(19)

(11)

EP 4 298 735 A1

(12)

(43) Date of publication: 03.01.2024 Bulletin 2024/01 (21) Application number: 22702123.5 (22) Date of filing: 13.01.2022

(51) International Patent Classification (IPC):  H04B 7/06(2006.01) H04B 17/10(2015.01) H04B 7/10(2017.01) H04B 7/08(2006.01) H04B 17/17(2015.01) (52) Cooperative Patent Classification (CPC): H04B 7/0695; H04B 7/088; H04B 7/10; H04B 17/17; H04B 17/101 (86) International application number: PCT/US2022/012336 (87) International publication number: WO 2022/182437 (01.09.2022 Gazette 2022/35)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 23.02.2021 US 202163152603 P 12.01.2022 US 202217574446 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: KOMPALA, Surendra San Diego, California 92121-1714 (US) LAGHATE, Mihir Vijay San Diego, California 92121-1714 (US) (74) Representative: Tomkins & Co  5 Dartmouth Road Dublin 6, D06 F9C7 Dublin 6, D06 F9C7 (IE)