time noise signal is within a specified range.
[0042] In a possible implementation, the processing module is specifically configured to:
obtain an external signal picked up by a feedforward FF microphone and an ear canal
signal picked up by a feedback FB microphone, where the external signal includes an
external noise signal and the music or call voice, and the ear canal signal includes
a residual noise signal inside an ear canal and the music or call voice; obtain a
voice signal picked up by a main microphone; subtract the external signal and the
ear canal signal from the voice signal to obtain a signal difference; and obtain the
estimated SP filter based on the audio source and the signal difference.
[0043] In a possible implementation, main operating frequency bands of the at least two
speakers are not exactly same.
[0044] In a possible implementation, the at least two speakers include a moving-coil speaker
and a moving-iron speaker.
[0045] In a possible implementation, the at least two speakers include a moving-coil speaker,
a moving-iron speaker, a micro-electro-mechanical system MEMS speaker, and a planar
vibrating diaphragm.
[0046] According to a fourth aspect, this application provides a computer-readable storage
medium, including a computer program. When the computer program is executed by a computer,
the computer is enabled to perform the method according to the second aspect.
[0047] According to a fifth aspect, this application provides a computer program. When the
computer program is executed by a computer, the method according to the second aspect
is performed.
BRIEF DESCRIPTION OF DRAWINGS
[0048]
FIG. 1 is a schematic diagram of an example structure of a TWS earphone in the related
technology;
FIG. 2a is a schematic diagram of an example structure of a TWS earphone in the related
technology;
FIG. 2b is a schematic diagram of an example structure of a TWS earphone in the related
technology;
FIG. 3 is a schematic diagram of an example structure of a TWS earphone according
to this application;
FIG. 4 is a schematic diagram of an example structure of a TWS earphone according
to this application;
FIG. 5a is an example flowchart of obtaining a fixed SP filter according to this application;
FIG. 5b is an example flowchart of obtaining a fixed SP filter according to this application;
FIG. 6 is a schematic diagram of an example structure of a TWS earphone according
to this application;
FIG. 7a is a schematic diagram of an example of signal frequency division according
to this application;
FIG. 7b is a schematic diagram of an example of signal frequency division according
to this application;
FIG. 7c is a schematic diagram of an example of signal frequency division according
to this application;
FIG. 7d is a schematic diagram of an example of signal frequency division according
to this application;
FIG. 8a is a schematic diagram of an example structure of a TWS earphone according
to this application;
FIG. 8b is a schematic diagram of an example structure of a TWS earphone according
to this application;
FIG. 8c is a schematic diagram of an example structure of a TWS earphone according
to this application;
FIG. 8d is a schematic diagram of an example structure of a TWS earphone according
to this application;
FIG. 8e is a schematic diagram of an example structure of a TWS earphone according
to this application;
FIG. 9a is a schematic diagram of an example structure of a TWS earphone according
to this application;
FIG. 9b is a schematic diagram of an example structure of a TWS earphone according
to this application;
FIG. 9c is a schematic diagram of an example structure of a TWS earphone according
to this application;
FIG. 9d is a schematic diagram of an example structure of a TWS earphone according
to this application;
FIG. 9e is a schematic diagram of an example structure of a TWS earphone according
to this application;
FIG. 10 is an example flowchart of a play method of a TWS earphone according to this
application; and
FIG. 11 is a diagram of an example structure of a play apparatus of a TWS earphone
according to this application.
DESCRIPTION OF EMBODIMENTS
[0049] To make the objectives, technical solutions, and advantages of this application clearer,
the following clearly and completely describes the technical solutions of this application
with reference to the accompanying drawings in this application. It is clear that
the described embodiments are merely a part rather than all of embodiments of this
application. All other embodiments obtained by a person of ordinary skill in the art
based on embodiments of this application without creative efforts shall fall within
the protection scope of this application.
[0050] In this specification, embodiments, claims, and accompanying drawings of this application,
terms "first", "second", and the like are merely intended for distinguishing and description,
and shall not be understood as an indication or implication of relative importance
or an indication or implication of an order. In addition, the terms "include", "have",
and any variant thereof are intended to cover non-exclusive inclusion, for example,
include a series of steps or units. Methods, systems, products, or devices are not
necessarily limited to those steps or units that are literally listed, but may include
other steps or units that are not literally listed or that are inherent to such processes,
methods, products, or devices.
[0051] It should be understood that in this application, "at least one (item)" refers to
one or more, and "a plurality of" refers to two or more. The term "and/or" is used
for describing an association relationship between associated objects, and indicates
that three relationships may exist. For example, "A and/or B" may indicate the following
three cases: Only A exists, only B exists, and both A and B exist, where A and B may
be singular or plural. The character "/" usually indicates an "or" relationship between
associated objects. "At least one of the following" or a similar expression thereof
indicates any combination of the following, including any combination of one or more
of the following. For example, at least one of a, b, or c may indicate a, b, c, a
and b, a and c, b and c, or a, b, and c, where a, b, and c may be singular or plural.
[0052] FIG. 1 is a schematic diagram of an example structure of a TWS earphone in the related
technology. As shown in FIG. 1, the TWS earphone includes three types of microphones:
a main microphone, a feedforward (feedforward, FF) microphone, and a feedback (feedback,
FB) microphone. The main microphone is configured to pick up a voice in a call. The
FF microphone is configured to pick up an external noise signal. The FB microphone
is configured to pick up a residual noise signal inside an ear canal. The TWS earphone
further includes a moving-coil speaker. The moving-coil speaker is configured to play
processed music or call voice.
[0053] Based on the structure shown in FIG. 1, FIG. 2a is a schematic diagram of an example
structure of a TWS earphone in the related technology. As shown in FIG. 2a, the main
microphone and the FF microphone are respectively connected to an input end of a voice
enhancement filter, and an output end of the voice enhancement filter and an audio
source (including music and call voice) are superimposed by a superimposer 1 to obtain
a downlink signal. The downlink signal is transmitted to an input end of a superimposer
2. The downlink signal is further transmitted to an input end of a secondary path
(secondary path, SP) filter. The FF microphone is further connected to an input end
of a feedforward filter, and an output end of the feedforward filter is connected
to another input end of the superimposer 2. The FB microphone is connected to an input
end of a superimposer 3, an output end of the SP filter is connected to another input
end of the superimposer 3, an output end of the superimposer 3 is connected to an
input end of a feedback filter, and an output end of the feedback filter is connected
to a third input end of the superimposer 2. An output end of the superimposer 2 is
connected to an input end of a digital-to-analog converter (digital to analog converter,
DAC), and an output end of the DAC is connected to the moving-coil speaker.
[0054] An active noise cancellation & hear through & augmented hearing (ANC&HT&AH, AHA)
joint controller is connected to the voice enhancement filter, the feedforward filter,
the feedback filter, and the SP filter respectively. Function of AHA joint controller:
In order to ensure normal and stable operation of the TWS earphone, some abnormal
cases need to be handled by using the TWS earphone, so an AHAjoint controller is required.
The AHAjoint controller analyzes a plurality of signals, determines a current state
of ANC, HT, or augmented hearing (augmented hearing, AH), then determines whether
an abnormal case such as squealing or clipping occurs, and therefore implements corresponding
processing, and implements system control by controlling parameter values of the foregoing
filters.
[0055] In the foregoing structure, the voice enhancement filter, the audio source, and the
AHA joint controller are disposed in a digital signal processing (digital signal processing,
DSP) chip, and the feedforward filter, the feedback filter, the SP filter, and the
DAC are disposed in a coder-decoder (coder-decoder, CODEC).
[0056] Based on the structure shown in FIG. 1, FIG. 2b is a schematic diagram of an example
structure of a TWS earphone in the related technology. As shown in FIG. 2b, a difference
from the structure shown in FIG. 2a lies in that the voice enhancement filter is moved
from the DSP chip to the CODEC.
