(19)

(11)

EP 4 327 251 A1

(12)

(43) Date of publication: 28.02.2024 Bulletin 2024/09 (21) Application number: 22715237.8 (22) Date of filing: 15.03.2022

(51) International Patent Classification (IPC):  G06N 3/08(2023.01) H04L 67/00(2022.01) G06N 3/04(2023.01) (52) Cooperative Patent Classification (CPC): G06N 3/084; G06N 3/088; H04W 4/70; G06N 7/01; G06N 3/044; G06N 3/045 (86) International application number: PCT/US2022/020355 (87) International publication number: WO 2022/225627 (27.10.2022 Gazette 2022/43)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (30) Priority: 20.04.2021 US 202163177180 P 14.03.2022 US 202217694467 (71) Applicant: Qualcomm Incorporated San Diego, CA 92121-1714 (US)	(72) Inventors: PEZESHKI, Hamed San Diego, CA 92121-1714 (US) LUO, Tao San Diego, CA 92121-1714 (US) YOO, Taesang San Diego, CA 92121-1714 (US) (74) Representative: Bardehle Pagenberg Partnerschaft mbB Patentanwälte Rechtsanwälte  Prinzregentenplatz 7 81675 München 81675 München (DE)