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(11)

EP 4 324 141 A1

(12)

(43) Date of publication: 21.02.2024 Bulletin 2024/08 (21) Application number: 22710937.8 (22) Date of filing: 25.02.2022

(51) International Patent Classification (IPC):  H04L 5/00(2006.01) H04W 74/08(2024.01) H04L 1/18(2023.01) (52) Cooperative Patent Classification (CPC): H04L 5/0048; H04L 5/0094; H04W 74/0833; H04L 1/08 (86) International application number: PCT/US2022/070845 (87) International publication number: WO 2022/221797 (20.10.2022 Gazette 2022/42)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 16.04.2021 US 202163175921 P 23.02.2022 US 202217652141 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: TAHERZADEH BOROUJENI, Mahmoud San Diego, California 92121-1714 (US) LUO, Tao San Diego, California 92121-1714 (US) SRIDHARAN, Gokul San Diego, California 92121-1714 (US) LY, Hung Dinh San Diego, California 92121-1714 (US) (74) Representative: Tomkins & Co  5 Dartmouth Road Dublin 6, D06 F9C7 Dublin 6, D06 F9C7 (IE)