[0057] Based on the structures shown in FIG. 1 to FIG. 2b, the TWS earphone may implement
the following functions:
[0058] Active noise cancellation: The FF microphone picks up an external noise signal, and the feedforward filter generates
a feedforward noise cancellation signal. The FB microphone picks up a residual noise
signal inside an ear canal, and the feedback filter generates a feedback noise cancellation
signal. The feedforward noise cancellation signal, the feedback noise cancellation
signal, and the downlink signal are superimposed to form a final speaker drive signal.
The DAC performs digital-to-analog conversion to generate an analog speaker drive
signal. When the analog speaker drive signal is played in a reverse manner by the
moving-coil speaker, the analog speaker drive signal is canceled out with an audio
signal in space, to obtain an analog audio signal with noise canceled out. In this
way, low-frequency noise within a specific frequency band range can be canceled, thereby
implementing noise cancellation.
[0059] Hear through: The FF microphone picks up an external noise signal, and the feedforward filter generates
a feedforward compensation signal. The FB microphone picks up a sound signal inside
an ear canal, and the feedback filter generates a feedback suppression signal. The
feedforward compensation signal, the feedback suppression signal, and the downlink
signal are superimposed to form a final speaker drive signal. The DAC performs digital-to-analog
conversion to generate an analog speaker drive signal. The analog speaker drive signal
is played by the moving-coil speaker, which can reduce or suppress low-frequency noise,
and compensate a high-frequency signal, so that an analog audio signal with acoustic
compensation implemented can be obtained. In this way, a "block" effect of active
phonating and listening (which means that a wearer hears his/her own voice) or a "stethoscope"
effect of vibration sound from a body part (for example, sound of walking, chewing,
or scratching with an earphone worn) is reduced or suppressed, and high-frequency
sound of passive listening (for example, sound or music in an environment) within
a specific frequency band range is compensated, thereby implementing hear through.
[0060] It should be noted that, in the foregoing step of obtaining the final speaker drive
signal through superimposition, a signal obtained through superimposition may include
the feedforward compensation signal, the feedback suppression signal, and the downlink
signal, or may include one or two of the feedforward compensation signal, the feedback
suppression signal, and the downlink signal. For example, when noise cancellation
processing is performed while a user is listening to music, the signal obtained through
superimposition may include the foregoing three signals. When a user only wants to
perform noise cancellation by an earphone to make a quiet environment, the signal
obtained through superimposition may include the feed compensation signal and the
feedback suppression signal, but does not include the downlink signal.
[0061] Concurrence of voice enhancement and music/call: When a voice enhancement function is implemented on a DSP side, signals from the
FF microphone and the main microphone are transmitted to the voice enhancement filter
for processing, to obtain a signal with ambient noise suppressed and voice reserved.
Then, the signal is downlinked to the CODEC, and is superimposed with signals output
by the feedforward filter and the feedback filter to obtain a speaker drive signal.
After digital-to-analog conversion by the DAC, an analog speaker drive signal is output
to be played by the moving-coil speaker. Sound played by the moving-coil speaker will
be picked up by the FB microphone. To prevent the played sound from being discarded
by the feedback filter through noise cancellation processing, an estimated signal
played by the moving-coil speaker may be subtracted from a signal picked up by the
FB microphone, so that the signal is not discarded by the feedback filter through
noise cancellation processing, thereby implementing concurrence of voice enhancement
and music/call, and further implementing an ANC/HT function on this basis.
[0062] In FIG. 2a, voice enhancement implemented in the DSP ensures computing overheads,
and has a stable noise cancellation effect and a stable playing effect after processing,
but a long delay, which sounds reverberant. In FIG. 2b, voice enhancement implemented
in the CODEC has a relatively fixed and simple algorithm, a short delay, a low reverberant
sense, but a limited noise cancellation effect.
[0063] With the structures of the TWS earphones shown in FIG. 1 to FIG. 2b, for high-frequency
music, especially a music signal in a frequency band of more than 8.5 kHz, played
sound quality may be severely damaged, affecting a playing effect of the music; and
high-frequency voice, especially a voice signal in a frequency band of more than 8.5
kHz, is not supported, limiting bandwidth of the voice call.
[0064] This application provides a speaker structure of a TWS earphone, to resolve the foregoing
technical problem.
[0065] FIG. 3 is a schematic diagram of an example structure of a TWS earphone according
to this application. As shown in FIG. 3, the TWS earphone 30 includes three types
of microphones: a main microphone 31, an FF microphone 32, and an FB microphone 33.
The main microphone 31 is configured to pick up a voice in a call. The FF microphone
32 is configured to pick up an external noise signal. The FB microphone 33 is configured
to pick up a residual noise signal inside an ear canal.
[0066] The TWS earphone 30 further includes a moving-coil speaker 34a and a moving-iron
speaker 34b. Amain operating frequency band of the moving-coil speaker 34a is less
than 8.5 kHz, and a main operating frequency band of the moving-iron speaker 34b is
more than 8.5 kHz. It should be noted that a quantity of speakers is not specifically
limited in this application, provided that there are at least two speakers. The at
least two speakers may have different main operating frequency bands, or some speakers
may have a same main operating frequency band and the other speakers may have different
main operating frequency bands from the main operating frequency bands of the foregoing
some speakers. For example, there are three speakers (1 to 3), a main operating frequency
band of the speaker 1 is the same as a main operating frequency band of the speaker
2, and a main operating frequency band of the speaker 3 is different from the main
operating frequency bands of the speaker 1 and the speaker 2. In another example,
there are three speakers (1 to 3), and the speaker 1, the speaker 2, and the speaker
3 have different main operating frequency bands. Optionally, the at least two speakers
may include a moving-coil speaker, a moving-iron speaker, a micro-electro-mechanical
system (micro-electro-mechanical system, MEMS) MEMS speaker, and a planar vibrating
diaphragm. A main operating frequency band of the moving-coil speaker is less than
8.5 kHz, and a main operating frequency band of the moving-iron speaker is more than
8.5 kHz. Amain operating frequency band of the MEMS speaker depends on an application
form. The main operating frequency band for an in-ear headphone is a full frequency
band. The main operating frequency band for an over-ear headphone is less than 7 kHz,
which is weak, and thus a main action frequency band is high frequency of more than
7 kHz. A main operating frequency band of the planar vibrating diaphragm is 10 kHz
to 20 kHz.
[0067] Based on the TWS earphone shown in FIG. 3, FIG. 4 is a schematic diagram of an example
structure of a TWS earphone according to this application. As shown in FIG. 4, the
TWS earphone 40 includes: an audio signal processing path 41, a frequency divider
42, and at least two speakers 43. An output end of the audio signal processing path
41 is connected to an input end of the frequency divider 42, and an output end of
the frequency divider 42 is connected to the at least two speakers 43.
[0068] The audio signal processing path 41 is configured to output a speaker drive signal
after noise cancellation or hear through processing is performed on an audio source.
The audio source is original music or call voice, or the audio source includes a voice
signal obtained through voice enhancement processing and the original music or call
voice.
[0069] The frequency divider 42 is configured to divide the speaker drive signal into sub-audio
signals of at least two frequency bands. The at least two frequency bands correspond
to main operating frequency bands of the at least two speakers 43. Adjacent frequency
bands in the at least two frequency bands partially overlap, or adjacent frequency
bands in the at least two frequency bands do not overlap. The at least two speakers
43 are configured to play the corresponding sub-audio signals.
[0070] A frequency band of the processed speaker drive signal corresponds to a frequency
band of the audio source, and may include low, middle, and high frequency bands. However,
because a main operating frequency band of a single speaker may cover only some of
the low, middle, and high frequency bands, the single speaker cannot provide high
sound quality in all the frequency bands.
[0071] The frequency divider 42 of this application may be configured to perform frequency
division on the speaker drive signal based on the main operating frequency bands of
the at least two speakers to obtain the sub-audio signals of the at least two frequency
bands respectively corresponding to the main operating frequency bands of the at least
two speakers. Then, each speaker plays a sub-audio signal in a corresponding frequency
band, so that the speaker maintains an optimal frequency response when playing the
sub-audio signal transmitted to the speaker. A parameter of the frequency divider
42 may be set to control the frequency divider 42 to perform frequency division on
the speaker drive signal in a preset manner.
