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(11)

EP 4 315 865 A1

(12)

(43) Date of publication: 07.02.2024 Bulletin 2024/06 (21) Application number: 22713243.8 (22) Date of filing: 09.03.2022

(51) International Patent Classification (IPC):  H04N 19/70(2014.01) H04N 19/85(2014.01) (52) Cooperative Patent Classification (CPC): H04N 19/70; H04N 19/85 (86) International application number: PCT/US2022/071051 (87) International publication number: WO 2022/213006 (06.10.2022 Gazette 2022/40)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 02.04.2021 US 202163170267 P 24.06.2021 US 202163214378 P 08.03.2022 US 202217653945 (71) Applicant: QUALCOMM Incorporated San Diego, California 92121-1714 (US)

(72) Inventors: HE, Yong San Diego, CA 92121-1714 (US) COBAN, Muhammed, Zeyd San Diego, CA 92121-1714 (US) RUSANOVSKYY, Dmytro San Diego, CA 92121-1714 (US) (74) Representative: Loveless, Ian Mark  Reddie & Grose LLP The White Chapel Building 10 Whitechapel High Street London E1 8QS London E1 8QS (GB)