<?xml version="1.0" encoding="UTF-8"?><!DOCTYPE ep-patent-document PUBLIC "-//EPO//EP PATENT BULLETIN 1.6//EN" "ep-patent-document-v1-6.dtd"><!--This XML data has been generated under the supervision of the European Patent Office --><ep-patent-document id="EP22727273A1" file="22727273.9" lang="de" country="EP" doc-number="4334405" kind="A1" date-publ="20240313" status="n" dtd-version="ep-patent-document-v1-6"><SDOBI lang="de"><B000><eptags><B001EP>ATBECHDEDKESFRGBGRITLILUNLSEMCPTIESILTLVFIROMKCYALTRBGCZEEHUPLSKBAHRIS..MTNORSMESMMAKHTNMD..........</B001EP><B003EP>*</B003EP><B005EP>X</B005EP><B007EP>BDM Ver 2.0.24 -  1100000/0</B007EP></eptags></B000><B100><B110>4334405</B110><B130>A1</B130><B140><date>20240313</date></B140><B190>EP</B190></B100><B200><B210>22727273.9</B210><B220><date>20220502</date></B220><B240><B241><date>20231205</date></B241></B240><B250>de</B250><B251EP>de</B251EP><B260>de</B260></B200><B300><B310>102021204549</B310><B320><date>20210505</date></B320><B330><ctry>DE</ctry></B330></B300><B400><B405><date>20240313</date><bnum>202411</bnum></B405><B430><date>20240313</date><bnum>202411</bnum></B430></B400><B500><B510EP><classification-ipcr sequence="1"><text>C09J   7/00        20180101AFI20221111BHEP        </text></classification-ipcr></B510EP><B520EP><classifications-cpc><classification-cpc sequence="1"><text>C09J2203/342       20130101 LA20220722BHEP        </text></classification-cpc><classification-cpc sequence="2"><text>C09J   7/29        20180101 FI20220728BHEP        </text></classification-cpc></classifications-cpc></B520EP><B540><B541>de</B541><B542>MATERIALBANDSYSTEM, MATERIALBANDSYSTEMVERBUND, VERFAHREN ZUM HERSTELLEN EINES MATERIALBANDSYSTEMVERBUNDS UND VERWENDUNG EINES MATERIALBANDSYSTEMS</B542><B541>en</B541><B542>MATERIAL TAPE SYSTEM, MATERIAL TAPE SYSTEM ASSEMBLY, METHOD FOR PRODUCING A MATERIAL TAPE SYSTEM ASSEMBLY AND USE OF A MATERIAL TAPE SYSTEM</B542><B541>fr</B541><B542>SYSTÈME DE BANDE DE MATÉRIAU, ENSEMBLE SYSTÈME DE BANDE DE MATÉRIAU, PROCÉDÉ DE PRODUCTION D'UN ENSEMBLE SYSTÈME DE BANDE DE MATÉRIAU ET UTILISATION D'UN SYSTÈME DE BANDE DE MATÉRIAU</B542></B540></B500><B700><B710><B711><snm>TESA SE</snm><iid>101712124</iid><irf>2019058/PCT/EP</irf><adr><str>Hugo-Kirchberg-Str. 1</str><city>22848 Norderstedt</city><ctry>DE</ctry></adr></B711></B710><B720><B721><snm>ROHDE, Marten</snm><adr><city>29553 Bienenbüttel</city><ctry>DE</ctry></adr></B721><B721><snm>ELLRINGMANN, Ute</snm><adr><city>22589 Hamburg</city><ctry>DE</ctry></adr></B721><B721><snm>MEYER, Katja</snm><adr><city>22523 Hamburg</city><ctry>DE</ctry></adr></B721><B721><snm>CHACATTE, Henning</snm><adr><city>25421 Pinnerberg</city><ctry>DE</ctry></adr></B721><B721><snm>ERDMANN, Björn</snm><adr><city>22145 Hamburg</city><ctry>DE</ctry></adr></B721></B720><B740><B741><snm>tesa SE</snm><iid>101879932</iid><adr><str>Hugo-Kirchberg-Straße 1</str><city>22848 Norderstedt</city><ctry>DE</ctry></adr></B741></B740></B700><B800><B840><ctry>AL</ctry><ctry>AT</ctry><ctry>BE</ctry><ctry>BG</ctry><ctry>CH</ctry><ctry>CY</ctry><ctry>CZ</ctry><ctry>DE</ctry><ctry>DK</ctry><ctry>EE</ctry><ctry>ES</ctry><ctry>FI</ctry><ctry>FR</ctry><ctry>GB</ctry><ctry>GR</ctry><ctry>HR</ctry><ctry>HU</ctry><ctry>IE</ctry><ctry>IS</ctry><ctry>IT</ctry><ctry>LI</ctry><ctry>LT</ctry><ctry>LU</ctry><ctry>LV</ctry><ctry>MC</ctry><ctry>MK</ctry><ctry>MT</ctry><ctry>NL</ctry><ctry>NO</ctry><ctry>PL</ctry><ctry>PT</ctry><ctry>RO</ctry><ctry>RS</ctry><ctry>SE</ctry><ctry>SI</ctry><ctry>SK</ctry><ctry>SM</ctry><ctry>TR</ctry></B840><B844EP><B845EP><ctry>BA</ctry></B845EP><B845EP><ctry>ME</ctry></B845EP></B844EP><B848EP><B849EP><ctry>KH</ctry></B849EP><B849EP><ctry>MA</ctry></B849EP><B849EP><ctry>MD</ctry></B849EP><B849EP><ctry>TN</ctry></B849EP></B848EP><B860><B861><dnum><anum>EP2022061713</anum></dnum><date>20220502</date></B861><B862>de</B862></B860><B870><B871><dnum><pnum>WO2022233788</pnum></dnum><date>20221110</date><bnum>202245</bnum></B871></B870></B800></SDOBI></ep-patent-document>