[0072] In a possible implementation, the audio signal processing path 41 may be provided
with the structure shown in FIG. 2a or FIG. 2b. In this case, the SP filter is disposed
in the coder-decoder (coder-decoder, CODEC), and a fixed SP filter is obtained by
using the CODEC.
[0073] The CODEC may obtain an estimated SP filter based on a preset speaker drive signal
and an ear canal signal picked up by the FB microphone, where the ear canal signal
includes a residual noise signal inside an ear canal; and determine the estimated
SP filter as the fixed SP filter when a difference signal between a signal obtained
through the estimated SP filter and the ear canal signal is within a specified range.
[0074] FIG. 5a is an example flowchart of obtaining a fixed SP filter according to this
application. As shown in FIG. 5a, a speaker drive signal x[n] is preset, and is transmitted
to at least two speakers after passing through a frequency divider, to emit sound.
The sound is transmitted to an FB microphone, and is picked up by the FB microphone.
The sound is converted into a digital signal y[n].
[0075] Usually, a transfer function of an SP filter may be assumed to be a high-order FIR
filter. Iterative modeling may be performed by using the least mean square (LMS) algorithm.
A transfer function S(z) of a real SP filter is unknown, but all information of the
transfer function S(z) is included in the speaker drive signal x[n] and the digital
signal y[n] picked up by the FB microphone. Therefore, a high-order FIR filter SÌ‚(z)
may be used as an estimated SP filter to simulate S(z). x[n] is inputted to SÌ‚(z)
to obtain ŷ[n], and a difference is obtained between y[n] and ŷ[n] to obtain an
error signal e[n]. When e[n] is within a specified range, it is considered that the
algorithm converges to a satisfactory state, and in this case, the high-order FIR
filter SÌ‚(z) is approximately equal to the real S(z), so that the high-order FIR filter
SÌ‚(z) may be determined as a transfer function of a fixed SP filter. In the foregoing
process, iterative modeling may be performed by using the least mean square (least
mean square, LMS) algorithm.
[0076] Further, in addition to obtaining a fixed SP filter through simulation by using a
finite impulse response (finite impulse response, FIR) filter, a fixed SP filter may
also be obtained through simulation by using an infinite impulse response (infinite
impulse response, IIR) filter on a CODEC side. FIG. 5b is an example flowchart of
obtaining a fixed SP filter according to this application. As shown in FIG. 5b, a
parameter of a cascaded second-order filter is obtained based on a target frequency
response of the estimated SP filter and a preset frequency division requirement when
the difference signal between the signal obtained through the estimated SP filter
and the ear canal signal is within the specified range; and an SP cascaded second-order
filter is obtained based on the parameter of the cascaded second-order filter, and
the SP cascaded second-order filter is used as the fixed SP filter.
- (1) The CODEC calculates a target frequency response based on the obtained FIR filter
SÌ‚(z).
s = [s0 s1 ··· sN-1]. N represents a filter order, and k represents a frequency number. The corresponding target response is calculated by
using the formula (1):

- (2) Frequency division is performed on the target frequency response, and different
weight coefficients ω[k] are set in different frequency bands.
- (3) Conversion is performed from the FIR filter to an IIR filter to obtain a parameter
of the IIR filter. The conversion requires target responses of the FIR filter and
the IIR filter to be consistent as much as possible.
[0077] From a mathematical perspective, an objective function of the formula (2) is required
to be optimized, to obtain coefficients of a plurality of IIR filters:

[0078] B[
k] and
A[
k] are respectively complex frequency responses of the coefficients
b and
a of the IIR filters, and are calculated by using a method same as the formula (1).
(4) IIR filter implementation
[0079] A group of IIR filter parameters under least mean square can be obtained by using
an optimization algorithm. An IIR filter obtained based on the group of IIR filter
parameters can be used as a final fixed SP filter and implemented in the CODEC for
hardwareization.
[0080] In a possible implementation, the audio signal processing path 41 may be provided
with a structure shown in FIG. 6. In this case, the SP filter is disposed in the digital
signal processing (digital signal processing, DSP) chip, and an adaptive SP filter
is obtained by using the DSP chip.
[0081] The DSP chip may obtain a real-time noise signal, obtain an estimated SP filter based
on an audio source (where the audio source is original music or call voice; or the
audio source includes a voice signal obtained through voice enhancement processing
and the original music or call voice) and the real-time noise signal, and determine
the estimated SP filter as the adaptive SP filter when a difference signal between
a signal obtained through the estimated SP filter and the real-time noise signal is
within a specified range.
[0082] The obtaining a real-time noise signal may be obtaining an external signal (where
the external signal includes an external noise signal and the music or call voice)
picked up by the FF microphone and an ear canal signal (where the ear canal signal
includes a residual noise signal inside an ear canal and the music or call voice)
picked up by the FB microphone, obtaining a voice signal picked up by the main microphone,
and subtracting the external signal and the ear canal signal from the voice signal
to obtain the real-time noise signal.
[0083] A difference between this embodiment and the foregoing embodiment of obtaining the
fixed SP filter lies in that: x[n] represents an audio source, and y[n] represents
a real-time noise signal, that is,
x[
n] =
dnlink[
n],
y[
n] =
fb[
n] -
ff[
n] *
A(
z) -
fb[
n - 1] *
C(
z)
, where
fb[
n] represents a voice signal picked up by the main microphone,
ff[
n] *
A(
z) represents an external signal picked up by the FF microphone, and
fb[
n - 1] *
C(
z) represents an ear canal signal picked up by the FB microphone. In this embodiment,
a high-order FIR filter SÌ‚(z) corresponding to a minimum error signal e[n] may also
be obtained by using the process shown in FIG. 5a. Because the audio source is real-time,
a noise cancellation or hear through function of the TWS earphone is concurrent with
the music or call voice. In this case, a signal picked up by the FB microphone cannot
be directly used for estimation of the SP filter, and modeling analysis needs to be
performed after an impact of another signal is removed, that is, the real-time noise
signal needs to be obtained. Therefore, the SP filter obtained in this way may be
adaptive to real-time conditions of the audio source and the noise signal instead
of being fixed.
[0084] In this application, the SP filter (including a fixed SP filter or an adaptive SP
filter) is determined by using the foregoing method, so that during music playing
or calls, not only a noise cancellation or hear through function can be implemented,
but also music or call voice can be prevented from being canceled by using a hear
through or noise cancellation technology.
[0085] For example, it is assumed that the TWS earphone includes two speakers: a moving-coil
speaker and a moving-iron speaker. A dashed line represents a frequency response curve
of the moving-coil speaker. A single-point line represents a frequency response curve
of the moving-iron speaker. A solid line represents a frequency division line.
[0086] FIG. 7a is a schematic diagram of an example of signal frequency division according
to this application. As shown in FIG. 7a, the frequency divider 42 is configured to
attenuate a non-main operating frequency band of the moving-coil speaker, reserve
power of the moving-coil speaker in a main operating frequency band, attenuate a non-main
operating frequency band of the moving-iron speaker, reserve power of the moving-iron
speaker in a main operating frequency band, and perform frequency division at a cross
frequency in respective attenuated frequency bands of the moving-coil speaker and
the moving-iron speaker, to obtain sub-audio signals in two frequency bands.
[0087] FIG. 7b is a schematic diagram of an example of signal frequency division according
to this application. As shown in FIG. 7b, the frequency divider 42 is configured to
attenuate a non-main operating frequency band of the moving-iron speaker, reserve
power of the moving-iron speaker in a main operating frequency band, and perform frequency
division at a frequency in an attenuated frequency band of the moving-iron speaker,
to obtain sub-audio signals in two frequency bands.
