(19)
(11) EP 4 302 546 A1

(12)

(43) Date of publication:
10.01.2024 Bulletin 2024/02

(21) Application number: 22714641.2

(22) Date of filing: 22.02.2022
(51) International Patent Classification (IPC): 
H04W 72/08(2009.01)
(52) Cooperative Patent Classification (CPC):
H04W 72/046; H04L 5/0023; H04L 5/0094; H04L 5/0062; H04B 7/0617; H04J 11/0056; G06N 3/084; G06N 3/044; G06N 3/045; H04W 72/541
(86) International application number:
PCT/US2022/017369
(87) International publication number:
WO 2022/187031 (09.09.2022 Gazette 2022/36)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 02.03.2021 US 202163155635 P
18.02.2022 US 202217675980

(71) Applicant: QUALCOMM INCORPORATED
San Diego, California 92121-1714 (US)

(72) Inventors:
  • TOKGOZ, Yeliz
    San Diego, California 92121-1714 (US)
  • SUNDARARAJAN, Jay Kumar
    San Diego, California 92121-1714 (US)
  • MUKKAVILLI, Krishna Kiran
    San Diego, California 92121-1714 (US)
  • KWON, Hwan Joon
    San Diego, California 92121-1714 (US)
  • BHUSHAN, Naga
    San Diego, California 92121 (US)
  • YOO, Taesang
    San Diego, California 92121-1714 (US)
  • JI, Tingfang
    San Diego, California 92121 (US)

(74) Representative: Bardehle Pagenberg Partnerschaft mbB Patentanwälte Rechtsanwälte 
Prinzregentenplatz 7
81675 München
81675 München (DE)

   


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