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(11)

EP 4 324 256 A1

(12)

(43) Date of publication: 21.02.2024 Bulletin 2024/08 (21) Application number: 21739921.1 (22) Date of filing: 16.04.2021

(51) International Patent Classification (IPC):  H04W 56/00(2009.01) (52) Cooperative Patent Classification (CPC): H04W 56/0045; H04W 56/0015 (86) International application number: PCT/CN2021/087679 (87) International publication number: WO 2022/217570 (20.10.2022 Gazette 2022/42)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: LI, Qiaoyu San Diego, California 92121-1714 (US) ZHANG, Yu San Diego, California 92121-1714 (US) WEI, Chao San Diego, California 92121-1714 (US) XU, Hao San Diego, California 92121-1714 (US) (74) Representative: Bardehle Pagenberg Partnerschaft mbB Patentanwälte Rechtsanwälte  Prinzregentenplatz 7 81675 München 81675 München (DE)