[0088] FIG. 7c is a schematic diagram of an example of signal frequency division according
to this application. As shown in FIG. 7c, the frequency divider 42 is configured to
perform two-segment attenuation on a non-main operating frequency band of the moving-coil
speaker, reserve power of the moving-coil speaker in a main operating frequency band,
perform two-segment attenuation on a non-main operating frequency band of the moving-iron
speaker, reserve power of the moving-iron speaker in a main operating frequency band,
perform frequency division at a turning frequency of a first attenuated frequency
band and a second attenuated frequency band of the moving-iron speaker, and perform
frequency division at a turning frequency of a first attenuated frequency band and
a second attenuated frequency band of the moving-coil speaker, to obtain sub-audio
signals in three frequency bands.
[0089] For example, it is assumed that the TWS earphone includes three speakers: a moving-coil
speaker, a moving-iron speaker, and a MEMS speaker. A dashed line represents a frequency
response curve of the moving-coil speaker. A single-point line represents a frequency
response curve of the moving-iron speaker. A double-point line represents a frequency
response curve of the MEMS speaker. A solid line represents a frequency division line.
[0090] FIG. 7d is a schematic diagram of an example of signal frequency division according
to this application. As shown in FIG. 7d, based on the example shown in FIG. 7c, the
frequency divider 42 is configured to attenuate a non-main operating frequency band
of the MEMS speaker, reserve power of the MEMS speaker in a main operating frequency
band, and perform frequency division at a cross frequency in respective attenuated
frequency bands of the moving-iron speaker and the MEMS speaker, to obtain sub-audio
signals in four frequency bands.
[0091] It should be noted that the examples shown in FIG. 7a to FIG. 7d are examples in
which the frequency divider 42 performs frequency division on a speaker drive signal.
A specific frequency division manner of the frequency divider 42 is not limited in
this application.
[0092] At least two speakers are disposed in the TWS earphone of this application, and main
operating frequency bands of the at least two speakers are not exactly same. The frequency
divider may divide the speaker drive signal into sub-audio signals of at least two
frequency bands. Adjacent frequency bands in the at least two frequency bands partially
overlap or do not overlap. In this case, each sub-audio signal is transmitted to a
speaker with a matching frequency band. The matching frequency band may mean that
a main operating frequency band of the speaker covers a frequency band of the sub-audio
signal transmitted to the speaker. In this way, the speaker maintains an optimal frequency
response when playing the sub-audio signal transmitted to the speaker, which can provide
a high-quality audio source in various frequency bands, and can also support ultra-wideband
audio calls.
[0093] In a possible implementation, FIG. 8a is a schematic diagram of an example structure
of a TWS earphone according to this application. As shown in FIG. 8a, based on the
structure shown in FIG. 4, the TWS earphone 40 further includes: a first DAC 44. An
input end of the first DAC 44 is connected to the output end of the audio signal processing
path 41, and an output end of the first DAC 44 is connected to the input end of the
frequency divider 42.
[0094] The first DAC 44 is configured to convert the speaker drive signal from a digital
format to an analog format. Correspondingly, the frequency divider 42 is an analog
frequency divider.
[0095] In the structure shown in FIG. 2a or FIG. 2b, after the speaker drive signal is obtained,
if the signal is in a digital format before transmitted to the DAC, but a signal to
be played by the speaker needs to be in an analog format, the speaker drive signal
in the digital format may be first converted into a speaker drive signal in the analog
format by the first DAC, and then the speaker drive signal in the analog format is
divided into sub-audio signals of at least two frequency bands by the analog frequency
divider.
[0096] In this embodiment, a structure of conversion before frequency division is used.
[0097] For example, FIG. 8b is a schematic diagram of an example structure of a TWS earphone
according to this application. As shown in FIG. 8b, the structure of this embodiment
is a more detailed implementation of the structure shown in FIG. 8a.
[0098] In the TWS earphone 60, a main microphone 601 and an FF microphone 602 are respectively
connected to an input end of a voice enhancement filter 603, and an output end of
the voice enhancement filter 603 and an audio source 604 (including music and call
voice) are superimposed by a superimposer 1 to obtain a downlink signal. The downlink
signal is transmitted to an input end of a superimposer 2. The downlink signal is
further transmitted to an input end of an SP filter 605. The FF microphone 602 is
further connected to an input end of a feedforward filter 606, and an output end of
the feedforward filter 606 is connected to another input end of the superimposer 2.
An FB microphone 607 is connected to an input end of a superimposer 3, an output end
of the SP filter 605 is connected to another input end of the superimposer 3, an output
end of the superimposer 3 is connected to an input end of a feedback filter 608, and
an output end of the feedback filter 608 is connected to a third input end of the
superimposer 2. An output end of the superimposer 2 is connected to an input end of
a digital-to-analog converter (DAC) 609, an output end of the DAC 609 is connected
to an input end of an analog frequency divider 610, and an output end of the analog
frequency divider 610 is connected to a moving-coil speaker 611a and a moving-iron
speaker 611b. An AHA joint controller 612 is connected to the voice enhancement filter
603, the feedforward filter 606, the feedback filter 608, and the SP filter 605 respectively.
[0099] The TWS earphone 60 in this embodiment is provided with two speakers: a moving-coil
speaker 611a and a moving-iron speaker 611b. A main operating frequency band of the
moving-coil speaker 611a is less than 8.5 kHz, and a main operating frequency band
of the moving-iron speaker 611b is more than 8.5 kHz. In this case, a frequency divider
42 may be provided to divide a speaker drive signal in an analog format into a sub-audio
signal of less than 8.5 kHz and a sub-audio signal of more than 8.5 kHz. The moving-coil
speaker 611a plays the sub-audio signal of less than 8.5 kHz to maintain an optimal
frequency response, and the moving-iron speaker 611b plays the sub-audio signal of
more than 8.5 kHz to maintain an optimal frequency response. Therefore, the TWS earphone
60 can provide a high-quality audio source in various frequency bands, and can also
support ultra-wideband audio calls.
[0100] For example, FIG. 8c is a schematic diagram of an example structure of a TWS earphone
according to this application. As shown in FIG. 8c, the structure of this embodiment
is another more detailed implementation of the structure shown in FIG. 8a.
[0101] A difference from the structure shown in FIG. 8b lies in that the output end of the
analog frequency divider 610 is connected to the moving-coil speaker 611a, the moving-iron
speaker 611b, a MEMS speaker 611c, and a planar vibrating diaphragm 611d.
[0102] The TWS earphone 60 in this embodiment is provided with four speakers: a moving-coil
speaker 611a, a moving-iron speaker 611b, a MEMS speaker 611c, and a planar vibrating
diaphragm 611d. A main operating frequency band of the moving-coil speaker 611a is
less than 8.5 kHz, and a main operating frequency band of the moving-iron speaker
611b is more than 8.5 kHz. Amain operating frequency band of the MEMS speaker 611c
depends on an application form. The main operating frequency band for an in-ear headphone
is a full frequency band. The main operating frequency band for an over-ear headphone
is less than 7 kHz, which is weak, and thus a main action frequency band is high frequency
of more than 7 kHz. A main operating frequency band of the planar vibrating diaphragm
611d is 10 kHz to 20 kHz. In this case, a frequency divider 42 may be provided to
divide a speaker drive signal in an analog format into four sub-frequency bands. The
moving-coil speaker 611a plays a sub-audio signal of less than 8.5 kHz to maintain
an optimal frequency response, the moving-iron speaker 611b plays a sub-audio signal
of more than 8.5 kHz to maintain an optimal frequency response, the MEMS speaker 611c
plays a sub-audio signal of more than 7 kHz to maintain an optimal frequency response,
and the planar vibrating diaphragm 611d plays a sub-audio signal of more than 10 kHz
to maintain an optimal frequency response. Therefore, the TWS earphone 60 can provide
a high-quality audio source in various frequency bands, and can also support ultra-wideband
audio calls.
