(19)

(11)

EP 4 320 772 A1

(12)

(43) Date of publication: 14.02.2024 Bulletin 2024/07 (21) Application number: 22710934.5 (22) Date of filing: 24.02.2022

(51) International Patent Classification (IPC):  H04L 1/18(2023.01) H04L 27/26(2006.01) H04L 5/00(2006.01) (52) Cooperative Patent Classification (CPC): H04L 5/0055; H04L 27/26035; H04L 1/1861 (86) International application number: PCT/US2022/070825 (87) International publication number: WO 2022/217174 (13.10.2022 Gazette 2022/41)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 06.04.2021 US 202163200974 P 03.12.2021 US 202117457540 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventor: HUANG, Yi San Diego, California 92121-1714 (US) (74) Representative: Tomkins & Co  5 Dartmouth Road Dublin 6, D06 F9C7 Dublin 6, D06 F9C7 (IE)