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EP 4 305 675 A1

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(43) Date of publication: 17.01.2024 Bulletin 2024/03 (21) Application number: 22713375.8 (22) Date of filing: 04.03.2022

(51) International Patent Classification (IPC):  H01L 31/11(2006.01) G01S 17/00(2020.01) (52) Cooperative Patent Classification (CPC): H01L 31/11; H01L 31/112; G01S 7/4814; G01S 7/4911 (86) International application number: PCT/EP2022/055533 (87) International publication number: WO 2022/189285 (15.09.2022 Gazette 2022/37)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 12.03.2021 EP 21162360 (71) Applicants: Sony Semiconductor Solutions Corporation Atsugi-shi, Kanagawa 243-0014 (JP) Sony Depthsensing Solutions SA/NV 1050 Ixelles (Brussels) (BE) AL

(72) Inventor: DEHAN, Morin 70327 Stuttgart (DE) (74) Representative: MFG Patentanwälte Meyer-Wildhagen Meggle-Freund Gerhard PartG mbB  Amalienstraße 62 80799 München 80799 München (DE)