(19)
(11) EP 4 327 291 A1

(12)

(43) Date of publication:
28.02.2024 Bulletin 2024/09

(21) Application number: 22732656.8

(22) Date of filing: 03.06.2022
(51) International Patent Classification (IPC): 
G06T 17/00(2006.01)
(52) Cooperative Patent Classification (CPC):
G06T 17/00; G06T 15/04; G06T 7/55; G06T 2207/10152; G06T 2207/30201
(86) International application number:
PCT/IB2022/055207
(87) International publication number:
WO 2022/259110 (15.12.2022 Gazette 2022/50)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30) Priority: 08.06.2021 US 202117342058

(71) Applicants:
  • Sony Group Corporation
    Tokyo 108-0075 (JP)
  • Sony Corporation of America
    New York, NY 10010 (US)

(72) Inventors:
  • FU, Chen
    San Jose, California 95112 (US)
  • GHARAVI-ALKHANSARI, Mohammad
    San Jose, California 95112 (US)

(74) Representative: D Young & Co LLP 
120 Holborn
London EC1N 2DY
London EC1N 2DY (GB)

   


(54) 3D MICROGEOMETRY AND REFLECTANCE MODELING