[0103] In the foregoing structure, the voice enhancement filter 603, the audio source 604,
and the AHAjoint controller 612 are disposed in a digital signal processing (digital
signal processing, DSP) chip, and the feedforward filter 606, the feedback filter
608, the SP filter 605, and the DAC 609 are disposed in a coder-decoder (coder-decoder,
CODEC).
[0104] For example, FIG. 8d is a schematic diagram of an example structure of a TWS earphone
according to this application. As shown in FIG. 8d, the structure of this embodiment
is a more detailed implementation of the structure shown in FIG. 8a.
[0105] A difference from the structure shown in FIG. 8b lies in that the voice enhancement
filter 603 is moved from the DSP chip to the CODEC.
[0106] For example, FIG. 8e is a schematic diagram of an example structure of a TWS earphone
according to this application. As shown in FIG. 8e, the structure of this embodiment
is a more detailed implementation of the structure shown in FIG. 8a.
[0107] A difference from the structure shown in FIG. 8c lies in that the voice enhancement
filter 603 is moved from the DSP chip to the CODEC.
[0108] In a possible implementation, FIG. 9a is a schematic diagram of an example structure
of a TWS earphone according to this application. As shown in FIG. 9a, based on the
structure shown in FIG. 4, the TWS earphone 40 further includes: at least two second
DACs 45. Input ends of the at least two second DACs 45 are all connected to the output
end of the frequency divider 42, and output ends of the at least two second DACs 45
are respectively connected to the at least two speakers 43.
[0109] Each second DAC 45 is configured to convert one of the sub-audio signals of the at
least two frequency bands from a digital format to an analog format. Correspondingly,
the frequency divider 42 is a digital frequency divider.
[0110] In the structure shown in FIG. 2a or FIG. 2b, after the speaker drive signal is obtained,
if the signal is in a digital format before transmitted to the DAC, but a signal to
be played by the speaker needs to be in an analog format, the speaker drive signal
in the digital format may be first divided into sub-audio signals of at least two
frequency bands by the digital frequency divider, and then the sub-audio signals in
the digital format that are transmitted to the at least two second DACs are respectively
converted into sub-audio signals in the analog format by the at least two second DACs.
[0111] In this embodiment, a structure of frequency division before conversion is used.
[0112] For example, FIG. 9b is a schematic diagram of an example structure of a TWS earphone
according to this application. As shown in FIG. 9b, the structure of this embodiment
is a more detailed implementation of the structure shown in FIG. 9a.
[0113] In the TWS earphone 70, a main microphone 701 and an FF microphone 702 are respectively
connected to an input end of a voice enhancement filter 703, and an output end of
the voice enhancement filter 703 and an audio source 704 (including music and call
voice) are superimposed by a superimposer 1 to obtain a downlink signal. The downlink
signal is transmitted to an input end of a superimposer 2. The downlink signal is
further transmitted to an input end of an SP filter 705. The FF microphone 702 is
further connected to an input end of a feedforward filter 706, and an output end of
the feedforward filter 706 is connected to another input end of the superimposer 2.
An FB microphone 707 is connected to an input end of a superimposer 3, an output end
of the SP filter 705 is connected to another input end of the superimposer 3, an output
end of the superimposer 3 is connected to an input end of a feedback filter 708, and
an output end of the feedback filter 708 is connected to a third input end of the
superimposer 2. An output end of the superimposer 2 is connected to an input end of
a digital frequency divider 709, and an output end of the digital frequency divider
709 is connected to input ends of two DACs 710a and 710b. An output end of the DAC
710a is connected to a moving speaker 711a, and an output end of the DAC 710b is connected
to a moving-iron speaker 711b. An AHAjoint controller 712 is connected to the voice
enhancement filter 703, the feedforward filter 706, the feedback filter 708, and the
SP filter 705 respectively.
[0114] For example, FIG. 9c is a schematic diagram of an example structure of a TWS earphone
according to this application. As shown in FIG. 9c, the structure of this embodiment
is a more detailed implementation of the structure shown in FIG. 9a.
[0115] The TWS earphone 70 in this embodiment is provided with four speakers: a moving-coil
speaker 711a, a moving-iron speaker 711b, a MEMS speaker 711c, and a planar vibrating
diaphragm 711d. A main operating frequency band of the moving-coil speaker 711a is
less than 8.5 kHz, and a main operating frequency band of the moving-iron speaker
711b is more than 8.5 kHz. Amain operating frequency band of the MEMS speaker 711c
depends on an application form. The main operating frequency band for an in-ear headphone
is a full frequency band. The main operating frequency band for an over-ear headphone
is less than 7 kHz, which is weak, and thus a main action frequency band is high frequency
of more than 7 kHz. A main operating frequency band of the planar vibrating diaphragm
711d is 10 kHz to 20 kHz. In this case, a frequency divider 42 may be provided to
divide a speaker drive signal in an analog format into four sub-frequency bands. The
moving-coil speaker 711a plays a sub-audio signal of less than 8.5 kHz to maintain
an optimal frequency response, the moving-iron speaker 711b plays a sub-audio signal
of more than 8.5 kHz to maintain an optimal frequency response, the MEMS speaker 711c
plays a sub-audio signal of more than 7 kHz to maintain an optimal frequency response,
and the planar vibrating diaphragm 711d plays a sub-audio signal of more than 10 kHz
to maintain an optimal frequency response. Therefore, the TWS earphone 70 can provide
a high-quality audio source in various frequency bands, and can also support ultra-wideband
audio calls.
[0116] In the foregoing structure, the voice enhancement filter 703, the audio source 704,
and the AHA joint controller 712 are disposed in a DSP chip, and the feedforward filter
706, the feedback filter 708, the SP filter 705, and the DAC 709 are disposed in a
CODEC.
[0117] For example, FIG. 9d is a schematic diagram of an example structure of a TWS earphone
according to this application. As shown in FIG. 9d, the structure of this embodiment
is a more detailed implementation of the structure shown in FIG. 9a.
[0118] A difference from the structure shown in FIG. 9b lies in that the voice enhancement
filter 703 is moved from the DSP chip to the CODEC.
[0119] For example, FIG. 9e is a schematic diagram of an example structure of a TWS earphone
according to this application. As shown in FIG. 9e, the structure of this embodiment
is a more detailed implementation of the structure shown in FIG. 9a.
[0120] A difference from the structure shown in FIG. 9c lies in that the voice enhancement
filter 703 is moved from the DSP chip to the CODEC.
[0121] FIG. 10 is an example flowchart of a play method of a TWS earphone according to this
application. As shown in FIG. 10, the method in this embodiment may be applied to
the TWS earphone in the foregoing embodiments. The method may include the following
steps:
Step 1001: Obtain an audio source.
[0122] Optionally, the audio source is original music or call voice. To be specific, the
audio source may be music, video sound, or the like that a user is listening to by
using earphones, or may be call voice when a user is making a call by using earphones.
The audio source may come from a player of an electronic device. Optionally, the audio
source includes a voice signal obtained through voice enhancement processing and original
music or call voice. To be specific, in addition to the music or call voice in the
foregoing two cases, the audio source may be further obtained by superimposing an
external voice signal obtained through the voice enhancement processing. The external
voice signal obtained through the voice enhancement processing may be obtained by
using the voice enhancement filter in the structure shown in FIG. 2a or FIG. 2b, and
details are not described herein again.
[0123] Step 1002: Perform noise cancellation or hear through processing on the audio source
to obtain a speaker drive signal.
[0124] In a possible implementation, a fixed secondary path SP filter may be obtained by
using the CODEC, the audio source is processed by using the fixed SP filter to obtain
a filtered signal, and the noise cancellation or hear through processing is performed
on the filtered signal to obtain the speaker drive signal. The CODEC may obtain an
estimated SP filter based on a preset speaker drive signal and an ear canal signal
picked up by a feedback FB microphone, where the ear canal signal includes a residual
noise signal inside an ear canal; and determine the estimated SP filter as the fixed
SP filter when a difference signal between a signal obtained through the estimated
SP filter and the ear canal signal is within a specified range. Optionally, a parameter
of a cascaded second-order filter is obtained based on a target frequency response
of the estimated SP filter and a preset frequency division requirement when the difference
signal between the signal obtained through the estimated SP filter and the ear canal
signal is within the specified range; and an SP cascaded second-order filter is obtained
based on the parameter of the cascaded second-order filter, and the SP cascaded second-order
filter is used as the fixed SP filter.
