(19)

(11)

EP 4 324 132 A1

(12)

(43) Date of publication: 21.02.2024 Bulletin 2024/08 (21) Application number: 22723326.9 (22) Date of filing: 14.04.2022

(51) International Patent Classification (IPC):  H04L 1/16(2023.01) H04L 1/18(2023.01) (52) Cooperative Patent Classification (CPC): H04L 1/1671; H04L 1/1854; H04L 1/1829 (86) International application number: PCT/US2022/071709 (87) International publication number: WO 2022/221854 (20.10.2022 Gazette 2022/42)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 14.04.2021 US 202163175054 P 13.04.2022 US 202217659073 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: ELGARISI, Yaniv San Diego, California 92121-1714 (US) RADULESCU, Andrei Dragos San Diego, California 92121-1714 (US) UZIEL, Lior San Diego, California 92121-1714 (US) (74) Representative: Dunlop, Hugh Christopher et al Maucher Jenkins Seventh Floor Offices Artillery House 11-19 Artillery Row London SW1P 1RT London SW1P 1RT (GB)