(19)
(11) EP 4 315 402 A1

(12)

(43) Date of publication:
07.02.2024 Bulletin 2024/06

(21) Application number: 22715277.4

(22) Date of filing: 18.03.2022
(51) International Patent Classification (IPC): 
H01L 21/36(2006.01)
(52) Cooperative Patent Classification (CPC):
H01L 21/02568; H01L 21/02491; H01L 21/02494; H01L 21/02667; H01L 21/02675; H01L 21/02422
(86) International application number:
PCT/US2022/020853
(87) International publication number:
WO 2022/212086 (06.10.2022 Gazette 2022/40)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 30.03.2021 US 202117216729
02.06.2021 US 202117336894

(71) Applicant: Government of The United States as Represented By the Secretary of the Air Force
Wright-Patterson AFB, Ohio 45433-7109 (US)

(72) Inventors:
  • GLAVIN, Nicholas, R.
    Springboro, OH 45066 (US)
  • MURATORE, Christopher
    Kettering, OH 45409 (US)

(74) Representative: Altmann Stößel Dick Patentanwälte PartG mbB 
Theodor-Heuss-Anlage 2
68165 Mannheim
68165 Mannheim (DE)

   


(54) PROCESS OF MAKING COMPONENTS FOR ELECTRONIC AND OPTICAL DEVICES USING LASER PROCESSING ON A PATTERNED CONDUCTIVE FILM