[0125] In a possible implementation, an adaptive SP filter may be obtained by using the
DSP chip, the audio source is processed by using the adaptive SP filter to obtain
a filtered signal, and the noise cancellation or hear through processing is performed
on the filtered signal to obtain the speaker drive signal. The DSP chip may obtain
a real-time noise signal, obtain an estimated SP filter based on the audio source
and the real-time noise signal; and determine the estimated SP filter as the adaptive
SP filter when a difference signal between a signal obtained through the estimated
SP filter and the real-time noise signal is within a specified range. Optionally,
the DSP chip may first obtain an external signal picked up by the FF microphone and
an ear canal signal picked up by the FB microphone, where the external signal includes
an external noise signal and music or call voice, and the ear canal signal includes
a residual noise signal inside an ear canal and music or call voice, then obtain a
voice signal picked up by the main microphone, and finally subtract the external signal
and the ear canal signal from the voice signal to obtain the real-time noise signal.
[0126] For the noise cancellation processing and the hear through processing in this application,
refer to the foregoing embodiments. Details are not described herein again.
[0127] Step 1003: Divide the speaker drive signal into sub-audio signals of at least two
frequency bands.
[0128] A frequency band of the processed speaker drive signal corresponds to a frequency
band of the audio source, and may include low, middle, and high frequency bands. However,
because a main operating frequency band of a single speaker may cover only some of
the low, middle, and high frequency bands, the single speaker cannot provide high
sound quality in all the frequency bands.
[0129] The frequency divider of this application may be configured to perform frequency
division on the speaker drive signal based on the main operating frequency bands of
the at least two speakers to obtain the sub-audio signals of the at least two frequency
bands respectively corresponding to the main operating frequency bands of the at least
two speakers. Then, each speaker plays a sub-audio signal in a corresponding frequency
band, so that the speaker maintains an optimal frequency response when playing the
sub-audio signal transmitted to the speaker. Adjacent frequency bands in the at least
two frequency bands partially overlap, or adjacent frequency bands in the at least
two frequency bands do not overlap. For example, the frequency divider divides the
speaker drive signal into two frequency bands: a high frequency band and a low frequency
band, which are completely separate without overlapping, or partially overlap. In
another example, the frequency divider divides the speaker drive signal into three
frequency bands: a high frequency band, a middle frequency band, and a low frequency
band, where the high frequency band and the middle frequency band are completely separate
without overlapping, and the middle frequency band and the low frequency band partially
overlap; or the high frequency band, the middle frequency band, and the low frequency
band are completely separate without overlapping; or the high frequency band and the
middle frequency band partially overlap, and the middle frequency band and the low
frequency band are completely separate without overlapping.
[0130] In this application, a parameter of the frequency divider 42 may be set to control
the frequency divider 42 to perform frequency division on the speaker drive signal
in a preset manner. For an implementation of frequency division, refer to FIG. 6a
to FIG. 6d, and details are not described herein again.
[0131] Step 1004: Play the sub-audio signals of the at least two frequency bands respectively
through the at least two speakers.
[0132] The at least two speakers are disposed in the TWS earphone of this application, and
main operating frequency bands of the at least two speakers are not exactly same.
The frequency divider may divide the speaker drive signal into sub-audio signals of
at least two frequency bands. Adjacent frequency bands in the at least two frequency
bands partially overlap or do not overlap. In this case, each sub-audio signal is
transmitted to a speaker with a matching frequency band. The matching frequency band
may mean that a main operating frequency band of the speaker covers a frequency band
of the sub-audio signal transmitted to the speaker. In this way, the speaker maintains
an optimal frequency response when playing the sub-audio signal transmitted to the
speaker, which can provide a high-quality audio source in various frequency bands,
and can also support ultra-wideband audio calls.
[0133] FIG. 11 is a diagram of an example structure of a play apparatus of a TWS earphone
according to this application. As shown in FIG. 11, the apparatus 1100 in this embodiment
may be used in the TWS earphone in the foregoing embodiments. The apparatus 1100 includes:
an obtaining module 1101, a processing module 1102, a frequency division module 1103,
and a play module 1104.
[0134] The obtaining module 1101 is configured to obtain an audio source, where the audio
source is original music or call voice, or the audio source includes a voice signal
obtained through voice enhancement processing and the original music or call voice.
The processing module 1102 is configured to perform noise cancellation or hear through
processing on the audio source to obtain a speaker drive signal. The frequency division
module 1103 is configured to divide the speaker drive signal into sub-audio signals
of at least two frequency bands, where adjacent frequency bands in the at least two
frequency bands partially overlap, or adjacent frequency bands in the at least two
frequency bands do not overlap. The play module 1104 is configured to play the sub-audio
signals of the at least two frequency bands respectively through at least two speakers.
[0135] In a possible implementation, the processing module 1102 is specifically configured
to: obtain a fixed secondary path SP filter by using a coder-decoder CODEC; process
the audio source by using the fixed SP filter to obtain a filtered signal; and perform
the noise cancellation or hear through processing on the filtered signal to obtain
the speaker drive signal.
[0136] In a possible implementation, the processing module 1102 is specifically configured
to: obtain an estimated SP filter based on a preset speaker drive signal and an ear
canal signal picked up by a feedback FB microphone, where the ear canal signal includes
a residual noise signal inside an ear canal and the music or call voice; and determine
the estimated SP filter as the fixed SP filter when a difference signal between a
signal obtained through the estimated SP filter and the ear canal signal is within
a specified range.
[0137] In a possible implementation, the processing module 1102 is further configured to:
obtain a parameter of a cascaded second-order filter based on a target frequency response
of the estimated SP filter and a preset frequency division requirement when the difference
signal between the signal obtained through the estimated SP filter and the ear canal
signal is within the specified range; and obtain an SP cascaded second-order filter
based on the parameter of the cascaded second-order filter, and use the SP cascaded
second-order filter as the fixed SP filter.
[0138] In a possible implementation, the processing module 1102 is specifically configured
to: obtain an adaptive SP filter by using a digital signal processing DSP chip; process
the audio source by using the adaptive SP filter to obtain a filtered signal; and
perform the noise cancellation or hear through processing on the filtered signal to
obtain the speaker drive signal.
[0139] In a possible implementation, the processing module 1102 is specifically configured
to: obtain a real-time noise signal; obtain an estimated SP filter based on the audio
source and the real-time noise signal; and determine the estimated SP filter as the
adaptive SP filter when a difference signal between a signal obtained through the
estimated SP filter and the real-time noise signal is within a specified range.
[0140] In a possible implementation, the processing module 1102 is specifically configured
to: obtain an external signal picked up by a feedforward FF microphone and an ear
canal signal picked up by a feedback FB microphone, where the external signal includes
an external noise signal and the music or call voice, and the ear canal signal includes
a residual noise signal inside an ear canal and the music or call voice; obtain a
voice signal picked up by a main microphone; subtract the external signal and the
ear canal signal from the voice signal to obtain a signal difference; and obtain the
estimated SP filter based on the audio source and the signal difference.
[0141] In a possible implementation, main operating frequency bands of the at least two
speakers are not exactly same.
[0142] In a possible implementation, the at least two speakers include a moving-coil speaker
and a moving-iron speaker.
[0143] In a possible implementation, the at least two speakers include a moving-coil speaker,
a moving-iron speaker, a micro-electro-mechanical system MEMS speaker, and a planar
vibrating diaphragm.
[0144] The apparatus in this embodiment may be configured to perform the technical solution
of the method embodiment shown in FIG. 10. The implementation principles and technical
effects are similar, and are not described herein again.
[0145] In an implementation process, the steps in the foregoing method embodiments may be
implemented by using a hardware integrated logic circuit in a processor, or by using
instructions in a form of software. The processor may be a general-purpose processor,
a digital signal processor (digital signal processor, DSP), an application-specific
integrated circuit (application-specific integrated circuit, ASIC), a field-programmable
gate array (field-programmable gate array, FPGA) or another programmable logic device,
a discrete gate or transistor logic device, or a discrete hardware component. The
general-purpose processor may be a microprocessor, or the processor may be any conventional
processor or the like. The steps of the method disclosed in embodiments of this application
may be directly presented as being performed and completed by a hardware encoding
processor, or performed and completed by a combination of hardware and a software
module in an encoding processor. The software module may be located in a storage medium
mature in the art, such as a random access memory, a flash memory, a read-only memory,
a programmable read-only memory, an electrically erasable programmable memory, or
a register. The storage medium is located in a memory, and the processor reads information
in the memory and completes the steps in the foregoing method in combination with
hardware of the processor.
[0146] The memory in the foregoing embodiments may be a volatile memory or a non-volatile
memory, or may include both a volatile memory and a non-volatile memory. The non-volatile
memory may be a read-only memory (read-only memory, ROM), a programmable read-only
memory (programmable ROM, PROM), an erasable programmable read-only memory (erasable
PROM, EPROM), an electrically erasable programmable read-only memory (electrically
EPROM, EEPROM), or a flash memory. The volatile memory may be a random access memory
(random access memory, RAM) and is used as an external cache. By way of example and
not limitation, RAMs in many forms may be used, such as a static random access memory
(static RAM, SRAM), a dynamic random access memory (dynamic RAM, DRAM), a synchronous
dynamic random access memory (synchronous DRAM, SDRAM), a double data rate synchronous
dynamic random access memory (double data rate SDRAM, DDR SDRAM), an enhanced synchronous
dynamic random access memory (enhanced SDRAM, ESDRAM), a synchlink dynamic random
access memory (synchlink DRAM, SLDRAM), and a direct rambus random access memory (direct
rambus RAM, DR RAM). It should be noted that the memory in the system and method described
in this specification includes but is not limited to these and any memory of another
appropriate type.
[0147] A person of ordinary skill in the art may be aware that, in combination with the
examples described in embodiments disclosed in this specification, units and algorithm
steps can be implemented by electronic hardware or a combination of computer software
and electronic hardware. Whether the functions are performed by hardware or software
depends on particular applications and design constraint conditions of the technical
solutions. A person skilled in the art may use different methods to implement the
described functions for each particular application, but it should not be considered
that the implementation goes beyond the scope of this application.
[0148] It may be clearly understood by a person skilled in the art that, for the purpose
of convenient and brief description, for a detailed working process of the foregoing
system, apparatus, and unit, refer to a corresponding process in the foregoing method
embodiments. Details are not described herein again.
[0149] In several embodiments provided in this application, it should be understood that
the disclosed system, apparatus, and method may be implemented in another manner.
For example, the described apparatus embodiment is merely an example. For example,
division into the units is merely logical function division and may be other division
during actual implementation. For example, a plurality of units or components may
be combined or integrated into another system, or some features may be omitted or
not performed. In addition, the displayed or discussed mutual couplings or direct
couplings or communication connections may be implemented through some interfaces.
The indirect couplings or communication connections between the apparatuses or units
may be implemented in electrical, mechanical, or another form.
[0150] The units described as separate parts may or may not be physically separate, and
parts displayed as units may or may not be physical units, may be located in one position,
or may be distributed on a plurality of network units. Some or all of the units may
be selected based on actual requirements to achieve the objectives of the solutions
of embodiments.
[0151] In addition, functional units in embodiments of this application may be integrated
into one processing unit, each of the units may exist alone physically, or two or
more units are integrated into one unit.
[0152] When the functions are implemented in the form of a software functional unit and
sold or used as an independent product, the functions may be stored in a computer-readable
storage medium. Based on such an understanding, the technical solutions in this application
essentially, or the part contributing to the conventional technology, or some of the
technical solutions may be implemented in a form of a software product. The computer
software product is stored in a storage medium and includes several instructions for
instructing a computer device (a personal computer, a server, a network device, or
the like) to perform all or some of the steps of the method in embodiments of this
application. The foregoing storage medium includes any medium that can store program
code, such as a USB flash drive, a removable hard disk, a read-only memory (read-only
memory, ROM), a random access memory (random access memory, RAM), a magnetic disk,
or an optical disc.
[0153] The foregoing descriptions are merely specific implementations of this application,
but are not intended to limit the protection scope of this application. Any variation
or replacement readily figured out by a person skilled in the art within the technical
scope disclosed in this application shall fall within the protection scope of this
application. Therefore, the protection scope of this application shall be subject
to the protection scope of the claims.
1. A true wireless stereo TWS earphone, comprising an audio signal processing path, a
frequency divider, and at least two speakers, wherein
an output end of the audio signal processing path is connected to an input end of
the frequency divider, and an output end of the frequency divider is connected to
the at least two speakers;
the audio signal processing path is configured to output a speaker drive signal after
noise cancellation or hear through processing is performed on an audio source, wherein
the audio source is original music or call voice, or the audio source comprises a
voice signal obtained through voice enhancement processing and the original music
or call voice;
the frequency divider is configured to divide the speaker drive signal into sub-audio
signals of at least two frequency bands, wherein the at least two frequency bands
correspond to main operating frequency bands of the at least two speakers, and adjacent
frequency bands in the at least two frequency bands partially overlap, or adjacent
frequency bands in the at least two frequency bands do not overlap; and
the at least two speakers are configured to play the corresponding sub-audio signals.
2. The TWS earphone according to claim 1, wherein the audio signal processing path comprises:
a secondary path SP filter, configured to prevent cancellation of sound of the audio
source by the noise cancellation or hear through processing when the noise cancellation
or hear through processing and the audio source are concurrent.
3. The TWS earphone according to claim 2, wherein the audio signal processing path further
comprises a feedback FB microphone and a feedback filter, wherein
the FB microphone is configured to pick up an ear canal signal, wherein the ear canal
signal comprises a residual noise signal inside an ear canal and the music or call
voice;
the SP filter is configured to input the audio source, process the audio source, and
transmit, to the feedback filter, a signal obtained by superimposing an output signal
on the ear canal signal; and
the feedback filter is configured to generate a signal for the noise cancellation
or hear through processing, wherein the signal for the noise cancellation or hear
through processing is one superimposed signal of the generated speaker drive signal.
4. The TWS earphone according to claim 3, wherein the feedback FB microphone, the feedback
filter, and the SP filter are disposed in a coder-decoder CODEC.
5. The TWS earphone according to claim 2, wherein the SP filter is configured to input
the audio source and process the audio source, wherein an output signal is one superimposed
signal of the speaker drive signal.
6. The TWS earphone according to claim 5, wherein the SP filter is disposed in a digital
signal processing DSP chip.
7. The TWS earphone according to any one of claims 1 to 6, further comprising: a first
digital-to-analog converter DAC, wherein an input end of the first DAC is connected
to the output end of the audio signal processing path, and an output end of the first
DAC is connected to the input end of the frequency divider;
the first DAC is configured to convert the speaker drive signal from a digital format
to an analog format; and
correspondingly, the frequency divider is an analog frequency divider.
8. The TWS earphone according to any one of claims 1 to 6, further comprising: at least
two second DACs, wherein input ends of the at least two second DACs are all connected
to the output end of the frequency divider, and output ends of the at least two second
DACs are respectively connected to the at least two speakers;
the second DAC is configured to convert one of the sub-audio signals of the at least
two frequency bands from a digital format to an analog format; and
correspondingly, the frequency divider is a digital frequency divider.
9. The TWS earphone according to any one of claims 1 to 8, wherein the main operating
frequency bands of the at least two speakers are not exactly same.
10. The TWS earphone according to claim 9, wherein the at least two speakers comprise
a moving-coil speaker and a moving-iron speaker.
11. The TWS earphone according to claim 9, wherein the at least two speakers comprise
a moving-coil speaker, a moving-iron speaker, a micro-electro-mechanical system MEMS
speaker, and a planar vibrating diaphragm.
12. A play method of a true wireless stereo TWS earphone, wherein the method is applied
to the TWS earphone according to any one of claims 1 to 11, and the method comprises:
obtaining an audio source, wherein the audio source is original music or call voice,
or the audio source comprises a voice signal obtained through voice enhancement processing
and the original music or call voice;
performing noise cancellation or hear through processing on the audio source to obtain
a speaker drive signal;
dividing the speaker drive signal into sub-audio signals of at least two frequency
bands, wherein adjacent frequency bands in the at least two frequency bands partially
overlap, or adjacent frequency bands in the at least two frequency bands do not overlap;
and
playing the sub-audio signals of the at least two frequency bands respectively through
at least two speakers.
13. The method according to claim 12, wherein the performing noise cancellation or hear
through processing on the audio source to obtain a speaker drive signal comprises:
obtaining a fixed secondary path SP filter by using a coder-decoder CODEC;
processing the audio source by using the fixed SP filter to obtain a filtered signal;
and
performing the noise cancellation or hear through processing on the filtered signal
to obtain the speaker drive signal.
14. The method according to claim 13, wherein the obtaining a fixed secondary path SP
filter by using a coder-decoder CODEC comprises:
obtaining an estimated SP filter based on a preset speaker drive signal and an ear
canal signal picked up by a feedback FB microphone, wherein the ear canal signal comprises
a residual noise signal inside an ear canal; and
determining the estimated SP filter as the fixed SP filter when a difference signal
between a signal obtained through the estimated SP filter and the ear canal signal
is within a specified range.
15. The method according to claim 14, wherein after the obtaining an estimated SP filter
based on a preset speaker drive signal and an ear canal signal picked up by a feedback
FB microphone, the method further comprises:
obtaining a parameter of a cascaded second-order filter based on a target frequency
response of the estimated SP filter and a preset frequency division requirement when
the difference signal between the signal obtained through the estimated SP filter
and the ear canal signal is within the specified range; and
obtaining an SP cascaded second-order filter based on the parameter of the cascaded
second-order filter, and using the SP cascaded second-order filter as the fixed SP
filter.
16. The method according to claim 12, wherein the performing noise cancellation or hear
through processing on the audio source to obtain a speaker drive signal comprises:
obtaining an adaptive SP filter by using a digital signal processing DSP chip;
processing the audio source by using the adaptive SP filter to obtain a filtered signal;
and
performing the noise cancellation or hear through processing on the filtered signal
to obtain the speaker drive signal.
17. The method according to claim 16, wherein the obtaining an adaptive SP filter by using
a digital signal processing DSP chip comprises:
obtaining a real-time noise signal;
obtaining an estimated SP filter based on the audio source and the real-time noise
signal; and
determining the estimated SP filter as the adaptive SP filter when a difference signal
between a signal obtained through the estimated SP filter and the real-time noise
signal is within a specified range.
18. The method according to claim 17, wherein the obtaining a real-time noise signal comprises:
obtaining an external signal picked up by a feedforward FF microphone and an ear canal
signal picked up by a feedback FB microphone, wherein the external signal comprises
an external noise signal and the music or call voice, and the ear canal signal comprises
a residual noise signal inside an ear canal and the music or call voice;
obtaining a voice signal picked up by a main microphone; and
subtracting the external signal and the ear canal signal from the voice signal to
obtain the real-time noise signal.
19. The method according to any one of claims 12 to 18, wherein main operating frequency
bands of the at least two speakers are not exactly same.
20. The method according to claim 19, wherein the at least two speakers comprise a moving-coil
speaker and a moving-iron speaker.
21. The method according to claim 19, wherein the at least two speakers comprise a moving-coil
speaker, a moving-iron speaker, a micro-electro-mechanical system MEMS speaker, and
a planar vibrating diaphragm.
22. A play apparatus of a true wireless stereo TWS earphone, wherein the apparatus is
used in the TWS earphone according to any one of claims 1 to 11, and the apparatus
comprises:
an obtaining module, configured to obtain an audio source, wherein the audio source
is original music or call voice, or the audio source comprises a voice signal obtained
through voice enhancement processing and the original music or call voice;
a processing module, configured to perform noise cancellation or hear through processing
on the audio source to obtain a speaker drive signal;
a frequency division module, configured to divide the speaker drive signal into sub-audio
signals of at least two frequency bands, wherein adjacent frequency bands in the at
least two frequency bands partially overlap, or adjacent frequency bands in the at
least two frequency bands do not overlap; and
a play module, configured to play the sub-audio signals of the at least two frequency
bands respectively through at least two speakers.
23. The apparatus according to claim 22, wherein the processing module is specifically
configured to: obtain a fixed secondary path SP filter by using a coder-decoder CODEC;
process the audio source by using the fixed SP filter to obtain a filtered signal;
and perform the noise cancellation or hear through processing on the filtered signal
to obtain the speaker drive signal.
24. The apparatus according to claim 23, wherein the processing module is specifically
configured to: obtain an estimated SP filter based on a preset speaker drive signal
and an ear canal signal picked up by a feedback FB microphone, wherein the ear canal
signal comprises a residual noise signal inside an ear canal and the music or call
voice; and determine the estimated SP filter as the fixed SP filter when a difference
signal between a signal obtained through the estimated SP filter and the ear canal
signal is within a specified range.
25. The apparatus according to claim 24, wherein the processing module is further configured
to: obtain a parameter of a cascaded second-order filter based on a target frequency
response of the estimated SP filter and a preset frequency division requirement when
the difference signal between the signal obtained through the estimated SP filter
and the ear canal signal is within the specified range; and obtain an SP cascaded
second-order filter based on the parameter of the cascaded second-order filter, and
use the SP cascaded second-order filter as the fixed SP filter.
26. The apparatus according to claim 22, wherein the processing module is specifically
configured to: obtain an adaptive SP filter by using a digital signal processing DSP
chip; process the audio source by using the adaptive SP filter to obtain a filtered
signal; and perform the noise cancellation or hear through processing on the filtered
signal to obtain the speaker drive signal.
27. The apparatus according to claim 26, wherein the processing module is specifically
configured to: obtain a real-time noise signal; obtain an estimated SP filter based
on the audio source and the real-time noise signal; and determine the estimated SP
filter as the adaptive SP filter when a difference signal between a signal obtained
through the estimated SP filter and the real-time noise signal is within a specified
range.
28. The apparatus according to claim 27, wherein the processing module is specifically
configured to: obtain an external signal picked up by a feedforward FF microphone
and an ear canal signal picked up by a feedback FB microphone, wherein the external
signal comprises an external noise signal and the music or call voice, and the ear
canal signal comprises a residual noise signal inside an ear canal and the music or
call voice; obtain a voice signal picked up by a main microphone; subtract the external
signal and the ear canal signal from the voice signal to obtain a signal difference;
and obtain the estimated SP filter based on the audio source and the signal difference.
29. The apparatus according to any one of claims 22 to 28, wherein main operating frequency
bands of the at least two speakers are not exactly same.
30. The apparatus according to claim 29, wherein the at least two speakers comprise a
moving-coil speaker and a moving-iron speaker.
31. The apparatus according to claim 29, wherein the at least two speakers comprise a
moving-coil speaker, a moving-iron speaker, a micro-electro-mechanical system MEMS
speaker, and a planar vibrating diaphragm.
32. A computer-readable storage medium, comprising a computer program, wherein when the
computer program is executed by a computer, the computer is enabled to perform the
method according to any one of claims 12 to 21.
33. A computer program, wherein when the computer program is executed by a computer, the
method according to any one of claims 12 to 21 is performed.